IC封装的水汽扩散和蒸汽压力建模

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678922

E. Wong, Y. C. Teo, T. Lim

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引用次数: 138

摘要

为了克服菲克扩散方程在多材料系统(如塑料集成电路封装)中的浓度不连续问题，引入了一个新的物理量——湿度分数。这使得可以使用商业热扩散软件来模拟IC封装中的瞬态水分扩散现象。更重要的是，湿度分数提供了一种简单的方法来计算IC封装内分层区域的蒸汽压力，当它在回流焊期间被加热到230/spl℃时。该方法与已发表的作品进行了对比，发现尽管简单，但证实效果非常好。

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Moisture diffusion and vapour pressure modeling of IC packaging

A new physical quantity-wetness fraction-has been introduced to overcome the concentration discontinuity in the application of Fick's diffusion equation to multi-material systems such as in plastic IC packaging. This enables the use of commercial thermal diffusion software to model the transient moisture diffusion phenomenon in IC packaging. More significantly, the wetness fraction provides a simple means of computing the vapour pressure in a delaminated region within an IC package when it is heated up to 230/spl deg/C during reflow solder. The approach was bench marked against published works and found to corroborate remarkbly well despite its simplicity.

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1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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