BCB封装表面微加工铝微机械谐振器的瞬态特性

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396599

S. Pamidighantam

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引用次数: 2

摘要

本文研究了苯并环丁烯(BCB)封装铝(Al)微机械谐振器的瞬态特性随压力时变的函数关系。封装铝谐振腔的品质因子随时间变化剧烈，降低幅度超过200%。估计的瞬态泄漏率跨越几个数量级(10/sup 5/至10/sup -9/ cm/sup 3/ s/sup -1/)。给出了铝微机械谐振器的理论描述和泄漏率。还概述了泄漏率的可能原因和可能的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Transient characteristics of BCB encapsulated surface micromachined aluminum micro-mechanical resonators

In this contribution, the transient characteristics of benzo cyclo butene (BCB) encapsulated aluminum (Al) micro mechanical resonators as a function of time varying pressure are studied. The quality factor of encapsulated Al resonator showed a drastic change with time of more than 200% reduction. The estimated transient leak rate spans over several orders of magnitude (10/sup 5/ to 10/sup -9/ atm cm/sup 3/ s/sup -1/). A theoretical description of Al micro mechanical resonator and the leak rate are presented. Possible causes for the leak rate and the potential solutions are also outlined.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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