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2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)最新文献

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Evaluation of concatenation techniques for state-space interconnect macromodels 状态空间互连宏模型的连接技术评价
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329728
Luis Ernesto Carrera-Retana, R. Rímolo-Donadío, C. Schuster
{"title":"Evaluation of concatenation techniques for state-space interconnect macromodels","authors":"Luis Ernesto Carrera-Retana, R. Rímolo-Donadío, C. Schuster","doi":"10.1109/EPEPS.2017.8329728","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329728","url":null,"abstract":"In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116637566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Impact of read enable (RE) signal duty cycle distortion (DCD) in NAND flash SI simulation 读使能(RE)信号占空比失真(DCD)对NAND闪存SI仿真的影响
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329702
Sayed Mobin, Balaji Raghunathan, Arkady Katz
{"title":"Impact of read enable (RE) signal duty cycle distortion (DCD) in NAND flash SI simulation","authors":"Sayed Mobin, Balaji Raghunathan, Arkady Katz","doi":"10.1109/EPEPS.2017.8329702","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329702","url":null,"abstract":"Impact of Read Enable (RE) signal's Duty Cycle Distortion (DCD) must be integrated in NAND to Flash Management Controller (FMC) SI simulation to predict system level performance accurately in multi-die, high performance systems. Assuming 50% duty cycle signal at the input to NAND driver is too optimistic. Both FMC and NAND contribute a portion of duty cycle distortion in the NAND read cycle. This paper identifies the gap in conventional SI simulation and describes how to reduce this gap in the simulation flow by including realistic RE DCD. Die level signals were measured for correlation purpose, and good correlation was observed between the measurements and simulations, demonstrating the importance of proposed changes.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130829005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Reduced-order modeling of high-speed channels using machine learning techniques: Partitional and hierarchical clusterings 使用机器学习技术的高速通道的降阶建模:分区和分层聚类
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329767
Wendem T. Beyene
{"title":"Reduced-order modeling of high-speed channels using machine learning techniques: Partitional and hierarchical clusterings","authors":"Wendem T. Beyene","doi":"10.1109/EPEPS.2017.8329767","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329767","url":null,"abstract":"Two well-known machine learning techniques, partitional and hierarchical clustering techniques, are applied to simplify the order of complex rational function models of high-speed interconnect channels. In order to retain the physical features of the system, the cluster centers are biased toward the dominant poles using a different kind of distance measure, called inverse distance measure (IDM) during clustering. The proposed procedure is computationally inexpensive and numerically stabile. To illustrate the validity of the methods, examples of frequency-domain simulations of a high-speed channels are provided.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"271 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114477797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Platform PI-PD co-design and validation for power efficient HSIO interfaces 低功耗HSIO接口的平台PI-PD协同设计与验证
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329703
X. Cai, S. G. Pang, J. Huang, Yan Li, S. Ji
{"title":"Platform PI-PD co-design and validation for power efficient HSIO interfaces","authors":"X. Cai, S. G. Pang, J. Huang, Yan Li, S. Ji","doi":"10.1109/EPEPS.2017.8329703","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329703","url":null,"abstract":"An efficient and effective methodology for platform power delivery and power integrity (PD-PI) co-analysis and design optimization has been developed, for investigating high yield loss, to support SoC validation. Both frequency and time domain results have demonstrated good correlation between simulation and lab measurement. Consequently it enabled quick verifying the root cause and optimizing work-around power delivery fixing solutions, and further provided optimal PD configuration scheme to key customers for their platform design.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133274857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A novel stochastic wave model statistically replicating reverberation chambers 一种新的统计复制混响室的随机波模型
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329763
Shen Lin, Z. Peng
{"title":"A novel stochastic wave model statistically replicating reverberation chambers","authors":"Shen Lin, Z. Peng","doi":"10.1109/EPEPS.2017.8329763","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329763","url":null,"abstract":"This paper presents a novel physics-oriented statistical representation for complex multipath environments, and develops a hybrid deterministic and stochastic formulation incorporating component-specific characteristics. The advancements lead to a stochastic wave model statistically replicating mode-stirred reverberation chambers, and establish an imperative design-under-chaos capability for electronic devices and systems. The research work is evaluated and validated through representative experiments.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126623290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
System-level coexistence impact of USB type-C and type-A connectors with WiFi radio USB type-C和type-A连接器与WiFi无线电的系统级共存影响
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329751
Jaejin Lee, Hao-han Hsu, Chung-hao Chen, Xiang Li, X. Cai
{"title":"System-level coexistence impact of USB type-C and type-A connectors with WiFi radio","authors":"Jaejin Lee, Hao-han Hsu, Chung-hao Chen, Xiang Li, X. Cai","doi":"10.1109/EPEPS.2017.8329751","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329751","url":null,"abstract":"In this paper, system-level coexistence impact of USB type-C connector with WiFi radio is assessed in comparison to USB type-A. As data rate increases and small form factor is highly demanded, adoption rate of USB Type-C connector has been substantially increasing. As compared to USB-A connector, USB-C connector has not been extensively investigated for RFI risk and coexistence impact of USB-C and WiFi radio. Therefore, radiated RFI noise and WiFi throughput of USB-C connector is characterized and compared to USB-A connector. The USB-C RFI risk assessment shows that 20dB RFI reduction realizes 180% throughput improvement as compared to one of the USB-A connector. The results demonstrate that RFI-shielded USB type-C connector has much less impact on wireless communication than USB-A, resulting in wireless performance improvement in mobile computer platforms.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114115844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Computation of the X-parameters of multi-tone circuits using multipoint moment expansion 用多点矩展开法计算多音电路的x参数
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329766
Marco T. Kassis, D. Tannir, Raffi Toukhtarian, R. Khazaka
{"title":"Computation of the X-parameters of multi-tone circuits using multipoint moment expansion","authors":"Marco T. Kassis, D. Tannir, Raffi Toukhtarian, R. Khazaka","doi":"10.1109/EPEPS.2017.8329766","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329766","url":null,"abstract":"The efficient generation of X-parameter1 macro-models for nonlinear RF circuit blocks that capture the essential nonlinear behavior of the system has become increasingly useful and even necessary. Recent work on X-parameter computations have provided clear relations between the X-parameters and circuit moments. In this paper, we show how higher order multi-dimensional moments evaluated using multi-point expansions can be used to efficiently compute the X-parameters for two-tone inputs, which are commonly found in general RF circuits.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114147742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A novel tensor-based model compression method via tucker and tensor train decompositions 基于tucker和张量列分解的新型张量模型压缩方法
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329724
Cong Chen, Kim Batselier, N. Wong
{"title":"A novel tensor-based model compression method via tucker and tensor train decompositions","authors":"Cong Chen, Kim Batselier, N. Wong","doi":"10.1109/EPEPS.2017.8329724","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329724","url":null,"abstract":"We develop a novel tensor-based Tucker-Tensor-Train-Model-Compression (T3MC) scheme for speeding up nonlinear circuit simulation. Experiment shows that T3MC achieves high efficiency with significantly higher accuracy than state-of-the-art nonlinear model order reduction (MOR) methods.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116460303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Suppression of radiated electromagnetic emissions using absorbing frequency selective surfaces 利用吸收频率选择表面抑制辐射电磁发射
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329705
A. Khoshniat, R. Abhari
{"title":"Suppression of radiated electromagnetic emissions using absorbing frequency selective surfaces","authors":"A. Khoshniat, R. Abhari","doi":"10.1109/EPEPS.2017.8329705","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329705","url":null,"abstract":"In this paper, a Frequency Selective Surface (FSS) is designed to act as an absorber of electromagnetic emissions at 8GHz. The designed FSS covers the top inside wall of the case box of a digital system and reduces the leaked radiations through the airflow slots. Resistive thin layers are used to create a low profile FSS with a 2-D array of square patches in two layers. An equivalent circuit is presented to provide closed-from relations for designing the FSS layout at the desired frequency. It is shown that the surface input impedance of FSS is matched to the intrinsic impedance of a plane wave in free space. Absorption versus incidence angle of incoming plane waves is evaluated through full-wave simulations showing a maximum value of 32dB. Simulations of radiated emissions from the enclosure box with and without absorbing FSS demonstrate 9dB improvement when the custom-designed FSS is used.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127095476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
LPDDR4X (3732 Mbps) DBI impact on SI/PI and power LPDDR4X (3732 Mbps) DBI对SI/PI和功率的影响
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329707
Sunil R. Gupta
{"title":"LPDDR4X (3732 Mbps) DBI impact on SI/PI and power","authors":"Sunil R. Gupta","doi":"10.1109/EPEPS.2017.8329707","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329707","url":null,"abstract":"Co-SI/PI analysis of a LPDDR4X SoC-PoP DRAM system operating at 0.6V VDDQ and data rate of 3732 Mbps is presented, quantifying the impact of Data Bus Inversion (DBI) coding on signal and power integrity. DBI significantly mitigates Victim/Aggressor and SSN scenarios. Eye-aperture improvements observed can be ∼15% for an 80% Vic/Agg plus SSN pattern with-DBI. Additionally, VDDQ power savings due to DBI is summarized and can be ∼50% for a full-channel running a 100% SSN data pattern.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134090817","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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