发布求助
文献互助 智能选刊 最新文献

2022 45th International Spring Seminar on Electronics Technology (ISSE)最新文献

筛选
英文 中文
Study and Integrated Strategies for Development and Minimizing Energy Losses in Batteries 研究和综合战略的发展和尽量减少电池的能量损失
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812776
E. Ceuca
{"title":"Study and Integrated Strategies for Development and Minimizing Energy Losses in Batteries","authors":"E. Ceuca","doi":"10.1109/ISSE54558.2022.9812776","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812776","url":null,"abstract":"This paper presents a study on the mathematical equations of discharge and optimal operation of batteries used in modern travel systems. Use in real operating conditions is very difficult due to the multiple parameters that affect their performances. The paper aims to operate a methodology for evaluating and estimating the most important parameters that affect their performance.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"139 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123809179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints 用分散分析研究导电胶接头的气候老化
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812817
P. Mach, Ferdinand Závora
{"title":"Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints","authors":"P. Mach, Ferdinand Závora","doi":"10.1109/ISSE54558.2022.9812817","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812817","url":null,"abstract":"In accelerated climatic aging tests, a multifactor loading of the tested components is often used. An example of such climatic stress can be aging at elevated temperatures and humidity. As a result, information about the change of the monitored component parameter is obtained. Usually, the influence of individual factors is not analyzed. In this work, the resistance of joints formed by two types of conductive adhesives with isotropic electrical conductivity on pads with copper and gold surface finish is monitored. The joints are climatically loaded by heat shocks and exposured to elevated temperature and humidity. The method of factor experiments and Taguchi's orthogonal arrays are used to determine which of these climatic factors has a more significant effect on the change in joint resistance. It was found that the dominant aging factor differs for different adhesives and that the results obtained by both methods are close in cases where the effect of factor interactions on the joint resistance is small.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128303585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis and Sintering Optimization of Nanoparticle Paste with High Silver Content 高银纳米颗粒浆料的分析与烧结优化
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812812
D. Michal, M. Janda, J. Řeboun
{"title":"Analysis and Sintering Optimization of Nanoparticle Paste with High Silver Content","authors":"D. Michal, M. Janda, J. Řeboun","doi":"10.1109/ISSE54558.2022.9812812","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812812","url":null,"abstract":"This paper deals with analysis, testing, and process optimization of new nanoparticle silvering paste with high silver content. Specifically, on ceramic substrates with printed conductive patterns created by thick film technology. Sintering is currently one of the most anticipated ways of connecting dies on substrates in power electronics field. Using ceramic substrates in combination with printed patterns brings out new challenges because of porous structure and ceramic specific attributes, especially when using presureless sintering as in this case. Presented paper is focused on analysis and comparison of structure and behaviour of the new nanoparticle paste with commercially available silver sintering pastes. Following step was initial testing with different deposition techniques and development of optimal sintering profile. After sintering examinations were also carried out. Shear test showing mechanical resilience, x-ray scanning for analysis of internal structure and stereoscopic analysis of sintered paste. Prolonging the temperature peak from 45 to 60 minutes and rising its temperature to 280°C shows better results in created joint. Higher shear strength was achieved together with more homogenous sintered structure. Lower porosity and presence of nanoparticles shows great potential for more homogenous, stable, and more resistive connection to mechanical separation.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124856355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Handling and Analysis of Large Datasets Using the Example of Partial Discharge Measurement 以局部放电测量为例的大数据集处理与分析
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812784
Johannes Drechsel, Henry Barth, L. Rebenklau
{"title":"Handling and Analysis of Large Datasets Using the Example of Partial Discharge Measurement","authors":"Johannes Drechsel, Henry Barth, L. Rebenklau","doi":"10.1109/ISSE54558.2022.9812784","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812784","url":null,"abstract":"As is the case in an increasing number of technical fields, large amounts of raw data are recorded during partial discharge (PD) measurements. This paper shows both common techniques and PD measurement-specific methods of data analysis. Defined test specimens are specifically designed, manufactured, and measured in order to provide raw data. Different organisation, calculation, and visualization options are evaluated regarding their applicability for finding correlations between measurement data and substrate parameters. Dependencies between partial discharge parameters and the specific test substrates’ properties are made visible.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116613725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Spectroscopic ellipsometry study of parylene AF4 聚对二甲苯AF4的椭偏光谱研究
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812819
D. Solonenko, Madeleine Petschnigg, T. D. Dao, G. Miskovic
{"title":"Spectroscopic ellipsometry study of parylene AF4","authors":"D. Solonenko, Madeleine Petschnigg, T. D. Dao, G. Miskovic","doi":"10.1109/ISSE54558.2022.9812819","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812819","url":null,"abstract":"The spectroscopic ellipsometry study of parylene AF4 films was performed in a broad optical range from mid-infrared (MIR) to deep ultra-violet (DUV) light. The wavelength-dependent refractive index and extinction coefficients were determined using the spectral fitting of the modeled and experimental data. The established optical model, based on the classical oscillator theory, comprised of four Gaussian and one Tauc-Lorentz peak functions for the UV and Brendel-Bormann oscillations – in MIR regions enables fast and precise thickness determination of parylene coatings as well as the electronic properties of the molecules by monitoring the alteration of the dielectric function. The thermal treatment of the films in ambient atmosphere up to 450°C showed the overall stability of the parylene film with only negligible alteration of the optical transition energies and thus its refractive index.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131671814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Remote Tracking System for ECG Signal with Textile Electrodes 纺织电极心电信号远程跟踪系统
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812840
E. Nikolova, V. Dimitrov, T. Hranov, E. Gieva
{"title":"Remote Tracking System for ECG Signal with Textile Electrodes","authors":"E. Nikolova, V. Dimitrov, T. Hranov, E. Gieva","doi":"10.1109/ISSE54558.2022.9812840","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812840","url":null,"abstract":"This article describes and analyzes a system for remote monitoring of cCG signal, performed using textile electrodes, which are the main component in the implementation of an innovative wearable textile system. The proposed device allows for long-term online monitoring, while maintaining the daily activities of patients in need of examination, as well as, if necessary, tracking patients during transportation or remote access.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126940245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Influence of PCB Surface Finishes on Intermetallic Compound Growth PCB表面处理对金属间化合物生长的影响
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812788
Pavel Rous, Antonios-Dionysios Pavlozas, F. Steiner
{"title":"Influence of PCB Surface Finishes on Intermetallic Compound Growth","authors":"Pavel Rous, Antonios-Dionysios Pavlozas, F. Steiner","doi":"10.1109/ISSE54558.2022.9812788","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812788","url":null,"abstract":"This article presents research focused on the intermetallic compound growing under different conditions. The quality of solder joints depends on many factors, one of which is the thickness of the intermetallic layer and its composition. Combination of multiple reflow processes which is common during the production process and thermal aging you can simulate long-term use of the product, which makes it possible to determine the condition of solder joints in the future. The growth of intermetallic layers using thermal aging is known, but the demand for lead-free solder causes new alloys with unknown properties. Each element in the solder alloy has a different impact on the resulting solder properties. The formation of intermetallic layers also depends on the surface finishes of the pads, so the object of the experiment is to compare the effect of known and used SAC305 solder with solder doped by Ge or Co at the various finishes of pads.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"104 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113969435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信