通过统计过程控制和前级减法分析来减少缺陷

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Pub Date : 1996-11-12 DOI:10.1109/ASMC.1996.558023

D. Shanks

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引用次数: 1

摘要

本文讨论了利用统计过程控制(SPC)来减少氮化物蚀刻过程中的缺陷。还描述了如何减少接触过程中的缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Defect reduction through statistical process control and prior-level subtraction analysis

This paper discusses the reduction of defects in a nitride etching process using statistical process control (SPC). How defects are reduced in a contact process is also described.

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来源期刊

IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings

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