{"title":"Testing Multichip Modules and Bare Die Using Vision Probing Techniques","authors":"D. Place","doi":"10.1109/ICMCM.1994.753553","DOIUrl":null,"url":null,"abstract":"Testing multichip modules (MCM's), MMIC devices, T/R modules, hybrid circuits, bare die, and any device with x,y,z and theta variations can now be performed automatically using a newly developed Vision Probing System.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Testing multichip modules (MCM's), MMIC devices, T/R modules, hybrid circuits, bare die, and any device with x,y,z and theta variations can now be performed automatically using a newly developed Vision Probing System.