{"title":"智能纺织品中印刷和刺绣导电路径的连接方法","authors":"M. Janda, Kateřina Rostás, S. Pretl, J. Řeboun","doi":"10.1109/ISSE54558.2022.9812714","DOIUrl":null,"url":null,"abstract":"This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles\",\"authors\":\"M. Janda, Kateřina Rostás, S. Pretl, J. Řeboun\",\"doi\":\"10.1109/ISSE54558.2022.9812714\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.\",\"PeriodicalId\":413385,\"journal\":{\"name\":\"2022 45th International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 45th International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE54558.2022.9812714\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE54558.2022.9812714","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles
This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.