Realization of LTCC modules for broadband applications

Abstract

In order to satisfy module miniaturization requirements for next-generation products, an advanced substrate integration platform is highly desirable. In recent years, intensive research has been carried out on integrating actives and passives within the common substrate platform, to achieve system integration within a module. Low temperature cofired ceramic (LTCC) technology is a substrate platform that provides true 3D integration, whilst satisfying very high frequency performance requirements, with superior thermal performance. This paper will address key manufacturing aspects and associated impact on high-frequency performance. A solution space analysis was employed to identify the key parameters encompassing trace width and gap. Robust manufacturing design rules were developed along with performance validation techniques