{"title":"Implementation of an in-situ particle monitoring methodology in a production environment","authors":"Y. Khawaja, S. Felker, T. Desanti","doi":"10.1109/ASMC.1996.558021","DOIUrl":null,"url":null,"abstract":"The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at a lower cost. In-situ particle monitoring is an accurate and cost effective method of contamination control in a production environment. In-situ particle monitors use laser particle counters to sample particles exiting the chamber, the data is displayed in real-time enabling the user to respond immediately to any out of control conditions. Implementation of in-situ particle monitoring on a chemical downstream etch system in a production environment is described. The chamber clean cycles on this etch system are driven by polymer flaking from chamber parts, which makes real time particulate monitoring necessary. In-situ plasma clean process is characterized using in-situ particle monitors to reduce particulate flaking from chamber parts. All process steps during the etch step are also analyzed using in-situ monitors to identify and eliminate sources of particulate contamination. Implementation of in-situ monitoring resulted in a 92% reduction in test wafer costs, and also provided a model for predicting particulate perturbations in the etch system. Improvements in cleaning techniques resulted in a two fold improvement in the mean time between cleans.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1996.558021","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at a lower cost. In-situ particle monitoring is an accurate and cost effective method of contamination control in a production environment. In-situ particle monitors use laser particle counters to sample particles exiting the chamber, the data is displayed in real-time enabling the user to respond immediately to any out of control conditions. Implementation of in-situ particle monitoring on a chemical downstream etch system in a production environment is described. The chamber clean cycles on this etch system are driven by polymer flaking from chamber parts, which makes real time particulate monitoring necessary. In-situ plasma clean process is characterized using in-situ particle monitors to reduce particulate flaking from chamber parts. All process steps during the etch step are also analyzed using in-situ monitors to identify and eliminate sources of particulate contamination. Implementation of in-situ monitoring resulted in a 92% reduction in test wafer costs, and also provided a model for predicting particulate perturbations in the etch system. Improvements in cleaning techniques resulted in a two fold improvement in the mean time between cleans.