{"title":"基于任务剖面数据的多层感知器的离散电力电子元件损伤预测与剩余使用寿命评估","authors":"Darshankumar Bhat, S. Muench, M. Roellig","doi":"10.1109/ISSE54558.2022.9812777","DOIUrl":null,"url":null,"abstract":"In this contribution, an automated routine is presented to assess the reliability of a discrete power electronic component used In electric bikes based on a data driven approach. Real temperature profiles are acquired from the field under different loading conditions of electric bikes and its features are extracted using a custom algorithm. A Multilayer Perceptron trained with synthetic but realistic temperature loads is used to predict creep strains induced in the solder joints of a chip resistor. In addition, the remaining useful lifetime has been evaluated at various stages of the mission profile. This methodology provided a solution for real-time capable remaining useful lifetime estimation method.","PeriodicalId":413385,"journal":{"name":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data\",\"authors\":\"Darshankumar Bhat, S. Muench, M. Roellig\",\"doi\":\"10.1109/ISSE54558.2022.9812777\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this contribution, an automated routine is presented to assess the reliability of a discrete power electronic component used In electric bikes based on a data driven approach. Real temperature profiles are acquired from the field under different loading conditions of electric bikes and its features are extracted using a custom algorithm. A Multilayer Perceptron trained with synthetic but realistic temperature loads is used to predict creep strains induced in the solder joints of a chip resistor. In addition, the remaining useful lifetime has been evaluated at various stages of the mission profile. This methodology provided a solution for real-time capable remaining useful lifetime estimation method.\",\"PeriodicalId\":413385,\"journal\":{\"name\":\"2022 45th International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 45th International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE54558.2022.9812777\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 45th International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE54558.2022.9812777","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data
In this contribution, an automated routine is presented to assess the reliability of a discrete power electronic component used In electric bikes based on a data driven approach. Real temperature profiles are acquired from the field under different loading conditions of electric bikes and its features are extracted using a custom algorithm. A Multilayer Perceptron trained with synthetic but realistic temperature loads is used to predict creep strains induced in the solder joints of a chip resistor. In addition, the remaining useful lifetime has been evaluated at various stages of the mission profile. This methodology provided a solution for real-time capable remaining useful lifetime estimation method.