{"title":"Simulation-Based Investigation of the Integration Capabilities of 3D-Printed Ceramic Heat Exchange Structures for Thermoelectric Modules","authors":"S. Schuh, Lukas Zechner, M. Schwentenwein","doi":"10.1109/ISSE54558.2022.9812761","DOIUrl":null,"url":null,"abstract":"To ensure efficient heat dissipation of a thermoelectric module in cooling or heating mode, the use of heat exchangers is essential. The associated thermal resistance between the module and the fluid operated heat exchanger leads to a reduction in the achievable overall efficiency of the module. By integrating the heat exchanger structure directly into the ceramic plates of the thermoelectric module, the number of heat transfer interfaces can be reduced, thus increasing the overall efficiency of the system. The aim of the presented study was to evaluate different integration options of a heat exchanger structures directly into the ceramic plate based on simulations. The results provide information on the influence of the layout, the shape and the area of the channel cross-section on the achievable overall heat transfer coefficient, the surface temperature distribution and the pressure drop of the heat transfer fluid. The comparison between integrated and externally attached heat exchanger showed a significant increase in performance when the heat exchanger was integrated.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE54558.2022.9812761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
To ensure efficient heat dissipation of a thermoelectric module in cooling or heating mode, the use of heat exchangers is essential. The associated thermal resistance between the module and the fluid operated heat exchanger leads to a reduction in the achievable overall efficiency of the module. By integrating the heat exchanger structure directly into the ceramic plates of the thermoelectric module, the number of heat transfer interfaces can be reduced, thus increasing the overall efficiency of the system. The aim of the presented study was to evaluate different integration options of a heat exchanger structures directly into the ceramic plate based on simulations. The results provide information on the influence of the layout, the shape and the area of the channel cross-section on the achievable overall heat transfer coefficient, the surface temperature distribution and the pressure drop of the heat transfer fluid. The comparison between integrated and externally attached heat exchanger showed a significant increase in performance when the heat exchanger was integrated.