Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints

Abstract

In accelerated climatic aging tests, a multifactor loading of the tested components is often used. An example of such climatic stress can be aging at elevated temperatures and humidity. As a result, information about the change of the monitored component parameter is obtained. Usually, the influence of individual factors is not analyzed. In this work, the resistance of joints formed by two types of conductive adhesives with isotropic electrical conductivity on pads with copper and gold surface finish is monitored. The joints are climatically loaded by heat shocks and exposured to elevated temperature and humidity. The method of factor experiments and Taguchi's orthogonal arrays are used to determine which of these climatic factors has a more significant effect on the change in joint resistance. It was found that the dominant aging factor differs for different adhesives and that the results obtained by both methods are close in cases where the effect of factor interactions on the joint resistance is small.