IEEE Transactions on Parts, Hybrids, and Packaging最新文献_第4页

Assessment of Silicone Encapsulants for Hybrid Integrated Circuits (HIC) 混合集成电路(HIC)用硅封装剂的评价

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-09-01 DOI: 10.1109/TPHP.1977.1135200

A. Christou

引用次数: 3

Lead-Indium for Controlled-Collapse Chip Joining 铅铟控制塌缩芯片连接

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-09-01 DOI: 10.1109/TPHP.1977.1135198

L. Goldmann, R. Herdzik, N. Koopman, V. Marcotte

{"title":"Lead-Indium for Controlled-Collapse Chip Joining","authors":"L. Goldmann, R. Herdzik, N. Koopman, V. Marcotte","doi":"10.1109/TPHP.1977.1135198","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135198","url":null,"abstract":"Lead-indium for flip-chip solder (\"controlled-collapse\") connections has been investigated as a possible alternative to the commonly used 5-95 tin-lead. In thermal cycle tests, lead-indium was substantially mote resistant than tin-lead to fatigue resulting from chipsubstrate mismatch. The lead-indium that has been studied most extensively, 50-50 by weight, gives a 3:1 improvement in lifetime over 595 and is compatible with standard chip and substrate processing. Evaporated above a Cr-Cu-Au pad on the chip surface, the solder is eventually joined to tinned Cr--Cu lands on the ceramic substate. Because of its lower melting point, lead-indium can be joined at a lower temperature than 5-95 tin-lead. In its reactions with copper and gold, which are present in chip and/or substrate metallizations, indium resembles tin. Gold, present only as the protective top film of the chip metallization, dissolves completely during chip joining, whereas copper is present in sufficient quantity to exceed its solubility limit, and thus forms copper-indium intermetallic layers at both interfaces. To ensure terminal strength and reliability, these layers should be stable and adherent both to the solder and to the underlying metnllizations. Lead-indium has been found to be more susceptible than lead-tin to corrosion in high-humidity and hostile environments. This susceptibility must be borne in mind when lead-indium is considered for nonhermetic applications.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122912067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 27

Reduced Gold-Plating on Copper Leads for Thermocompression Bonding--Part II: Long Term Reliability 用于热压键合的铜引线上减少镀金——第二部分:长期可靠性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-09-01 DOI: 10.1109/TPHP.1977.1135202

N. Panousis, P. Hall

{"title":"Reduced Gold-Plating on Copper Leads for Thermocompression Bonding--Part II: Long Term Reliability","authors":"N. Panousis, P. Hall","doi":"10.1109/TPHP.1977.1135202","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135202","url":null,"abstract":"This two-part series is an evaluation of the acceptability for thermocompression (TC) bonding of Cu leads having reduced thicknesses of Au-plating at the bond sites. Part I was concerned with initial characterization which made use of recent grain boundary diffusion work in the Cu-Au system. In this second part, long term reliability is considered where use is made of recent work in volume interdiffusion in the Cu-Au system. Three properties are evaluated: 1) Long term reliability based on accelerated aging of bonded leads; 2) temperature cycling; and 3) cyclic 45° bend fatigue. Results of these evaluations are the following. 1) A lifetime of greater than 40 years at 50° C is predicted for Cu leads with as little as 0.7 µm Au-plating. This conclusion was reached using volume interdiffusion as the rate controlling mechanism for the observed decrease in strengths. The same conclusion was reached from a statistical analysis of the lifetime data without making recourse to a physical model for the degradation. 2) No degradation in bond strength was observed for up through 300 temperature cycles between -40 and +150°C. 3) Cyclic 45° bend fatigue of the bonded leads was not affected by the Au-plating thicknesses studied. In summary, when the results of both parts are combined, the overall conclusion is that oxygen-free Cu leads plated with as little as 0.7 µm Au are judged acceptable for TC bonding.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124232003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

The Application of Magnetically Enhanced Sputtering in a Production Cylindrical Sputtering System 磁增强溅射技术在生产圆柱溅射系统中的应用

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-09-01 DOI: 10.1109/TPHP.1977.1135216

F. Arcidiacono

引用次数: 3

The Effect of Solid-State Reactions Upon Solder Lap Shear Strength 固相反应对焊料搭接剪切强度的影响

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-09-01 DOI: 10.1109/TPHP.1977.1135211

C. Wright

{"title":"The Effect of Solid-State Reactions Upon Solder Lap Shear Strength","authors":"C. Wright","doi":"10.1109/TPHP.1977.1135211","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135211","url":null,"abstract":"The effect of solid-state reactions between gold plating and the eutectic solders 88Au:12Ge, 80Au:20Sn, 90SN:10Au, and 85Pb: 15Au and the off eutectic solder 60SN:36Pb:4Ag upon the solder lap shear strength has been investigated at four aging temperatures ranging from 75 to 150°C. Failure analysis of the lap shear samples has shown that Au-Ge and Au-Sn solders failed cohesively whereas Sn-Au, Pb-Au, and Sn-Pb-Ag solders failed adhesively. Scanning electron micrographs and microprobe analysis of gold-solder metallographic sampies aged at 125°C revealed the presence of AuSn, AuSn 2 , AuSn 4 , and voids at the plating-solder interface of Sn-Au solder. AuSn 2 and AuSn 4 intermetallic compounds were detected at the interface of SnPb-Ag solder, and AuPb 2 was detected at the interface of Pb-Au solder. The zeta phase of the Au-Sn binary system was detected at the plating-solder interface of the Au-Sn solder. The plating-solder interface of the Au-Ge solder was devoid of any intermediate phases or intermetallic compounds. The results of the lap shear measurements have shown that all five solders can be expected to exhibit adequate strength for microelectronic purposes for >105h at a sustained temperature of <100°C when the mating materials have similar coefficients of thermal expansion. However, with dissimilar thermal expansion coefficients, the SnAu and Sn-Pb-Ag solders both failed catastrophically within 103h at 100°C","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132962877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 33

When Heat Losses in a Better Capacitor May Be More than in a Poorer One 当热损失在一个较好的电容器可能比在一个较差的

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135187

M. Lerner

引用次数: 1

Nonhermeticity of Polymeric Lid Sealants 聚合物盖子密封胶的非密封性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135193

R. Traeger

引用次数: 79

The Use of Acoustic Emission in a Test for Beam-Lead, TAB, and Hybrid Chip Capacitor Bond Integrity 声发射在波束引线、TAB和混合芯片电容键合完整性测试中的应用

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135184

G. Harman

{"title":"The Use of Acoustic Emission in a Test for Beam-Lead, TAB, and Hybrid Chip Capacitor Bond Integrity","authors":"G. Harman","doi":"10.1109/TPHP.1977.1135184","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135184","url":null,"abstract":"The use of acoustic emission (AE) in a test for beam-lead bond and anchor integrity has been investigated. AE refers to the emission of broad-band stress waves when materials are broken, cracked, or deformed. A major problem in the present work was to develop means of nondestructively stressing the delicate, irregularly extending beam leads. The most promising of the methods developed are a silicone rubber (SR) pull test, a push down test on SR-encapsulated devices, and various probe methods of applying force to the beams without contacting the chip. AE bursts from weak bonds or beam anchors axe detected with a substrate detector operating at 375 kHz or a probe detector operating at 1.1 MHz or both. The study has revealed considerable difference in the mechanical integrity of beam-lead bond-anchor systems. General deterioration of the beam-anchor system begins at pull forces per beam of approximately 1.0-2.5 gramsforce (gf), depending on the manufacturer's procedure. The forces applied to the beam-anchor system for all methods of stressing, except the pull test, are dependent upon the shape of the individual beams as they extend from the chip, as well as the uniformity of the bugging height. There are many other potential uses of AE in electronics, such as to insure the bonding integrity of flip chips, capacitor chips in hybrids, and bonds on tape automated bonded integrated circuits. The latter two uses were experimentally demonstrated in the present work. Thus it appears that AE will have an increasing role in assuring reliability in the microelectronics field.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121463334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Wiring Algorithms for the Computer-Aided Layout of Multilayer Hybrid Microcircuits 多层混合微电路计算机辅助布局的布线算法

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135190

I. R. Price, P. Moran

引用次数: 0

Gas Infusion in Doubled Hermetic Enclosures 气体输注在双密封外壳

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135183

S. Ruthberg

引用次数: 2