Proceedings of the International Conference on Multichip Modules最新文献_第10页

Defect Migration of Multi-chip Modules Using Structural Test 基于结构测试的多芯片模块缺陷迁移

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI: 10.1109/ICMCM.1994.753556

J. Eastman, W. Creighton, A. Laidler, Tak Lun Leung

引用次数: 2

Choosing an Mcm Technology for Thermal Performance 为热性能选择Mcm技术

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI: 10.1109/ICMCM.1994.753604

J. Demmin

引用次数: 5

Mcm Burn-In Experience Mcm老化经验

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI: 10.1109/ICMCM.1994.753555

T. Bardsley, J. Lisowski, S. Wilson, S. VanAernam

引用次数: 0

Cost effective ceramic surface mount packaging for high I/O applications 高I/O应用的高性价比陶瓷表面贴装封装

Proceedings of the International Conference on Multichip Modules Pub Date : 1900-01-01 DOI: 10.1109/ICMCM.1994.753597

J. Miks

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引用次数: 0

Proceedings of the 1994 International Conference on Multichip Modules 1994年多芯片模块国际会议论文集

Proceedings of the International Conference on Multichip Modules Pub Date : 1900-01-01 DOI: 10.1109/ICMCM.1994.753519

引用次数: 0

Thin-Profile MCM-D Packaging for Small Form Factor Applications 用于小尺寸应用的薄型MCM-D封装

Proceedings of the International Conference on Multichip Modules Pub Date : 1900-01-01 DOI: 10.1109/ICMCM.1994.753590

A. Bet-Shliemoun, M. McGraw, B. Griswold, Chung Ho, S. Westbrook

引用次数: 0

Testing Multichip Modules and Bare Die Using Vision Probing Techniques 使用视觉探测技术测试多芯片模块和裸模

Proceedings of the International Conference on Multichip Modules Pub Date : 1900-01-01 DOI: 10.1109/ICMCM.1994.753553

D. Place

引用次数: 0