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2022 45th International Spring Seminar on Electronics Technology (ISSE)最新文献

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Visible Light based Positioning by Continuous Frequency-Modulated LEDs in Combination with Fingerprinting 连续调频led结合指纹识别的可见光定位
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812836
Saman Zahiri-Rad, A. Weiss, Andreas Kröpfl, E. Leitgeb
{"title":"Visible Light based Positioning by Continuous Frequency-Modulated LEDs in Combination with Fingerprinting","authors":"Saman Zahiri-Rad, A. Weiss, Andreas Kröpfl, E. Leitgeb","doi":"10.1109/ISSE54558.2022.9812836","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812836","url":null,"abstract":"This work proposes an indoor positioning solution to achieve positioning in a low complex way. Our solution approach is based on frequency-modulated light sources without the need for complex modulation and encoding schemes. By utilizing a least-square approximation, the composition of the frequency spectrum of the impinging light on a receiver unit is calculated. Based on the generation of the ratio between the different modulation frequencies, a positioning algorithm is implemented that fulfills the task of positioning without the need for complex calculations. Utilizing a simulation environment, which is based on MATLAB, Simulink, and Simscape, we can precisely simulate the proposed scenario in order to generate the offline map for performing fingerprinting. By experimental results, we verify our proposed low complex solution, showing that our system can be realized with off-the-shelf components and without the necessity of specialized hardware for controlling the light sources or in the receiver design.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124022855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Overview of Various Failures of Luminaires Assembled with SMD LED Chips SMD LED芯片组装灯具的各种故障概述
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812779
D. Bušek, K. Dušek
{"title":"Overview of Various Failures of Luminaires Assembled with SMD LED Chips","authors":"D. Bušek, K. Dušek","doi":"10.1109/ISSE54558.2022.9812779","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812779","url":null,"abstract":"This work describes common mistakes that are present in luminaires with light emitting diodes (LED) and suggests possible solutions or rather procedures and points that cannot be omitted during both luminaires manufacture and usage. LED packaging is designed to provide mechanical support, electrical connection, thermal management, spectral transformation, and optical control to the LED dies [1]. The LED chip package therefore brings a large variety of reliability issues that are described in the following work. The quality of wirebonds on an LED with soft chip encapsulant was negatively affected during placement. This is minimized when the setting of the machine is optimal, but further handling must also use softer approach when compared to LED chips with hard shell. Mismatch in coefficient of thermal expansion (CTE) also played a significant role in reliability due to fractures in solder joints as our measurement showed and the improper thermal design caused deterioration in the optics that further led to overheating. Several studies were conducted on the reliability calculations, taking into account theoretical or manufacturer declared properties of various LED chips or high power LED chip arrays [2], [3] or whole lighting system including the driver electronics (calculating with initial power consumption, efficiency of the optical system etc., trying to estimate remaining useful life of the entire system [4], [5]. However, real life situations bring into play other, usually unexpected factors such as improper handling.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129103336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data 基于任务剖面数据的多层感知器的离散电力电子元件损伤预测与剩余使用寿命评估
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812777
Darshankumar Bhat, S. Muench, M. Roellig
{"title":"Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data","authors":"Darshankumar Bhat, S. Muench, M. Roellig","doi":"10.1109/ISSE54558.2022.9812777","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812777","url":null,"abstract":"In this contribution, an automated routine is presented to assess the reliability of a discrete power electronic component used In electric bikes based on a data driven approach. Real temperature profiles are acquired from the field under different loading conditions of electric bikes and its features are extracted using a custom algorithm. A Multilayer Perceptron trained with synthetic but realistic temperature loads is used to predict creep strains induced in the solder joints of a chip resistor. In addition, the remaining useful lifetime has been evaluated at various stages of the mission profile. This methodology provided a solution for real-time capable remaining useful lifetime estimation method.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116255525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Microcontroller-based Compensation of High-power LED Controller in Active Infrared Thermography 主动红外热成像中大功率LED控制器的微控制器补偿
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812831
D. Badarov, B. Bonev, A. Stoynova
{"title":"A Microcontroller-based Compensation of High-power LED Controller in Active Infrared Thermography","authors":"D. Badarov, B. Bonev, A. Stoynova","doi":"10.1109/ISSE54558.2022.9812831","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812831","url":null,"abstract":"The main goal of the study is to apply frequency compensation on a voltage-controlled current source LED driver and to correct the control voltage to achieve faster impulse response and more linear control of the power LED. The output current is precisely measured using accurate resistive shunt and RMS-to-DC converter. Using the converter eliminates the measurement error even in the scenario of high output current ripple. The compensation delivers higher bandwidth and more linear phase response. This increases possibilities for using of power LED as an excitation source for active thermography in case of higher modulation frequency and non-sinusoidal waveform of modulating signal.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124851044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of Reliability Test Assemblies for WLCSP Solder Interconnects using Finite Element Modeling 基于有限元建模的WLCSP焊料互连可靠性测试组件设计
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812715
Viktor Dudash, K. Meier, K. Machani, F. Kuechenmeister, M. Wieland, K. Bock
{"title":"Design of Reliability Test Assemblies for WLCSP Solder Interconnects using Finite Element Modeling","authors":"Viktor Dudash, K. Meier, K. Machani, F. Kuechenmeister, M. Wieland, K. Bock","doi":"10.1109/ISSE54558.2022.9812715","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812715","url":null,"abstract":"In this study, a finite element model was designed to access inelastic strains accumulating in solder joints of a wafer level chip scale package (WLCSP) during the reflow process. The finite element model was evaluated to analyze different bump array layouts and board pad configurations such as solder mask defined (SMD) and non-solder mask defined (NSMD) to determine the most suitable configuration for thermal cycling reliability test. Maximum equivalent plastic strain and maximum principal stress were used to identify the critical bump location in the model and critical region within the bump. A package consisting of a 7x7 mm2 die with a thickness of 300 μm directly attached to a 10x10 mm2 printed circuit board (PCB) has been used for simulation. Size of a fully populated bump array was 18x18 bumps with 350 μm pitch. Solder joint diameter was varied from 240 μm to 270 μm depending on board pad configuration. As a result, two bump layouts i.e. 3x3 and 5x5 corner bump populations were found to cause reasonable load levels. Hence, these two bump layouts are planned for setting up the reliability test in order to obtain the solder lifetime coefficients.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115057431","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel PLA/Flax Based Biodegradable Printed Circuit Boards 新型聚乳酸/亚麻基可生物降解印刷电路板
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812827
A. Géczy, András Csiszár, Egon Rozs, I. Hajdu, B. Medgyes, O. Krammer, Dániel Straubinger, L. Gál
{"title":"Novel PLA/Flax Based Biodegradable Printed Circuit Boards","authors":"A. Géczy, András Csiszár, Egon Rozs, I. Hajdu, B. Medgyes, O. Krammer, Dániel Straubinger, L. Gál","doi":"10.1109/ISSE54558.2022.9812827","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812827","url":null,"abstract":"In this paper we present a novel polylactic acid (PLA)-based printed circuit board (PCB) substrate with flax reinforcement to form a biodegradable alternative to classical PCB materials. The substrate is laminated with copper to be used as two-sided PCB with flame retardant addition. The substrate is both bio-based and biodegradable, compatible with the current and future mindset of green electronics and classical manufacturing approaches. The laminates are prepared with traditional subtractive technology. For assembly, surface mount technology (SMT) is used. The basic aspects of surface mounting (stencil printing, pick and place), a heat sensitive approach on soldering and the validation of the results with copper peeling and shear-force tests is presented in the paper. It was found that the strength of the joints is comparable with the ones soldered on traditional FR4-based PCBs, and that there are several peculiarities of the substrate, which affects the adhesion of the copper layer.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129244258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Regression Analysis of Static Noise Margin and Transconductance for Underlap Lengths of FinFET 复搭长度对FinFET静态噪声裕度和跨导的回归分析
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812809
R. Rathore, V. Srivastava
{"title":"Regression Analysis of Static Noise Margin and Transconductance for Underlap Lengths of FinFET","authors":"R. Rathore, V. Srivastava","doi":"10.1109/ISSE54558.2022.9812809","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812809","url":null,"abstract":"In the sub-nanometer regime, the polysilicon gate has been a better replacement by the metal gates. However, metal gates are prone to variation due to their granular nature. The present research work analyzes the effect of Titanium Nitride (TiN) metal gate for various underlap FinFET devices. Numerical values for Static Noise Margin (SNM) and Transconductance (${g}_{m}$) have been realized for three different underlap lengths (3 nm, 6 nm, and 9 nm) FinFET device. The result shows that underlap length plays a vital role in the sub-nanometer FinFET device. Furthermore, a static noise margin analysis has been performed for the SRAM cell. This work suggests that the large underlap FinFET devices are robust from variations introduced by TiN metal fluctuations.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127335767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Silver Ink Printed Logarithmic Spiral Antenna 银墨印刷对数螺旋天线
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812823
R. Langwieser, Edgar Jirousek, L. Tauber, Christoph Mehofer, Matthias Paul, Markus Wellenzohn
{"title":"Silver Ink Printed Logarithmic Spiral Antenna","authors":"R. Langwieser, Edgar Jirousek, L. Tauber, Christoph Mehofer, Matthias Paul, Markus Wellenzohn","doi":"10.1109/ISSE54558.2022.9812823","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812823","url":null,"abstract":"Innovative manufacturing processes based on printing technology are gaining in importance and already evolve to a key technology for electrical components. In this paper we compare a broadband antenna design in the high frequency regime from 1 GHz to 8 GHz. One antenna was designed and fabricated on a copper coated printed circuit board based on a conventional wet etching process and two antennas of equal design were fabricated with a silver ink-based printing process. Typical antenna parameters such as reflection coefficient, realized antenna gain, and radiation pattern were investigated for the performance comparison of the two different manufacturing techniques. Frequency dependent deviations in impedance matching were found as well as a reduced antenna gain behavior over the entire frequency band of the silver ink printed antennas. The greatest and frequency dependent deviations are at low frequencies from 1 GHz to 2 GHz and at higher frequencies starting at 6 GHz. Between these frequency regimes the observed deviations are comparably constant over frequency.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121708257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low-Cost Strain Gauge Integration in Ceramics for Force Sensor Applications 用于力传感器应用的陶瓷低成本应变片集成
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812829
Muhammad Talal Asghar, C. Kupsch, T. Frank, F. Schwierz
{"title":"Low-Cost Strain Gauge Integration in Ceramics for Force Sensor Applications","authors":"Muhammad Talal Asghar, C. Kupsch, T. Frank, F. Schwierz","doi":"10.1109/ISSE54558.2022.9812829","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812829","url":null,"abstract":"A popular solution for force sensor applications is the integration of strain gauges in microelectromechanical systems. Before such a system can be used, it has to be tested and characterized. Typically, this requires a complete strain gauge integration within an electronic carrier such as ceramics in a pressure sintering process with a typical force of 5000 N acting on a 100 mm x 100 mm specimen, which is costly and mostly not available for laboratory scale investigations due to lack of pressure sintering furnace. To overcome this challenge, we describe a method for the SOI (Silicon-on-insulator) strain gauge integration in ceramics with a force of 3 - 25 N upon a 7 mm × 9 mm specimen. A leverbased pressure application tool for the 0.04 - 0.34 MPa pressure range was successfully employed for this purpose. Targeting a single process configuration of chip-on-ceramic, the reliability of the process results is studied in terms of mechanical stability and electrical connectivity of strain gauge. Finally, the integrated strain gauge is mounted to a 3-point test bench to demonstrate its functionality as a force sensor. The described simple and low-cost fabrication process of the order of € 100 is useful for sensors integration within ceramics, not only for research laboratories but also for industrial manufacturers.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128111417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Automated Measurement System for Characterization and Testing of Elastic Materials 弹性材料特性和测试的自动测量系统
2022 45th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2022-05-11 DOI: 10.1109/ISSE54558.2022.9812822
K. Babković, M. Kisić, M. Damnjanović
{"title":"Automated Measurement System for Characterization and Testing of Elastic Materials","authors":"K. Babković, M. Kisić, M. Damnjanović","doi":"10.1109/ISSE54558.2022.9812822","DOIUrl":"https://doi.org/10.1109/ISSE54558.2022.9812822","url":null,"abstract":"In the case of testing materials or sensors sensitive to displacement or bending, a measurement system able to provide repeatable elastic deformation is needed. This paper presents an automated measurement system for the characterization and testing of sensors and elastic materials used within these sensors. The device under test will be repeatedly stretched or bent during tests. The range of the applied movement is 3 cm for this prototype. The frequency of the movement can be easily changed by changing the velocity or the deformation range. The necessary number of cycles can be programmed. The measurement setup consists of an automated measurement system, a power supply, and a digital oscilloscope.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133764162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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