LTCC基板上微型热电冷却器的设计与制造

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396580

W. Fan, C. K. Wong, Y. M. Tan, K. M. Chua, Bill Freeman, H. J. Jiang

{"title":"LTCC基板上微型热电冷却器的设计与制造","authors":"W. Fan, C. K. Wong, Y. M. Tan, K. M. Chua, Bill Freeman, H. J. Jiang","doi":"10.1109/EPTC.2004.1396580","DOIUrl":null,"url":null,"abstract":"The paper presents the design and fabrication of micro thermoelectric cooler (TEC) using LTCC process and SMT technique. Two micro thermoelectric module prototypes illustrate the construction and performance of the micro TECs. The micro TEC performance simulation results of the micro thermoelectric module indicate that the maximal parameters and performance curves can be optimized based on maximum current (Imax), maximum voltage (Vmax), maximum cooling power (Qmax) and maximum temperature difference (DeltaTmax)","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Design and fabrication of micro thermoelectric cooler on LTCC substrate\",\"authors\":\"W. Fan, C. K. Wong, Y. M. Tan, K. M. Chua, Bill Freeman, H. J. Jiang\",\"doi\":\"10.1109/EPTC.2004.1396580\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents the design and fabrication of micro thermoelectric cooler (TEC) using LTCC process and SMT technique. Two micro thermoelectric module prototypes illustrate the construction and performance of the micro TECs. The micro TEC performance simulation results of the micro thermoelectric module indicate that the maximal parameters and performance curves can be optimized based on maximum current (Imax), maximum voltage (Vmax), maximum cooling power (Qmax) and maximum temperature difference (DeltaTmax)\",\"PeriodicalId\":370907,\"journal\":{\"name\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2004.1396580\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396580","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

本文介绍了利用LTCC工艺和SMT技术设计和制造微型热电冷却器(TEC)。两个微型热电模块原型说明了微型tec的结构和性能。微热电模块的micro TEC性能仿真结果表明，可以根据最大电流(Imax)、最大电压(Vmax)、最大冷却功率(Qmax)和最大温差(DeltaTmax)来优化其最大参数和性能曲线。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Design and fabrication of micro thermoelectric cooler on LTCC substrate

The paper presents the design and fabrication of micro thermoelectric cooler (TEC) using LTCC process and SMT technique. Two micro thermoelectric module prototypes illustrate the construction and performance of the micro TECs. The micro TEC performance simulation results of the micro thermoelectric module indicate that the maximal parameters and performance curves can be optimized based on maximum current (Imax), maximum voltage (Vmax), maximum cooling power (Qmax) and maximum temperature difference (DeltaTmax)

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

自引率

0.00%

发文量