2022 45th International Spring Seminar on Electronics Technology (ISSE)最新文献_第5页

Tin Whisker Susceptibility of SAC0307-ZnO Composite Solder Joints SAC0307-ZnO复合焊点的锡晶须敏感性

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812782

Ha-Jung Choi, B. Illés, A. Skwarek, T. Hurtony

引用次数: 0

Combined Jet Printed and Screen Printed Solder Paste Deposit - Evaluation of Results 喷射印刷和丝网印刷相结合的锡膏沉积-结果评价

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812795

V. Tsenev, V. Videkov

{"title":"Combined Jet Printed and Screen Printed Solder Paste Deposit - Evaluation of Results","authors":"V. Tsenev, V. Videkov","doi":"10.1109/ISSE54558.2022.9812795","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812795","url":null,"abstract":"The article presents the first results obtained from modified SMT (surface mount technology) assemblies with the application of PiP (Pin in Paste). The modification consists of the use of a combined footprint, consisting of two types of solder pastes (standard and low temperature) in one footprint. It can be applied using screen printing and jet printing. The aim is to use the entire amount of applied solder paste in the area of the pads and holes when over printing is used (applying paste on the solder mask) and to improve the conditions for obtaining quality assembly. The experiments were performed using a printer and a two-head jet printer. Deep machine learning has been applied in the preparation of the jet printer for the realization of the combined footprint. Ceramic and FR4 materials as well as real PCBs were used for the substrates. The obtained results are presented using statistics. They confirm the expectations - use of all solder material in the solder, lack of balls of solder material, non-eutectic melting of the solder material and lack of the tombstone effect. The obtained positive results give grounds for future in-depth study and development of the combined footprint, as well as for its industrialization.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125958142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Built-in Thermal Test as a Pre-Integrated Architecture 作为预集成架构的内置热测试

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812759

F. Ender, Kristóf Hegedűs, Richárd Csekő, A. Poppe

引用次数: 0

Alternative interconnection methods for bare die electronic components 裸模电子元件的可选互连方法

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812814

J. Hlina, J. Navrátil, M. Janda, M. Hirman, J. Řeboun

引用次数: 0

Thermomechanical Assessment of Novel Composites Intended for Fused Deposition Modeling 用于熔融沉积建模的新型复合材料的热力学评估

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812709

Denis Froš, P. Veselý

{"title":"Thermomechanical Assessment of Novel Composites Intended for Fused Deposition Modeling","authors":"Denis Froš, P. Veselý","doi":"10.1109/ISSE54558.2022.9812709","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812709","url":null,"abstract":"New types of filaments were formed by adding various fillers into polymers during the fabrication. We designed two new composites in cooperation with a filament producer. Biodegradable thermoplastic polyester polylactic acid (PLA) was filled with carbon black. Carbon black (CB) formed 30 wt.% of in the final mixture. The second composite was made by compounding the polyethylene terephthalate glycol-modified (PET-G) with titanium dioxide. Two different contents of TiO2, namely 10 and 20 wt.%, were selected for filament preparation. The goal of the testing was to evaluate the change of mechanical and thermomechanical properties in contrast to pure filaments. The testing specimens were prepared by Fused Deposition Modeling (FDM), which belongs to 3D printings techniques. The printed samples were subjected to mechanical tensile testing and to microhardness measurement by the Vickers method. Thermomechanical analysis (TMA) and dynamic mechanical analysis (DMA) were performed too. In particular, glass transition temperature, coefficient of thermal expansion (CTE), and storage modulus were analyzed. All composites showed a lower ultimate tensile strength than the neat polymer. Notable changes in thermomechanical behavior were also detected. The most significant difference was the drop in CTE above the glass transition in the case of filled PLA samples.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132808413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity 提高热导率的3D电路载流子的增材制造

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812778

Daniel Utsch, Niklas Piechulek, J. Franke

{"title":"Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity","authors":"Daniel Utsch, Niklas Piechulek, J. Franke","doi":"10.1109/ISSE54558.2022.9812778","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812778","url":null,"abstract":"The ongoing demand for more powerful electronic assemblies requires the development of more flexible systems with substrates showing improved thermal and electrical properties. In this regard, fiber-filled polymers processed by Additive Manufacturing technologies are promising. While previous work rather focuses on the material and mechanical aspects of filled polymers and 3D printing, this work proposes an innovative approach to manufacture electronic assemblies additively using Fused Filament Fabrication with glass fiber-filled polymers to create 3D substrates and using digital printing technologies to create electrically conductive structures on the manufactured specimens. For this reason, a reduction of substrate surface roughness through systematic optimization of parameter configuration is necessary to print constant conductive lines subsequently. By this means, 3D circuit carriers for electronic assemblies with improved thermal conductivity can be produced completely additively. Surface roughness of ${mathrm Ra} = 2.6 mu{mathrm m}$ and ${mathrm Rz} = 42.0 mu{mathrm m}$ was achieved in this work, and the printed lines were qualified in optical, electrical, and mechanical regard.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132323499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Utilization of a Digital Accelerometer Unit for a Switch Array Emulation 数字加速度计单元在开关阵列仿真中的应用

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812712

S. Kardoš

引用次数: 0

Monitoring and Stabilization of the Fully Automatic Robotic Sensor Assembly Line in the Conditions of Digital Twins 数字孪生条件下全自动机器人传感器装配线的监测与稳定

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812839

Valentin Tsenev

{"title":"Monitoring and Stabilization of the Fully Automatic Robotic Sensor Assembly Line in the Conditions of Digital Twins","authors":"Valentin Tsenev","doi":"10.1109/ISSE54558.2022.9812839","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812839","url":null,"abstract":"The article presents the design and expected results from the use of a digital twin monitoring and management system. It is a continuation of the multi-step improvement of the sensor assembly line until its full automation. Statistical control, machine learning, deep machine learning, fuzzy logic and neural networks have been applied to improve and optimize data selection and analysis. A model of digital twins is applied, in which the analysis and feedback for automatic optimal control are outside the work center of a server or cloud. With this powerful management model, many work centers are serviced. Thus, with the development of a single powerful analysis software from the machine manufacturer, many work centers can be managed. This makes the process more automatic and with a lower cost. A specific goal has been set to speed up the work of the automatic production center for assembling sensors and achieve a production cycle of 5 seconds with improved quality results. This is achieved by optimizing automatic visual control using digital twin analysis. Quality improvement has been achieved by improving the inputs of the assembly process using digital twin analysis.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"443 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115927306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution 无铅锡基钎料合金在3.5% wt.% NaCl溶液中的电化学迁移研究

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812805

A. Gharaibeh, D. Rigler, B. Medgyes, G. Harsányi

引用次数: 1

Development and Validation of the Wheel Speed Sensor Interface Based on V-model Method 基于v型方法的车轮转速传感器接口开发与验证

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812803

Nicolae Ioan Gross, P. Svasta

{"title":"Development and Validation of the Wheel Speed Sensor Interface Based on V-model Method","authors":"Nicolae Ioan Gross, P. Svasta","doi":"10.1109/ISSE54558.2022.9812803","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812803","url":null,"abstract":"Hardware development and testing in automotive industry is strongly influenced by safety requirements. Key hardware components, such as the interface of wheel speed sensors (WSS), are subject of functional safety methodology for activities during hardware development. The functional safety of electrical, electronic and software components is addressed by the ISO26262 series of standards, and the proposed methodology follows its recommendations. The WSS are key electrical components of road vehicle brake systems, which is a safety system, rated as ASIL D, therefore the development of hardware interface for these sensors must fully comply with the ISO26262 recommendations [1]. The WSS are physically mounted at each wheel of the car and wired to an Electronic Control Unit (ECU). The data collected from WSS is used for calculating the vehicle velocity and for various function of the braking system, such as ABS (Anti-lock brake system), TCS (Traction control system) and ESC (Electronic stability control) [2], and a plurality of other systems in the car are using the vehicle velocity as an input for performing their various functions. The WSS are working in a harsh environment, exposed to mechanical, environmental, and electrical hazards. Failure of any WSS must be detected and addressed accordingly, in the shortest time and with best possible accuracy.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122751001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1