多层混合微电路计算机辅助布局的布线算法

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-06-01 DOI:10.1109/TPHP.1977.1135190

I. R. Price, P. Moran

{"title":"多层混合微电路计算机辅助布局的布线算法","authors":"I. R. Price, P. Moran","doi":"10.1109/TPHP.1977.1135190","DOIUrl":null,"url":null,"abstract":"The interconnection algorithm originally presented by Lee is outlined and some of its features are discussed. The implications of the various technologies to which it may be applied are presented, and it is shown that for multilayer hybrid microcircuits the algorithm can be extended to advantage. Typical results using the extended algorithm are given.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1977-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wiring Algorithms for the Computer-Aided Layout of Multilayer Hybrid Microcircuits\",\"authors\":\"I. R. Price, P. Moran\",\"doi\":\"10.1109/TPHP.1977.1135190\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The interconnection algorithm originally presented by Lee is outlined and some of its features are discussed. The implications of the various technologies to which it may be applied are presented, and it is shown that for multilayer hybrid microcircuits the algorithm can be extended to advantage. Typical results using the extended algorithm are given.\",\"PeriodicalId\":387212,\"journal\":{\"name\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1977-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPHP.1977.1135190\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1977.1135190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

概述了Lee最初提出的互连算法，并讨论了它的一些特征。提出了它可能应用的各种技术的含义，并表明对于多层混合微电路，该算法可以扩展到优势。给出了应用扩展算法的典型结果。

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Wiring Algorithms for the Computer-Aided Layout of Multilayer Hybrid Microcircuits

The interconnection algorithm originally presented by Lee is outlined and some of its features are discussed. The implications of the various technologies to which it may be applied are presented, and it is shown that for multilayer hybrid microcircuits the algorithm can be extended to advantage. Typical results using the extended algorithm are given.

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IEEE Transactions on Parts, Hybrids, and Packaging

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