Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)最新文献

{"title":"Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method","authors":"E. Liu, E. Li, Lewei Li","doi":"10.1109/EPTC.2004.1396690","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396690","url":null,"abstract":"A new hybrid finite-difference time-domain and mixed-potential integral equation method (hybrid FDTD-MPIE) is developed for the modeling of multilayer planar structures with locally inhomogeneous objects. By using equivalence principle, the original problem can be decomposed into external and internal problems. The FDTD method is applied to solve the internal problem, which contains the locally inhomogeneous dielectric objects. Conversely, the frequency domain MPIE method is employed to address the external problem of the global multilayered planar structure. The FDTD model and the MPIE model are coupled together by enforcing the continuity of tangential fields on the equivalent surface. Both the direct and iterative method is demonstrated in This work to solve the integral-differential problem. In addition, the DCIM method is applied to improve the computational efficiency. Numerical results are presented to validate the proposed hybrid FDTD-MPIE method.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"72 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129343427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Control chart for joint monitoring mean and variance of a stationary process","authors":"Penghui Wang, Zhang Wu","doi":"10.1109/EPTC.2004.1396577","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396577","url":null,"abstract":"As a newly proposed control scheme in SPC, adaptive-loss-function (AL) control chart is a single chart for monitoring process mean and variance simultaneously (Wang and Wu, 2004). It has demonstrated considerable reductions in average run length (ARL) to signal process shifts for independent observations. This article is a follow-up effort to extend the AL chart to a stationary process of AR(1). Under an AR(1) model, the application of the original AL chart is addressed by a residual approach conveniently. Through numerical comparisons, it is found that the AL chart by residual approach is a preferable choice over a wide range of process shifts relative to other two schemes. Generally, the superiority is more evident for moderate to large mean shift in case of positive correlation, and for small to moderate mean shift in presence of negative correlation","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129691122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Transient characteristics of BCB encapsulated surface micromachined aluminum micro-mechanical resonators","authors":"S. Pamidighantam","doi":"10.1109/EPTC.2004.1396599","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396599","url":null,"abstract":"In this contribution, the transient characteristics of benzo cyclo butene (BCB) encapsulated aluminum (Al) micro mechanical resonators as a function of time varying pressure are studied. The quality factor of encapsulated Al resonator showed a drastic change with time of more than 200% reduction. The estimated transient leak rate spans over several orders of magnitude (10/sup 5/ to 10/sup -9/ atm cm/sup 3/ s/sup -1/). A theoretical description of Al micro mechanical resonator and the leak rate are presented. Possible causes for the leak rate and the potential solutions are also outlined.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115024822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Coaxial probe dielectric measurements in the presence of airgaps","authors":"A. P. Popov, M. Rotaru","doi":"10.1109/EPTC.2004.1396658","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396658","url":null,"abstract":"Interpolation formulas for retrieval of the dielectric constant of the substrate from the measured probe impedance within a specified frequency range are introduced. The proposed formulas were tested for retrieval of dielectric constant from impedance measurements for the substrates with known properties. It was found that the accuracy of the proposed interpolation formulas is better than 5% within the frequency range of 0.5-20 GHz.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115413893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Silicon steel core printed wiring board for a highly efficient low profile spindle motor for mobile storage devices","authors":"Y. Fujita, Y. Amano, Y. Yamaguchi","doi":"10.1109/EPTC.2004.1396705","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396705","url":null,"abstract":"We have developed a silicon steel core printed wiring board (PWB) for a highly efficient and low profile spindle motor, stator. This PWB incorporates stator coils and circuit patterns that realize a thinner hard disk drive than is possible with conventional coiled wiring technology. The thermal reliability test and an evaluation of power consumption of motor showed that this board-embedded structure is feasible for mobile storage devices.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121244465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"RoHS-compliant molding compound evaluation and manufacturability for FBGA packages","authors":"R. Ingkanisorn, A. Sriyarunya","doi":"10.1109/EPTC.2004.1396655","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396655","url":null,"abstract":"The European Union through its waste electrical and electronic equipment (WEEE) and the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) requires lead and certain brominated flame-retardants to be phased out of electronic products by July 1,2006. Bromine-containing flame-retardants and antimony oxide flame retardant synergists are commonly used in molding compounds formulations and are thought to be potentially unsafe if released into the environment. Phosphorus-containing compounds have been proposed as flame-retardants. Although phosphorus is less hazardous, it has been shown to have a negative effect on package reliability. New molding compounds have been developed that are substantially free of bromine, antimony and phosphorous and are able to pass UL94V-0 flammability rating. Our company has evaluated and qualified new molding compounds for FBGA (fine pitch ball grid array), which are free of bromine, antimony flame-retardants, and phosphorous and can pass precondition reliability test at 30/spl deg/C70%RH for 216 hours and 3/spl times/ reflow at 260/spl deg/C temperature. In this evaluation, six (6) alternative molding compound formulations were studied. These molding compound formulations contain different flame retardant additives, which enable the compound to pass UL94V-0 flammability rating. Four (4) molding compounds use biphenyl resin base with different flame retardant additives, while two (2) other molding compounds use aromatic resin without flame retardant additive. The evaluation used a FBGA1 package with die size 51 mm/sup 2/ as a test vehicle. Optimized molding process parameters were determined for each compound and the six compounds were compared to each other on the basis of molded quality, wire sweep, die top surface delamination on and package warpage. Based on moldability and manufacturability results, the two (2) best molding compounds were selected for reliability test with 2 FBGA packages as - FBGA1 and FBGA2 at different package and die size. The results of both the manufacturability and package reliability evaluations have indicated that new molding compound with biphenyl resin without flame retardant has the best performance in term of quality and reliability.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"288 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116585118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Heat transfer enhancement in impinging jets by surface modification","authors":"A. King, T.T. Chandratilleket","doi":"10.1109/EPTC.2004.1396617","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396617","url":null,"abstract":"This work presents a numerical investigation of a novel technique of enhancing heat transfer from impinging fluid jets at a heated surface. In the proposed method, suitable modifications are introduced to the target surface area of the jet by attaching thermally conductive objects right beneath the impinging jet. Results indicate a significant change in fluid flow characteristics and show substantial improvement in heat transfer up to about 30% over a large range of flow regimes. Further enhancement possibilities are also examined with appropriate changes to the surface geometry.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121492434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Unsteady thermal behaviour of electronic chips inside FC-72 cooled channel","authors":"H. Bhowmik, K. W. Tou, C. Tso","doi":"10.1109/EPTC.2004.1396674","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396674","url":null,"abstract":"Experimental analysis of transient natural convection heat transfer from a four-in-line chip module that are flush-mounted to one wall of a vertical rectangular channel are performed for the liquid coolant of FC-72. The heat flux ranges from 1 kW/m2 to 6 kW/m 2. The effect of heat fluxes and chip numbers are investigated. The results indicate that the heat transfer coefficient is affected strongly by the number of chips. Correlations are presented for individual chips as well as for overall data in the transient regime. The transient correlation for overall data recommended is Nul = 0.47(Fo)-0.35(Ral)1/4","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127149698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design of nanowire anisotropic conductive film for ultra-fine pitch flip chip interconnection","authors":"Renbang Lin, Y. Hsu, R. Fan, Yu-Chih Chen, S. Cheng, Chao-Ta Huang, R. Uang","doi":"10.1109/EPTC.2004.1396589","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396589","url":null,"abstract":"As the prediction that the I/O pitch will decrease from 60 um in 2004 to 20 um beyond 2010 by ITRS roadmap, flip chip interconnection by traditional ACF containing conductive particles with micro-meter size will face more and more challenges. One of many possible solutions is using high aspect-ratio metal posts or flake instead of conductive particles for electrical interconnection between chip and substrate. But this interconnection by metal posts is less reliable compared with elastic conductive particles. Therefore we develop a new type of conductive film composed of nanowires and polymer. Unlike some other composed material by blending nanowires, tubes, powders in polymer, the arrangement of nanowires in polymer is highly ordered in X, Y, and Z direction for anisotropic conductance. In order to achieve high reliability performance of this novel package, the structure design of flip chip package constructed by nanowires/polymer conductive film was evaluated by stress simulation and related D.O.E analysis. In this research, series of finite element models were established based on the D.O.E. (design of experiment) matrix. The four factors including thickness of nanowires/polymer composed film, volume ratio of nanowires in nanowires/polymer composed film, CTE and Young's modulus of polymer were used in this D.O.E. matrix. The full factorial DOE matrix was applied to optimize the response of peeling stress. These results indicated that volume ratio of nanowires was the major factor. The other important factor was film thickness. Besides the above stress analysis, we also demonstrated the production of nanowires/polymer composed film. Now we can obtain the silver nanowires/polyimide composed films with diameter of nanowire about 200nm and maximum film thickness up to 50 um. The X-Y insulation resistance is about 4~6 GOmega and Z-direction resistance including the trace resistance (3mm length) is less than 0.2Omega","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127194517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Techniques for nano-scale deformation measurement","authors":"Su Fei, Sun Yaofeng, Shi Xunqing, Wong Chee Khuen Stephen","doi":"10.1109/EPTC.2004.1396703","DOIUrl":"https://doi.org/10.1109/EPTC.2004.1396703","url":null,"abstract":"Deformation measurement of mechanical-electrical devices is important for their reliability evaluation. However, with the development of fabrication technology, sizes of mechanical-electrical devices are reduced to micro or even nano-scale. Correspondingly, testing resolution of the required metrology techniques must be improved to the same or even higher level. The commonly used characterization facility with nano-scale resolution is STM/AFM/SEM etc. In this paper, some metrology technologies based on these facilities for nano-scale deformation measurement, e.g. AFM/SEM moire and AFM/SEM digital speckle correlation are introduced, including their principles, advantages and disadvantages. Their applications in the deformation/strain measurement of MEMS and IC packages are highlighted.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127233556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}