The effectiveness of defect-to-yield correlations [semiconductor manufacture]

Abstract

Most semiconductor manufacturers have a yield enhancement group to continually monitor and evaluate probe and E-test data. In addition to assuring that devices meet parametric specifications, the yield enhancement group will also focus on understanding the relationship between post fab probe data and in-line wafer processing data. In-line data is information such as equipment ID, operator, wafer sequence, lot sequence, thickness/CD, equipment clean frequency or any other measurable and recordable event that occurs during the manufacturing process. When clear correlations are found between the post fab probe and in-line data, redirection of product flow or some type of corrective action needs to be considered. This method of continuous process control driven by electrical correlation to in-line manufacturing events drives up the yield and improves a companies time to market and profit metrics.