{"title":"使用视觉探测技术测试多芯片模块和裸模","authors":"D. Place","doi":"10.1109/ICMCM.1994.753553","DOIUrl":null,"url":null,"abstract":"Testing multichip modules (MCM's), MMIC devices, T/R modules, hybrid circuits, bare die, and any device with x,y,z and theta variations can now be performed automatically using a newly developed Vision Probing System.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Testing Multichip Modules and Bare Die Using Vision Probing Techniques\",\"authors\":\"D. Place\",\"doi\":\"10.1109/ICMCM.1994.753553\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Testing multichip modules (MCM's), MMIC devices, T/R modules, hybrid circuits, bare die, and any device with x,y,z and theta variations can now be performed automatically using a newly developed Vision Probing System.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753553\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Testing Multichip Modules and Bare Die Using Vision Probing Techniques
Testing multichip modules (MCM's), MMIC devices, T/R modules, hybrid circuits, bare die, and any device with x,y,z and theta variations can now be performed automatically using a newly developed Vision Probing System.