IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings最新文献_第8页

Implementation of an in-situ particle monitoring methodology in a production environment 在生产环境中实施现场颗粒监测方法

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558021

Y. Khawaja, S. Felker, T. Desanti

{"title":"Implementation of an in-situ particle monitoring methodology in a production environment","authors":"Y. Khawaja, S. Felker, T. Desanti","doi":"10.1109/ASMC.1996.558021","DOIUrl":"https://doi.org/10.1109/ASMC.1996.558021","url":null,"abstract":"The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at a lower cost. In-situ particle monitoring is an accurate and cost effective method of contamination control in a production environment. In-situ particle monitors use laser particle counters to sample particles exiting the chamber, the data is displayed in real-time enabling the user to respond immediately to any out of control conditions. Implementation of in-situ particle monitoring on a chemical downstream etch system in a production environment is described. The chamber clean cycles on this etch system are driven by polymer flaking from chamber parts, which makes real time particulate monitoring necessary. In-situ plasma clean process is characterized using in-situ particle monitors to reduce particulate flaking from chamber parts. All process steps during the etch step are also analyzed using in-situ monitors to identify and eliminate sources of particulate contamination. Implementation of in-situ monitoring resulted in a 92% reduction in test wafer costs, and also provided a model for predicting particulate perturbations in the etch system. Improvements in cleaning techniques resulted in a two fold improvement in the mean time between cleans.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121306016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Strategic alliances for equipment reliability improvement in a dynamic startup environment 动态启动环境下提高设备可靠性的战略联盟

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558118

J. Crowley, Sey-Ping Sun, Curtis Clingingsmith, M. Turner

{"title":"Strategic alliances for equipment reliability improvement in a dynamic startup environment","authors":"J. Crowley, Sey-Ping Sun, Curtis Clingingsmith, M. Turner","doi":"10.1109/ASMC.1996.558118","DOIUrl":"https://doi.org/10.1109/ASMC.1996.558118","url":null,"abstract":"For the AMD Fab 25 start-up in Austin, TX, it was critical to achieve high availability and low defectivity performance for all critical equipment early on. The economics of the project required that process maturity be reached within hundreds of lots rather than thousands of lots, which can only be done with a reliable equipment set. However, it also required the capability of extending the technology many years into the future. This meant that the tools selected for the fab generally were the most advanced with small installation bases and, as a result, little background experience. Because of this it was imperative that we achieve rapid cycles of learning on these tool sets early in the start-up. The Novellus Concept Two Sequel and Altus were selected as the major CVD tools for use in Fab 25. An equipment Continuous Improvement Team (CIT) was formed prior to installation of the equipment. This team consisted of representatives from both Novellus and AMD. The focus was on key reliability metrics required to facilitate maturation of the fab: availability, Mean Time Between Failure (MTBF), and cost-of-ownership. A strategy for achieving our goals was devised. Critical to this process was partnering with Novellus Systems. The alliance between AMD and Novellus was designed to optimize learning on this tool set. Interaction occurred at all levels including engineering, manufacturing, maintenance, and management from both parties. All data was continuously and rigorously reviewed and validated. Knowledge was transferred in both directions. The CIT focused on critical problems during the start-up, rapidly addressing them.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115080538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Role of rapid isothermal processing (RIP) in cycle time reduction 快速等温处理(RIP)在缩短循环时间中的作用

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.557989

R. Singh, R. Sharangpani

引用次数: 0

Optical characterization of TiN thin films TiN薄膜的光学特性

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558081

W. McGahan, B. Spady, J. Iacoponi, J.D. Williams

引用次数: 1

User group implementation with a U.S. supplier 使用美国供应商的用户组实现

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558119

S. Hossain-Pas, J. Brennan, D. Matsuhiro

引用次数: 0

Yield risk cards at D2 收益率风险卡在D2

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558109

T. Agostino, V. Dhar, R. Dudonis, J. Ku

引用次数: 0

The effectiveness of defect-to-yield correlations [semiconductor manufacture] 缺陷-成品率相关性的有效性[半导体制造]

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558096

K. Zinke, R. Spencer, D. Freeman

引用次数: 3

300 mm tool automation and its impact on fab design and OEE 300mm工具自动化及其对fab设计和OEE的影响

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.557988

M. Weiss

{"title":"300 mm tool automation and its impact on fab design and OEE","authors":"M. Weiss","doi":"10.1109/ASMC.1996.557988","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557988","url":null,"abstract":"The challenge to building fabs in the 300 mm era will be to maximize the productivity of capital. One road in this direction is to increase Overall Equipment Effectiveness (OEE). At this time the approach being taken to increasing OEE involves the redesign of tools to improve reliability, increase throughput, reduce footprint, etc. The onset of 300 mm, however, presents an opportunity to take a more system wide approach at increasing OEE. In this paper we quantify the effects that material handling has on the cost of front end wafer fab by analyzing the effects that selection of batch size, carrier design, tool layout, wafer handling systems, etc. have on the Manufacturing Lead Time (MLT) of a chip. The paper then identifies design options for 300 mm handling components which increase the amount of time wafers spend getting value added in process tools, and decrease the overall non-value added handling times. This presents the basis for a description of a 300 mm fab tools and carriers which are designed as a total system to increase the OEE of the total fab, or the Overall Fab Effectiveness (OFE).","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128301363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The free factory: cutting cycle time and gaining output 自由工厂:缩短周期时间，提高产量

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.557986

M. Page

{"title":"The free factory: cutting cycle time and gaining output","authors":"M. Page","doi":"10.1109/ASMC.1996.557986","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557986","url":null,"abstract":"In 1992 Texas Instruments launched a program to maximize the throughput in its existing wafer fabrication facilities by improving yields, reducing cycle times and increasing the predictability of the manufacturing process. It was a monumental effort, involving everyone in TI's Semiconductor Group worldwide, from process technicians on the factory floor, to design engineers, to R&D scientists to top executives. TI's \"Free Fab\" initiative was aimed at every process, every manufacturing step from design to finished product in every TI semiconductor manufacturing facility worldwide. The challenges were diverse spanning standardized commodity product processes as well as customized product processes, like digital signal processors. The results have been dramatic. By 1994, TI had gained the equivalent of a complete factory in output and, by end of 1995 a second \"free\" factory had been gained, all from productivity improvements. Cycle times have been cut from 140 days on a custom product to 60 days and on-time delivery is the best in the industry at over 95 percent. While the results are significant, the bigger challenge now is keep the organization focused on continued improvement in yields, cycle times and predictability.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130660950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Defect reduction through statistical process control and prior-level subtraction analysis 通过统计过程控制和前级减法分析来减少缺陷

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI: 10.1109/ASMC.1996.558023

D. Shanks

引用次数: 1