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Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)最新文献

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ESD sensitivity of GMR heads at variable pulse length 变脉冲长度下GMR磁头的ESD灵敏度
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890092
D. Guarisco, M. Li
{"title":"ESD sensitivity of GMR heads at variable pulse length","authors":"D. Guarisco, M. Li","doi":"10.1109/EOSESD.2000.890092","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890092","url":null,"abstract":"9 Gb/in/sup 2/ GMR heads were subjected to electrical overstress using square pulses of variable duration. The pulse length was varied between 4 ns and 80 ms. For each pulse length, the magnetic and physical failure thresholds were measured via a quasi-static test. It is found that for long pulses (/spl gsim/1 /spl mu/s) the GMR sensors fail at constant power, whereas at very short times (<100 ns), the system starts to gradually transition to an adiabatic regime where failure occurs at constant energy.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130951023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
A study of static-dissipative tweezers for handling giant magneto-resistive recording heads 处理巨磁阻记录磁头的静耗散镊子研究
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890124
C. F. Lam
{"title":"A study of static-dissipative tweezers for handling giant magneto-resistive recording heads","authors":"C. F. Lam","doi":"10.1109/EOSESD.2000.890124","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890124","url":null,"abstract":"The goal of this paper is to share information on the study of static-dissipative tweezers for use in giant magneto-resistive recording heads. There are two tests, one to measure the amount of energy of transient currents discharged from tweezers and the other to determine the voltage of a head gimbal assembly (HGA) at which a pair of grounded tweezers can damage the GMR head when in contact. These experiments are important because the energy of transient current discharged from tweezers directly affects the magnetic performance of the GMR head. The results of the two tests correlate relatively well. Most dissipative ceramic tweezers performed very well. Black polymer tweezers with 1.3% carbon, and metal impregnated ceramic tweezers, also performed very well. One type of dissipative copolymer tweezers was found to behave like a conductor. Some carbon-loaded polymer tweezers and stainless steel tweezers have the worst ESD performances.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114836994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimizing the performance of ESD circuit protection devices 优化ESD电路保护器件的性能
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890025
H. Hyatt, J. Harris, J. Colby, P. Bellew
{"title":"Optimizing the performance of ESD circuit protection devices","authors":"H. Hyatt, J. Harris, J. Colby, P. Bellew","doi":"10.1109/EOSESD.2000.890025","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890025","url":null,"abstract":"Decision-making methods for choosing ESD circuit protection remain poorly understood. Selecting an IC which passed ESD device level testing does not guarantee that a particular circuit using that device will survive ESD events. We present an optimization methodology for assessment of ESD circuit protection.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123917750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Threshold of ESD damage to GMR sensor GMR传感器ESD损伤阈值
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890094
R. Tao, F.G. Zhao
{"title":"Threshold of ESD damage to GMR sensor","authors":"R. Tao, F.G. Zhao","doi":"10.1109/EOSESD.2000.890094","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890094","url":null,"abstract":"There are basically two kinds of ESD damage modes for GMR sensors in current GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes: the current damage mode and the voltage damage mode. The current damage mode accounts for most of the ESD damage in actual GMR head production, which indicates that the GMR sensor gets damaged by an unexpected transient current passing through it. This paper discusses the possibility of defining a generic ESD threshold for the current damage mode.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121806268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Chip-level simulation for CDM failures in multi-power ICs 多功率集成电路中CDM故障的芯片级仿真
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890116
Jea-Chun Lee, Y. Huh, Jau-Wen Chen, P. Bendix, S. Kang
{"title":"Chip-level simulation for CDM failures in multi-power ICs","authors":"Jea-Chun Lee, Y. Huh, Jau-Wen Chen, P. Bendix, S. Kang","doi":"10.1109/EOSESD.2000.890116","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890116","url":null,"abstract":"This paper presents a new chip-level simulation methodology for charged-device model (CDM) failure analysis in multi-power ICs. A circuit model considering reported CDM failures and efficient simulation is proposed and incorporated with the circuit-level ESD simulator, iETSIM. The CDM behaviors in multi-power ICs are analyzed and the vulnerable sites to CDM stress can be predicted by chip-level simulation. Simulation results are verified by CDM testing of a 0.25 /spl mu/m CMOS ASIC and show good correlation. This simulation methodology at the full-chip level enables us to address CDM failure issues before the detailed chip floorplan and power grid networking are started.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122916604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
Floating gate EEPROM as EOS indicators during wafer-level GMR processing 在晶圆级GMR处理过程中，浮栅EEPROM作为EOS指示灯
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/6104.930958
E. Granstrom, R. Cermak, P. Tesárek, N. Tabat
{"title":"Floating gate EEPROM as EOS indicators during wafer-level GMR processing","authors":"E. Granstrom, R. Cermak, P. Tesárek, N. Tabat","doi":"10.1109/6104.930958","DOIUrl":"https://doi.org/10.1109/6104.930958","url":null,"abstract":"Potentially damaging charging currents and voltages in wafer-level giant magentoresistance (GMR) plasma processing tools have been measured using floating gate EEPROM (FG-EEPROM) monitor wafers. Although FG-EEPROM monitors have been used as semiconductor process monitors, this report demonstrates their use in ESD-sensitive GMR head production. Use of FG-EEPROM monitors allows quantification of plasma-induced EOS voltages and currents, and can be used in optimizing process tool EOS performance, as is demonstrated in a case study on an ion mill.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116233248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Design and testing of facilities ground 场地设施的设计和测试
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890104
D.R. Stockin
{"title":"Design and testing of facilities ground","authors":"D.R. Stockin","doi":"10.1109/EOSESD.2000.890104","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890104","url":null,"abstract":"The goal of this manuscript is to provide the base knowledge needed to be able to properly manage the testing and/or improvement of a facilities grounding system. Solutions for static charge problems rely on dedicated earth grounds with a resistance-to-ground typically specified at less than 5 ohms. Simple driven rods cannot normally reach this goal and often do not meet the NEC standard of 25 ohms resistance-to-ground. Proper testing and design will provide quantitative data to the EOS/ESD engineer and reduce the potential for revenue loss caused by ESD faults.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122338465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Engineering the cascoded NMOS output buffer for maximum V/sub t1/ 设计级联编码NMOS输出缓冲器，最大V/sub t1/
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890090
J. Miller, M. Khazhinsky, J. Weldon
{"title":"Engineering the cascoded NMOS output buffer for maximum V/sub t1/","authors":"J. Miller, M. Khazhinsky, J. Weldon","doi":"10.1109/EOSESD.2000.890090","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890090","url":null,"abstract":"The overall ESD performance of CMOS integrated circuits is often limited by the ESD robustness of the lateral NPN (LNPN) bipolar transistor parasitic to the NMOS output buffer. In this paper, we investigate layout and bias options for maximizing the lateral NPN bipolar trigger voltage V/sub t1/ of the cascoded NMOSFET output buffer. Based on experimental data and device simulations, we demonstrate: (1) how bipolar turn-on characteristics change with buffer layout; and (2) how V/sub t1/ may be significantly increased by applying bias to the upper NMOSFET gate. Example circuits which produce these preferential ESD bias conditions are shown.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130690024","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 48
Baseline popping of spin-valve recording heads induced by ESD 静电放电引起的自旋阀记录磁头基线爆裂
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890100
Yong Shen, R. Leung, J.Z.F. Sun
{"title":"Baseline popping of spin-valve recording heads induced by ESD","authors":"Yong Shen, R. Leung, J.Z.F. Sun","doi":"10.1109/EOSESD.2000.890100","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890100","url":null,"abstract":"We report a novel mechanism of baseline popping (BLP) of spin-valve (SV) magnetic recording heads induced by machine model (MM) ESD, which is characterized by short transient time (10-20 ns) and high peak current (25-35 mA). Energy required for the phenomenon is just 0.2-0.3 nJ which is significantly less than that required for pinned layer reversal induced by human body model (HBM) ESD (Takahashi et al., 1998). Our data shows that this magnetic instability is caused by a change in the magnetization state of the permanent magnetic layer near track edges and can be eliminated by magnetic field re-initialization.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130740221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Silicon-on-insulator dynamic threshold ESD networks and active clamp circuitry 绝缘体上硅动态阈值ESD网络和有源箝位电路
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI: 10.1109/EOSESD.2000.890024
S. Voldman, D. Hui, D. Young, R. Williams, D. Dreps, J. Howard, M. Sherony, F. Assaderaghi, G. Shahidi
{"title":"Silicon-on-insulator dynamic threshold ESD networks and active clamp circuitry","authors":"S. Voldman, D. Hui, D. Young, R. Williams, D. Dreps, J. Howard, M. Sherony, F. Assaderaghi, G. Shahidi","doi":"10.1109/EOSESD.2000.890024","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890024","url":null,"abstract":"Active clamp circuits are key to minimize electrical overshoot and undershoot and minimize reflected signals and achieve performance objectives and reliability requirements in high performance CMOS circuits. This paper discusses for the first time the electrostatic discharge (ESD) protection circuits of silicon-on-insulator (SOI) active clamp networks, dynamic threshold MOSFET SOI ESD techniques and the synthesis of DTMOS concepts, ESD protection networks, and active clamp circuitry for high-pin-count high-performance semiconductor chips.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126851314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
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