高集成射频收发器通用馈电网络的混合技术建模

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396691

J.J. Wang, A. Lu, Y.P. Zhang

{"title":"高集成射频收发器通用馈电网络的混合技术建模","authors":"J.J. Wang, A. Lu, Y.P. Zhang","doi":"10.1109/EPTC.2004.1396691","DOIUrl":null,"url":null,"abstract":"This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Hybrid technique modeling of a generic feeding network for highly integrated RF transceivers\",\"authors\":\"J.J. Wang, A. Lu, Y.P. Zhang\",\"doi\":\"10.1109/EPTC.2004.1396691\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.\",\"PeriodicalId\":370907,\"journal\":{\"name\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2004.1396691\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396691","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

这项工作提出了一个通用馈电网络的电路建模方法，用于高度集成的射频收发器模块。馈电网络由模块或封装互连组成，包括键合线、信号走线和过孔。采用解析和数值模拟技术计算电路参数。并将该电路建模方法与全波三维电磁仿真进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Hybrid technique modeling of a generic feeding network for highly integrated RF transceivers

This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

自引率

0.00%

发文量