2022 45th International Spring Seminar on Electronics Technology (ISSE)最新文献

3D Printed Resistive Flexible Sensor for Motion Detection 用于运动检测的3D打印电阻柔性传感器

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812771

M. Kisić, K. Babković, Miroslav Katanić, M. Damnjanović

引用次数: 0

Measuring of Gas Flow Speed in Reflow Furnace 回流炉气体流速的测量

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812804

M. Hurban, I. Szendiuch

{"title":"Measuring of Gas Flow Speed in Reflow Furnace","authors":"M. Hurban, I. Szendiuch","doi":"10.1109/ISSE54558.2022.9812804","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812804","url":null,"abstract":"Soldering in surface mount technology (SMT) is a constantly researched area in electronic production, as it affects both the quality of soldered joints and ecology. Continuous reflow furnaces with conventional hot gas heating (air or nitrogen) are most often used. One of the factors that affects the quality and reliability of soldered joints is the flow distribution in the process part of the soldering reflow furnace. This flow distribution highly depends on the design of the nozzles. The aim of this work is to achieve a reproducible measurement of hot gas flow rate under real operation conditions. This however requires measuring the temperature inside the furnace up to $300 ^{circ}text{C}$. Due to the European RoHS directive introducing soldering with lead-free alloys with a higher melting point, the energy intensity of the soldering process has also been increased. An integral part of this work is therefore to create the prerequisites for optimizing the gas flow in the soldering equipment and thus achieve not only a reduction in the thermal load of the product but also a reduction in the energy consumption for the entire soldering process. For this purpose, a measuring method using a new type of sensor FS7.4W is proposed, which allows measuring the temperature and flow speed in different types of furnaces and in turn to find the optimal nozzle layout.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121238270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thick Layers’ Adhesion Measurements on Flexible Substrate by Cross Cut Adhesion Test 柔性基材上厚层附着力的横切测试

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812806

Peter Provazek, A. Pietrikova, Peter Lukacs

{"title":"Thick Layers’ Adhesion Measurements on Flexible Substrate by Cross Cut Adhesion Test","authors":"Peter Provazek, A. Pietrikova, Peter Lukacs","doi":"10.1109/ISSE54558.2022.9812806","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812806","url":null,"abstract":"Flexible electronics is currently widely used to create new bendable and stretchable structures. Since these structures are mechanically stressed, it is necessary to know the adhesion between the layers, which shows their durability. In this paper, we propose and test a new cheap adhesion method which could substitute expensive methods. The adhesion was analyzed by cross cut adhesion test, which is typically used for measuring the adhesion of paints. The tested samples were fabricated by screen printing technology. Three types of flexible foils, polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN) were used as a substrate. Three different types of polymer pastes were deposited on the substrates. Two pastes were based on silver particles and one on carbon particles. The test was performed by a special tool TQC CC 3000 specified by the ISO and ASTM standards. The samples were evaluated by the software “CCT Analyzer’' developed at the Department of Technologies in Electronics. The results show that the cross cut test is a cheap, fast, accurate method for measuring the adhesion of thick polymer layers and a suitable substitute for the expensive tests.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125849094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Accelerated Fatigue Testing and Lifetime Modelling of Solder Interconnects in Power Electronics 电力电子焊接互连的加速疲劳试验和寿命建模

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812797

M. Lederer, A. Kotas, G. Khatibi

引用次数: 0

Image Processing Methods for Detecting Voids in the Solder Joints of Surface-Mounted Components 检测表面贴装元件焊点空隙的图像处理方法

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812775

O. Krammer, Á. Varga, A. Géczy, K. Csorba

{"title":"Image Processing Methods for Detecting Voids in the Solder Joints of Surface-Mounted Components","authors":"O. Krammer, Á. Varga, A. Géczy, K. Csorba","doi":"10.1109/ISSE54558.2022.9812775","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812775","url":null,"abstract":"Void formation in the lead-free solder joints of electrical components can significantly affect their mechanical properties and thermal performance. Void-detection methods have been investigated in this paper, which are able to identify and measure voids in meniscus-shaped solder joints of surface mounted components automatically. In the experiment, 0603 size resistors (1.5 × 0.75 mm) were soldered onto a testboard, and X-ray images were acquired about the samples then. The image processing methods for the void detection were implemented in OpenCV-Python. At first, the properties of the images were analyzed (for example, calculating the histogram), and then the area, including the resistor and solder pads, was extracted by masking. Several methods were investigated for identifying voids in the images; Canny edge detection, global-and adaptive thresholding, and blob detection algorithm. The accuracy of the extraction methods was evaluated by identifying voids on a test image manually and comparing the results to that provided by the different methods. Canny edge detection was the best in our case, but global thresholding and blob detection are also promising solutions.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129172013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading 铋基钎料合金:添加磷和镓对润湿性和铺展的影响

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812828

Markéta Klimtová, I. Králová, P. Veselý

{"title":"Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading","authors":"Markéta Klimtová, I. Králová, P. Veselý","doi":"10.1109/ISSE54558.2022.9812828","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812828","url":null,"abstract":"Due to the restrictions on lead solder alloy, there is an ongoing search for alternative lead-free alloys with the best possible solder properties similar to Pb-based solder alloys. Therefore, phosphorus and gallium are, for example, added to solder alloys, which could lead to an improvement in their solder properties (wettability, mechanical, lower melting point). These additives are usually used for the improvement of SAC alloys. This work focused on lead-free low-temperature solders based on tin and bismuth. The effect of added 1 wt.% gallium and traces of phosphorus on wettability and spreading was studied. These properties were observed on FR4 boards with three different surface materials: copper, copper with hot air solder leveling surface finish (HASL) and copper with electroless nickel-immersion gold surface finish (ENIG). Examined alloys were Bi58Sn42, Bi58Sn42P, Bi59Sn40Ga1 and Bi59Sn40Ga1P. The results showed that although the addition of Ga and P exhibited no significant improvement or even decrease in the wetting and spreading ability of the solder alloy on copper and ENIG surfaces, the wetting behavior of the doped alloys was better on HASL surface compared to the eutectic solder alloy.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"143 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121638950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles 智能纺织品中印刷和刺绣导电路径的连接方法

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812714

M. Janda, Kateřina Rostás, S. Pretl, J. Řeboun

引用次数: 0

Methods for the Capacity Increasing of Textile Capacitors 纺织电容器增容量的方法

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812802

T. Blecha, Daniela Moravcova

引用次数: 1

Embroidered Flexible Elastic Textile Antenna as Strain Sensor 用作应变传感器的绣花柔性弹性织物天线

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812713

Michaela Radouchová, Stanislav Suchý, T. Blecha

引用次数: 1

Multisensor precision positioning based on inertial and GNSS systems via 5G network 基于5G网络的惯性和GNSS系统的多传感器精确定位

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812792

R. Miletiev, E. Iontchev, R. Yordanov

引用次数: 0