{"title":"磁增强溅射技术在生产圆柱溅射系统中的应用","authors":"F. Arcidiacono","doi":"10.1109/TPHP.1977.1135216","DOIUrl":null,"url":null,"abstract":"A Penning cylindrical sputtering geometry has been used for the production of tantalum thin films. A simple magnetic field-shaping technique coupled with proper target design has produced films with a uniformity characteristic of a quality deposit. The technique has proven to be a cost effective way of producing a high throughput of product in a system designed for a cylindrical sputtering mode.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"452 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"The Application of Magnetically Enhanced Sputtering in a Production Cylindrical Sputtering System\",\"authors\":\"F. Arcidiacono\",\"doi\":\"10.1109/TPHP.1977.1135216\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Penning cylindrical sputtering geometry has been used for the production of tantalum thin films. A simple magnetic field-shaping technique coupled with proper target design has produced films with a uniformity characteristic of a quality deposit. The technique has proven to be a cost effective way of producing a high throughput of product in a system designed for a cylindrical sputtering mode.\",\"PeriodicalId\":387212,\"journal\":{\"name\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"volume\":\"452 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1977-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPHP.1977.1135216\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1977.1135216","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Application of Magnetically Enhanced Sputtering in a Production Cylindrical Sputtering System
A Penning cylindrical sputtering geometry has been used for the production of tantalum thin films. A simple magnetic field-shaping technique coupled with proper target design has produced films with a uniformity characteristic of a quality deposit. The technique has proven to be a cost effective way of producing a high throughput of product in a system designed for a cylindrical sputtering mode.
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