IEEE Transactions on Parts, Hybrids, and Packaging最新文献_第5页

Analysis of Mobility, Volatility, Morphology, Physical States, and Oxidation Stability of Selected Contact Lubricants 所选接触润滑剂的流动性、挥发性、形态、物理状态和氧化稳定性分析

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135185

J. Sinclair

{"title":"Analysis of Mobility, Volatility, Morphology, Physical States, and Oxidation Stability of Selected Contact Lubricants","authors":"J. Sinclair","doi":"10.1109/TPHP.1977.1135185","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135185","url":null,"abstract":"The increasingly strenuous and variable thermal environments in which static gold-plated contacts must operate has generated a need for expanded information on the physical properties of traditional and new lubricant materials. This work investigated the mobilities, volatilities, oxidation stabilities, morphologies, and physical states of microcrystalline waxes, synthesized hydrocarbons, polyphenyl ether, di-2-ethylhexylsebacate, and polyethylene glycol over a wide temperature range. The mobilities of the microcrystalline waxes, high viscosity synthesized hydrocarbons, polyphenyl ether, and polyethylene glycol were all very low. The relative volatilities were: di-2-ethylhexylsebacate > low viscosity synthesized hydrocarbon > polyethylene glycol > polyphenyl ether > microcrystalline wax> high viscosity synthesized hydrocarbon. Oxidation tests indicated that the microcrystalline waxes and synthesized hydrocarbons were mildly sensitive to oxidation. Morphologies of thin films, determined up to 150°C with scanning electron microscope, were variable. The microcrystalline waxes and high viscosity synthesized hydrocarbons existed as generally uniform films with some clustering. The di-2-ethylhexylsebacate produced a very uniform film, and the polyphenyl ether distributed itself in a beaded nonwetting manner.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134565001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Oxygen Embrittlement of Copper Leads 铜引线的氧脆

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135182

N. Panousis, B. Wonsiewicz, L. Condra

{"title":"Oxygen Embrittlement of Copper Leads","authors":"N. Panousis, B. Wonsiewicz, L. Condra","doi":"10.1109/TPHP.1977.1135182","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135182","url":null,"abstract":"Electrolytic tough pitch copper (known as ETP, CDA110, or copper alloy no. 110) is a material used in the manufacture of external leads for hybrid integrated circuits. Cracking during the formation of 90° bends and the relatively poor cyclic fatigue behavior of this material are identified as due to embrittlement caused by second-phase oxide inclusions. Optical and SEM examinations of failures led to the following model for embrittlement. Under the applied loads, voids nucleate at the second-phase inclusions; continued loading causes the voids to grow and coalesce, resulting in a fracture. This model is consistent with the published literature. Cyclic fatigue behavior, i.e., the median number of cycles to failure (MCTF), was found to vary inversely with the oxygen concentration. Over the range 10-650 ppm oxygen (by weight), the fatigue results could be represented by [100/MCTF] = 0.0228 [ppm oxygen] + 8.32. For both CDA110 and oxygen-free copper (CDA102 or copper alloy no. 102) the MCTF was found to vary inversely with the percent of bond deformation over the 10-60-percent range. Therefore, all cyclic fatigue comparisons among the various CDA110 and CDA102 specimens were made at a common bond deformation, chosen to be 35 percent. Oxygen-free copper with ~10 ppm oxygen was found to have about twice the MCTF as CDA110 with ~400 ppm oxygen.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123795208","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Stability of BaTiO 3 Ceramics Doped with Dy for High-Voltage Capacitor Use 掺Dy高压电容器用batio3陶瓷的稳定性研究

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135186

T. Nozawa, J. Kato, T. Murakami, A. Yamaji

引用次数: 2

Resistance Increases in Gold Aluminum Interconnects with Time and Temperature 金铝互连电阻随时间和温度的增加而增加

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135189

D. Bushmire

引用次数: 4

Energy Storage Capacitors of Very High Energy Density 超高能量密度储能电容器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135188

R. Parker

引用次数: 5

Correlation Between Thick-Film Resistance Values 厚膜电阻值的相关性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135192

A. Thorbjornsen, M. Dvorack, A. Riad

引用次数: 1

Kinetics of Thermocompression Bonding to Organic Contaminated Gold Surfaces 有机污染金表面热压键合动力学

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI: 10.1109/TPHP.1977.1135191

J. Jellison

{"title":"Kinetics of Thermocompression Bonding to Organic Contaminated Gold Surfaces","authors":"J. Jellison","doi":"10.1109/TPHP.1977.1135191","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135191","url":null,"abstract":"The kinetics of thermocompression gold ball bonding were studied for gold metallization contaminated with organic films. The contaminants studied were residual photoresist and atmospheric contamination. For gold metallization contaminated with organic films, thermo-compression gold bonding is a two-stage process. The first stage occurs within a fraction of a second and results from the mechanical disruption of barrier films by shear displacements at the faying surface. Bonding during this initial stage is a strong function of the interface temperature, the bonding force, and the contaminant films. The second stage involves growth of the metal-metal interfaces by a sintering phenomenon. Growth of bonds by sintering also occurs in the absence of external loads though at a decreased rate. Analysis of the rate data leads to the conclusion that the growth mechanism follows a parabolic rate law and, in the absence of external loads, exhibits an activation energy of approximately 11 kcal/mole. Under high external loads, the rate of second-stage growth exhibited little temperature dependence, indicative of a stress-assisted process. Bond growth rates for the atmospherically contaminated metallization were an order of magnitude higher than that for the photoresist contaminated samples.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133313619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 38

A Production Parylene Coating Process for Hybrid Microcircuits 一种用于混合微电路的聚对二甲苯涂层生产工艺

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-05-01 DOI: 10.1109/TPHP.1977.1135214

V. Kale, T. Riley

{"title":"A Production Parylene Coating Process for Hybrid Microcircuits","authors":"V. Kale, T. Riley","doi":"10.1109/TPHP.1977.1135214","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135214","url":null,"abstract":"Application of Parylene for protecting microelectronic circuits from loose particles and external environment has been visualized for many years. With a joint effort by NASA and TMD, a process has now been qualified to perform Parylene deposition on hybrid circuits on a production basis, for the Centaur inertial guidance computer. The Parylene coating process developed during this program consists of a) obtaining a hybrid cover with a hole in it, b) sealing of the circuit with a hole in the cover, c) Parylene coating through the hole with the external leads protected from Parylene by appropriate fixturing, and d) sealing of the hole by soldering a pretinned Kovax tab. Development of the above process required optimization of the Parylene coater parameters to obtain a uniform consistent coating which could offer adequate protection to the circuits, fixture design for packages of various types, determination of the size of the deposition hole, the amount of dimer charge per run, a process to hermetically seal the deposition holes and establishment of quality control techniques or acceptance criteria for the deposited film. Several experimental runs were made on test circuits as well as actual production circuits to determine the effect of Parylene coating on active components, thin film resistors, and wire bonds under various conditions. Tests were also made to determine if Parylene indeed protected circuits from loose particles and external environment. After these experiments, Parylene coating acceptance standards were established and a long and rigorous qualification program was completed in order to prove the feasibility of this process. The results of the qualification program will be reported in a future publication. It is concluded that Parylene offers excellent protection against loose particles and a degree of protection from some environmental conditions. It is expected that the fraction of hybrids being coated with Parylene will continue to increase in the microelectronic industry.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127048502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

The Response of Optical Isolators in a Nuclear Radiation Environment 光隔离器在核辐射环境中的响应

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-05-01 DOI: 10.1109/TPHP.1977.1135209

A. E. Mardiguian, K. Soda, R. J. Maier

引用次数: 0

Lubricants for Separable Connectors 可分离连接器用润滑剂

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-03-01 DOI: 10.1109/TPHP.1977.1135172

W. Freitag

{"title":"Lubricants for Separable Connectors","authors":"W. Freitag","doi":"10.1109/TPHP.1977.1135172","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135172","url":null,"abstract":"About two dozen lubricating fluids were tested for use on electrical contacts on card edge or pin-and-socket connectors. The lubricants selected for screening represented a cross section of thewide variety of natural and synthetic materials available on the market. Among them were polyphenyl ethers, natural and synthetic hydrocarbons, several types of esters, polygiycols, some fluorinated materials, a few silicones, and some proprietary formulations. Lubricants were evaluated on the basis of volatility and their ability to prevent fretting corrosion on tin-to-solder contacts. Limited tests were also done on their spreading characteristics, their thermal degradation properties, and their effect on contact resistance. The objective of the work was to develop guidelines in the selection of contact lubricants for field testing. The lubricants were ranked on the basis of weight loss from thin deposits of the samples on solder foil coupons at 65°C. Fretting experiments were done by forcibly moving a printed circuit card finger between a pair of spring contacts cut from actual cards and connectors. The time required for contact resistance to increase from a few milliohms to 2 Omeg was determined as a function of the amount of lubricant present.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"244 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116233859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24