{"title":"High current characteristics of devices in a 0.18 /spl mu/m CMOS technology","authors":"E. Worley, A. Salem, Y. Sittampalam","doi":"10.1109/EOSESD.2000.890089","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890089","url":null,"abstract":"ESD protection networks can involve several different types of devices and associated interconnect. This paper examines the high current performance of several devices that can be found in the I/O cells of a 0.18 micron CMOS technology. Devices characterized include NFETs with and without N well drain resistors including segmented resistors, N well resistors, N channel field snap-back devices, PFETs, and diodes. Also examined is the performance of metal, contacts, and vias. Diode interconnect is also analyzed with respect to failure point and parasitic resistance.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128559131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"ESD evaluation of tunneling magnetoresistive (TMR) devices","authors":"A. Wallash, J. Hillman, Dexin Wang","doi":"10.1109/EOSESD.2000.890118","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890118","url":null,"abstract":"In this work, we study and compare the dielectric breakdown and human body model electrostatic discharge (ESD) failure levels of tunneling magnetoresistive (TMR) sensors. An equivalent circuit for the TMR device is developed and used in SPICE circuit simulations to study its response to electrostatic discharge. Dielectric breakdown averaged 2.3 V and ESD testing showed device shorting at 8.6 V HBM.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127169961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"New methods for measuring resistance and charge decay of worksurfaces","authors":"H. Uchida, H. Kurosaki, T. Numaguchi","doi":"10.1109/EOSESD.2000.890038","DOIUrl":"https://doi.org/10.1109/EOSESD.2000.890038","url":null,"abstract":"All microelectronic components are increasingly small, lightweight, thin, and short. This paper considers how to provide a better static control worksurface for the manufacturing area that handles very fine and highly sensitive microelectronic parts. The static sensitivity level for the microelectronic parts concerned is less than 100 V (HBM). We propose a new evaluation test method and guidance for new materials for use in highly susceptible microelectronics working areas. Unprotected devices with extremely thin oxide layers are very sensitive to electrostatic effects. Even some passive components such as capacitors, coils and resistors in surface mount packages are shown to be highly susceptible to electrostatic effects. Conventional static control methods are not always effective in protecting these modern parts, and thus it is time to re-evaluate static control methods and materials for the microelectronics market. In this paper, we consider the changes needed to ensure proper protection of extremely sensitive parts. We propose a new test methodology that better emulates the actual conditions encountered in microelectronics manufacturing.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115329443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}