2022 45th International Spring Seminar on Electronics Technology (ISSE)最新文献_第2页

Behaviour of Moisture Sensitive Devices 湿气敏感装置的性能

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812783

Zbyněk Plachý, K. Dušek

{"title":"Behaviour of Moisture Sensitive Devices","authors":"Zbyněk Plachý, K. Dušek","doi":"10.1109/ISSE54558.2022.9812783","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812783","url":null,"abstract":"Humidity is an essential and integral part of human life, of which electrical equipment and devices are already an integral part. The moisture problem is mainly associated with components in non-hermetic plastic packages. Understanding the behavior of these components is a basic prerequisite for proper handling during the manufacturing process. By proper handling of the components, various moisture-related defects can be avoided. For these reasons, moisture sensitive devices (MSD) are divided into different moisture sensitivity levels (MSL), which indicate their floor life. The main danger associated with moisture does not lie in its absorption itself, but in the mechanical stress caused by the rapid expansion of the evaporated water in a relatively short time during the reflow soldering process. Defects associated with delamination and cracks of the component packages are one of the most common defects in surface mounting technology. If the absorbed moisture does not cause mechanical defects during production within the Surface Mount Technology (SMT), it can further accelerate the degradation phenomena of the device. The results of this work clearly show that components exposed to environments with higher relative humidity (RH) absorb more moisture than the same components at lower RH. By reducing RH, the risk associated with defects caused by mishandling MSDs can also be reduced.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121911636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips 铜柱芯片的薄片成型和再分布沉积工艺发展

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812790

Ran Yin, Clara Pechnig, K. Nieweglowski, K. Meier, K. Bock

引用次数: 2

Electrochemical Migration Issues Related to Improper Solder Mask Application 与不当阻焊应用有关的电化学迁移问题

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812811

P. Veselý, Markéta Klimtová, Denis Froš

{"title":"Electrochemical Migration Issues Related to Improper Solder Mask Application","authors":"P. Veselý, Markéta Klimtová, Denis Froš","doi":"10.1109/ISSE54558.2022.9812811","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812811","url":null,"abstract":"This work aimed to analyze a reliability issue that occurred on printed circuit boards (PCB) primarily designed to study electrochemical migration (ECM) phenomena. The test boards were supplied directly from the PCB producer, and the copper traces were covered with a hot air solder leveling (HASL) surface finish. However, the solder layer was clearly inconsistent and poor, caused by contamination from improper solder mask application, as was confirmed by analysis using the scanning electron microscope. On these boards, a water drop test with distilled water (bias voltage of 10 V) and thermal humidity bias test (85 °C/90% R.H./25 V/168 h) was conducted to evaluate predisposition for electrochemical migration of boards with a such poorly fabricated solder mask. PCB without solder mask and with correctly applied solder mask was also included in this study for comparison. The results clearly showed that the test boards with the poorly fabricated solder mask were significantly more inclinable to electrochemical migration – in the case of the water drop test, the forming dendritic structures shorted the electrodes up to 6 times faster than on PCB without a solder mask, while the samples with correct solder mask exhibited the best resistance against ECM. During the thermal humidity bias test, the electrical short appeared after only 2 hours on PCB with the bad solder mask compared to PCB without the mask, where the dendrites grew after more than 27 hours. Energy dispersive spectroscopy confirmed that the migrating element was tin from the HASL cover layer.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132268626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Preparation and Application of Carbon Nanotubes Ink for Aerosol Jet Printing System 气溶胶喷射打印系统用碳纳米管油墨的制备及应用

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812844

J. Navrátil, Karel Šíma, Tomas Rericha, A. Hamácek

引用次数: 0

Ultrasonic Welded Textile Thermocouples 超声波焊接纺织热电偶

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812781

Jan Kalčík, R. Soukup

引用次数: 0

Wetting of New SnAg Surface Finish 新SnAg表面处理的润湿

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812833

A. Pietrikova, Daniel Dzivý, Olga Vrublenskaya, M. Shikun

引用次数: 2

Investigation of Plasma Etching Rates of a Methacrylate Resin 甲基丙烯酸酯树脂等离子体刻蚀速率的研究

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812707

Alexandra Borók, Dávid Gál, Rebeka Kovács, Á. Szokol, A. Bonyár

引用次数: 0

Simulation-Based Investigation of the Integration Capabilities of 3D-Printed Ceramic Heat Exchange Structures for Thermoelectric Modules 基于仿真的热电模块3d打印陶瓷换热结构集成能力研究

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812761

S. Schuh, Lukas Zechner, M. Schwentenwein

{"title":"Simulation-Based Investigation of the Integration Capabilities of 3D-Printed Ceramic Heat Exchange Structures for Thermoelectric Modules","authors":"S. Schuh, Lukas Zechner, M. Schwentenwein","doi":"10.1109/ISSE54558.2022.9812761","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812761","url":null,"abstract":"To ensure efficient heat dissipation of a thermoelectric module in cooling or heating mode, the use of heat exchangers is essential. The associated thermal resistance between the module and the fluid operated heat exchanger leads to a reduction in the achievable overall efficiency of the module. By integrating the heat exchanger structure directly into the ceramic plates of the thermoelectric module, the number of heat transfer interfaces can be reduced, thus increasing the overall efficiency of the system. The aim of the presented study was to evaluate different integration options of a heat exchanger structures directly into the ceramic plate based on simulations. The results provide information on the influence of the layout, the shape and the area of the channel cross-section on the achievable overall heat transfer coefficient, the surface temperature distribution and the pressure drop of the heat transfer fluid. The comparison between integrated and externally attached heat exchanger showed a significant increase in performance when the heat exchanger was integrated.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121862469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electrochemical Impedance Spectroscopy Processing and Modelling for Lithium-ion Batteries Using Python and Jupiter 使用Python和Jupiter进行锂离子电池的电化学阻抗谱处理和建模

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812762

Martin Molhanec, V. Knap

引用次数: 0

The Effect of Subtractive Manufacturing Technologies on the UWB Antenna’s Scattering Parameter 减法制造技术对超宽带天线散射参数的影响

2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812756

Peter Lukacs, I. Vehec, T. Lenger

{"title":"The Effect of Subtractive Manufacturing Technologies on the UWB Antenna’s Scattering Parameter","authors":"Peter Lukacs, I. Vehec, T. Lenger","doi":"10.1109/ISSE54558.2022.9812756","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812756","url":null,"abstract":"The paper investigates the effect of commonly used subtractive manufacturing technologies on the scattering parameter of an Ultra-WideBand (UWB) antenna that was designed, realized, and measured. As a result, the conventional copper layer etching method using two chemical solutions based on ferric chloride and hydrochloric acid, as well as the Computer Numerical Control (CNC) machining, are critically analyzed. As proven by the obtained results, the etchant, its temperature, and the etching time has a direct effect on the quality of the realized UWB antenna’s edges. Along with the scattering parameter of the antenna, the cross sections’ analysis of the quality of the edges is presented. The Printed Circuit Board (PCB) with the copper layer was used in three thicknesses (17.5, 35, and 70 $mu$m) for the experiments described in the paper. The polyimide film with a thickness of 50 $mu$m was used as the substrate material. Due to the thin polymeric film and the narrow width of the feeding element (330 $mu$m), CNC machining is at the limit of its possibilities. Additionally, the paper analyzes the effect of the etching solution’s temperature on the edge quality in the high frequency area.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122501493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1