为热性能选择Mcm技术

J. Demmin
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引用次数: 5

摘要

众所周知,由于典型MCM的密度和性能,热管理对多芯片模块(MCM)封装的成功至关重要,但不同MCM技术的热方面却鲜为人知。例如,当忽略了满足热要求所需的尺寸、成本和电气性能方面的权衡时,简单的分析可能会产生误导。此外,热性能和分析的某些微妙之处可能会使通常指导设计决策的一阶评估无效。本工作试图通过用有限元建模技术评估各种MCM技术的热特性来澄清这种情况。这项工作还通过检查MCM热分析的一些不太直观的方面来解决问题。总结了评估MCM技术热性能时需要考虑的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Choosing an Mcm Technology for Thermal Performance
It is widely known that thermal management is critical to the success of multichip module (MCM) packaging because of the density and performance of typical MCMs, but the thermal aspects of different MCM technologies are less well understood. Simplistic analysis can be misleading when, for example, the trade-offs in size, cost, and electrical performance needed to meet thermal requirements are ignored. In addition, certain subtleties of thermal performance and analysis can invalidate the first-order evaluations that often guide design decisions. This work attempts to clarify the situation by evaluating the thermal characteristics of various MCM technologies with finite element modeling techniques. This work also addresses the problem by examining some of the less intuitive aspects of MCM thermal analysis. A summary of issues to consider when evaluating thermal performance of MCM technologies is presented.
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