Alternative interconnection methods for bare die electronic components

This paper is focused on alternative interconnection methods for bare die electronic components which can be used instead of wire-bonding. Alternative methods are fully-printed interconnections and copper strip interconnections. These methods were tested and optimized on bare die chip mockups and finally were used for the interconnection of CPV (Concentrated Photovoltaic) bare dies. Detailed description and characterization including contact resistance, cross-section and thermal shock cycling of both methods are summarized in this paper.