状态空间互连宏模型的连接技术评价

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI:10.1109/EPEPS.2017.8329728

Luis Ernesto Carrera-Retana, R. Rímolo-Donadío, C. Schuster

{"title":"状态空间互连宏模型的连接技术评价","authors":"Luis Ernesto Carrera-Retana, R. Rímolo-Donadío, C. Schuster","doi":"10.1109/EPEPS.2017.8329728","DOIUrl":null,"url":null,"abstract":"In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Evaluation of concatenation techniques for state-space interconnect macromodels\",\"authors\":\"Luis Ernesto Carrera-Retana, R. Rímolo-Donadío, C. Schuster\",\"doi\":\"10.1109/EPEPS.2017.8329728\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.\",\"PeriodicalId\":397179,\"journal\":{\"name\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2017.8329728\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329728","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

在这项工作中，我们表明，通过向量拟合算法或Loewner矩阵铅笔方法获得的以状态空间(描述符)形式表示的连接互连模型可以提供与使用采样频域数据的通常连接一样准确的结果。此处以pcb互连为例进行说明。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Evaluation of concatenation techniques for state-space interconnect macromodels

In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

自引率

0.00%

发文量