无铅电镀:工艺及焊点可靠性研究

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396596

Ming Sing Ong, Y.M. Lau, A. Tan

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引用次数: 0

摘要

将两家电镀供应商的无铅(Pb-free/100%锡)铅镀层质量与标准90wt%Sn-1 0wt%Pb镀层的质量进行了比较。对电镀锡(Sn)性能的表征研究表明，该镀层具有大而稳定的晶粒、高纯度、相当的离子污染水平和可焊性。采用无铅锡膏的组件具有更好的温度循环(T/C)性能，而采用无铅锡膏的组件具有明显的裂纹扩展。分别在零时间、模块回流后和温度/温度的变化过程中对各组分进行了锡晶须的观察和表征。锡晶须的生长速率与镀层上的拉伸和压缩应力有关

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Pb-free plating: a process and solder joint reliability study

The lead-free (Pb-free/100% tin) lead finish quality from two plating suppliers was compared to that of standard 90wt%Sn-1 0wt%Pb plating. A characterization study of the properties of the electroplated tin (Sn) showed that the finish exhibited large stable grains, high purity, comparable ionic contamination levels, and solderability. The assembled modules that employed Pb-free paste for the Sn finish showed better temperature cycling (T/C) performance, as those with Sn-Pb paste showed distinguished crack propagation. Sn whisker observation and characterization were performed on the components at time-zero, after module reflow and with the progression of T/C. The Sn whisker growth rates are explained in relation to tensile and compressive stresses on the plated layer

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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