Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)最新文献_第10页

An inertial measurement unit (IMU) for an autonomous wireless sensor network 自主无线传感器网络惯性测量单元(IMU)

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396675

J. Barton, A. Lynch, S. Bellis, B. O’flynn, K. Mahmood, K. Delaney, S. O'Mathuna

{"title":"An inertial measurement unit (IMU) for an autonomous wireless sensor network","authors":"J. Barton, A. Lynch, S. Bellis, B. O’flynn, K. Mahmood, K. Delaney, S. O'Mathuna","doi":"10.1109/EPTC.2004.1396675","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396675","url":null,"abstract":"This paper will present the work done in designing and fabricating an autonomous inertial measurement unit (IMU) panel for a novel 25mm wireless sensor network platform. This panel increases the sensory capabilities of each node allowing the orientation of each node to be completely realised. As part of the NMRC's technology development there is a drive towards wireless nodes for sensor networks of volume in the sub 5mm region (Barton et al., 2003; Barton et al., 2004). As a stepping stone towards this goal, the target objectives for the development of a 25mm cube module were to develop, a low volume prototyping and experimentation platform. This is for use as a platform for sensing and actuating through various parameters, for use in scalable, reconfigurable distributed autonomous sensing networks in a number of research projects currently underway in the NMRC. This paper outlines the development of the system with particular emphasis on the IMU layer. The total system is packaged in a modular 25mm cubed form factor which gives the capability for the module to be utilised in a wide variety of projects incorporating a multitude of actuators/sensors in miniaturised, mobile, autonomous systems.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127547671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Design and fabrication of micro thermoelectric cooler on LTCC substrate LTCC基板上微型热电冷却器的设计与制造

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396580

W. Fan, C. K. Wong, Y. M. Tan, K. M. Chua, Bill Freeman, H. J. Jiang

引用次数: 7

Realization of LTCC modules for broadband applications 宽带应用LTCC模块的实现

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396610

K. M. Chua, A. Lu, Lin Jin, W. Fan, S. Wong

引用次数: 1

Characterization of organic multi-mode optical waveguides for the electro-optical printed circuit board (EOPCB) 光电印刷电路板(EOPCB)有机多模光波导的特性研究

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1108/03056120610616508

Li-Cheng Shen, W. Lo, Hsiang-Hung Chang, H. Fu, Yuan-Chang Lee, Yu-Chih Chen, Shu-Ming Chang, Wun-Yan Chen, M. Chou

引用次数: 4

Gold ball-bond mechanical reliability at 40/spl mu/m pitch: squash height and bake temperature effects 40/spl亩/米节距下的金球粘接机械可靠性:挤压高度和烘烤温度的影响

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396698

J. Beleran, F. Wulff, C. Breach

{"title":"Gold ball-bond mechanical reliability at 40/spl mu/m pitch: squash height and bake temperature effects","authors":"J. Beleran, F. Wulff, C. Breach","doi":"10.1109/EPTC.2004.1396698","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396698","url":null,"abstract":"Gold ball-bonding is still used for manufacturing over 90% of the worlds of electronics packages and has moved towards finer pitch in response to increasing demands for more I/O's in smaller spaces. However, as commonly observed when reducing the size of components or features in semiconductor assemblies, reliability decreases. Wirebonding behaves similarly in terms of isothermal bake testing and it is observed that the maximum time ballbonds can be baked without observing high strength ball lifts and low strength ball lifts (HSBL and LSBL respectively) decreases. One of the reasons for this is the need to accommodate smaller bonded balls (by a change of capillary geometry) with diameters not much larger than the wire diameter at pitches of 40 and 35/spl mu/m and even a small loss of bonded ball area by intermetallic degradation can lead to competition between failure at the pad or neck. Previously at pitches >50pm, the larger ball size/wire diameter ratio favoured more robust ballbonding. Understanding the process parameters that affect the occurrence of HSBL and LSBL failures is useful, even if the science behind the root causes of the ball lift phenomenon in ultra-fine pitch applications is currently lacking or at best, developing. An easily controlled and measured parameter is ballbond squash height, which depends on the plastic deformation of the free air ball (FAB) and which might therefore result in ballbond residual mechanical stresses that may couple with geometrical, epitaxial and non-stoichiometry stresses during intermetallic compound growth during ageing. Another factor of interest is the bake temperature, temperatures of interest usually being 150/spl deg/C, 175/spl deg/C and 200/spl deg/C. This paper briefly reports the effects of squash height and bake temperature on the occurrence of ball lifts in a 4N gold wire at 40/spl mu/m bond-pad pitch.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123114998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Pb-free plating: a process and solder joint reliability study 无铅电镀:工艺及焊点可靠性研究

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396596

Ming Sing Ong, Y.M. Lau, A. Tan

引用次数: 0

Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization 铝金属化过程中铜和金球键中金属间生长的表征

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396632

F. Wulff, C. Breach, D. Stephan, Saraswati, K. Dittmer

{"title":"Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization","authors":"F. Wulff, C. Breach, D. Stephan, Saraswati, K. Dittmer","doi":"10.1109/EPTC.2004.1396632","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396632","url":null,"abstract":"While the characterisation of intermetallic coverage and intermetallic phase (IP) growth in gold ball bonding on aluminium is quite well understood, there is relatively little literature concerning the morphology and growth of IP's between Cu balls bonded on aluminium pad metallisation. The difference between Cu-Al IP growth compared with the well known Au-Al IP's has been studied mainly of larger wire diameter (35-50/spl mu/m) in the early 1980's. Cu wire ball bonding has been established for many years mainly for high power devices at wire diameters /spl ges/ 38/spl mu/m and fine wire for discrete device applications. However, there is now interest in fine pitch Cu wire ball bonding at smaller wire diameters of 25/spl mu/m and smaller for high pin count applications, driven mainly by cost reduction. Development and optimisation of robust copper wire bonding processes for such applications requires an assessment of intermetallic coverage and Cu-Al intermetallic growth after isothermal aging. This work describes the problems associated with coverage determination, some characteristics of Cu-Al and Au-Al intermetallic compounds and characterises the difference in the IP growth between Au-Al and Cu-Al. The relative merits of gold and copper ballbonding are also briefly discussed.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127910792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 91

Hybrid technique modeling of a generic feeding network for highly integrated RF transceivers 高集成射频收发器通用馈电网络的混合技术建模

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396691

J.J. Wang, A. Lu, Y.P. Zhang

引用次数: 2

Test bench modeling and characterization for fine pitch wafer level packaged devices 小间距晶圆级封装器件的试验台建模和表征

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396660

J. Jayabalan, R.D. Mihai, J. Tan, M. Iyer, O. B. Leong, L. M. Seng

引用次数: 2

The study of OSP as reliable surface finish of BGA substrate OSP作为BGA基板可靠表面处理剂的研究

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI: 10.1109/EPTC.2004.1396594

D. Chang, F. Bai, Y. Wang, C. Hsiao

{"title":"The study of OSP as reliable surface finish of BGA substrate","authors":"D. Chang, F. Bai, Y. Wang, C. Hsiao","doi":"10.1109/EPTC.2004.1396594","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396594","url":null,"abstract":"OSPs(organic solderability preservatives) have been used as surface finish for over 20 years and continues to taken the place of HASL (hot air solder leveling) or other surface finish to ensure the solderability of printed circuit board (PCB)(Wengenroth and Stafstrom). It is a transparent organic complex film to coat onto copper surface to keep from corrosion of copper surface. The advantages of OSP are stronger solder joint, substrate low price, simple process and environment friendly. For BGA substrate surface finish, electrolytic Ni/Au and electroless Ni/Au are popular in packaging industry. To reduce the cost and solder joint embrittlement, OSP is getting popular in package assembly industry as BGA substrate surface finish, especially in CSP application. In this work, solder spreading is used to determine the wettability of Sn/3.OAg/O.5Cu with 3 kinds of flux. Flux B and C has higher activity and acidity that affected the solder wettability significantly. The thickness of OSP after each packaging process is measured by UV spectrophotometer. OSP discoloration is inspected after multi-reflow, N/sub 2/ implement and packaging process. After packaging process, the ball shear test, IMC growth analysis and failure mode as aging conditions were implemented to evaluate the OSP performance. Finally, these OSP packages mounted onto PCB to evaluate solder joint reliability by board level drop test.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121202957","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 23