焊料的本构与损伤模型

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678721

V. Stolkarts, B. Moran, L. Keer

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引用次数: 26

摘要

引入了考虑损伤的蠕变塑性统一模型，并应用该模型模拟了锡银焊料的等温循环行为。所提出的损伤演化规律是基于损伤的非线性累积和外加载荷与蠕变的相互作用。在大范围的加载条件下，建立了应力降幅值和滞回线模型。

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Constitutive and damage model for solders

A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.

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来源期刊

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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