无铅锡基钎料合金在3.5% wt.% NaCl溶液中的电化学迁移研究

A. Gharaibeh, D. Rigler, B. Medgyes, G. Harsányi
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引用次数: 1

摘要

研究了3种无铅锡基钎料合金(SAC305、Sn-3.7Ag和Sn-0.7Cu)在3.5 wt.% NaCl溶液中,在10 VDC偏置电压下的电化学迁移(ECM)行为。水滴(WD)测试结果显示,与其他两种焊料合金相比,Sn-0.7Cu具有最低的ECM电阻,其平均故障时间(MTTF)值最低。然而,没有观察到MTTF值之间的显著差异。WD测试后,通过扫描电镜和能谱分析(SEM-EDS)方法研究了枝晶的微观结构和化学组成,Sn-3.7 ag和SAC305的枝晶呈树状结构,Sn-0.7 cu的枝晶呈鱼骨状结构,Sn是形成枝晶的主要成分。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution
Electrochemical migration (ECM) behavior of three lead-free Sn-based solder alloys (SAC305, Sn-3.7Ag, and Sn-0.7Cu) was investigated in 3.5 wt.% NaCl solution at 10 VDC bias voltage to determine the resistance to ECM. The findings of the water drop (WD) test revealed that Sn-0.7Cu had the lowest ECM resistance by showing the lowest Mean-Time-To-Failure (MTTF) value compared to the other two solder alloys. However, significant differences between the MTTF values were not observed. After the WD test, the microstructure and chemical composition of the dendrites were studied by scanning electron microscopy and energy dispersive spectroscopy (SEM-EDS) methods, which showed a tree-like structure for Sn-3.7Ag and SAC305 and fishbone-like structure for Sn-0.7Cu, Sn was the main component of the formed dendrites.
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