Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)最新文献_第3页

Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board 无流底填充材料吸湿性及其对阻焊FR4印制板界面附着力的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916597

T. P. Ferguson, J. Qu

{"title":"Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board","authors":"T. P. Ferguson, J. Qu","doi":"10.1109/ISAOM.2001.916597","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916597","url":null,"abstract":"Interfacial delamination of underfill from both chip and substrate is a prevalent failure mechanism in microelectronic packaging. Of particular interest is the role moisture plays in package interfacial adhesion. In this paper, the effect of moisture on the interfacial adhesion of two no-flow underfill materials with commercially available solder mask coated FR4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85/spl deg/C/85%RH for 725 hours. In addition, a one dimensional diffusion model was developed to estimate the time at which the moisture first penetrated the interface. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture and that amine functional groups considerably retard moisture penetration through underfill encapsulants.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126672098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15

The mass transfer in Al film during local anodic oxidation investigation 局部阳极氧化过程中铝膜的传质研究

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916588

V.K. Moskvichev, V.N. Parqun, I.A. Vrublevsky

{"title":"The mass transfer in Al film during local anodic oxidation investigation","authors":"V.K. Moskvichev, V.N. Parqun, I.A. Vrublevsky","doi":"10.1109/ISAOM.2001.916588","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916588","url":null,"abstract":"Mechanical stresses in aluminium thin films arise during electrochemical oxidation. In this case, there are structural stresses in aluminium films caused by the change of specific volume as a result of aluminium structural transformations into anodic oxide. The mechanical stresses in the thin films can be measured by optical interferometry, X-ray diffraction (Malhorta et al., 1997) or laser scanning (Gardner and Flinn, 1988). However, these methods can be used for measuring mechanical stresses only in the field of elastic deformation. The relative softness of aluminium can result in plastic deformation, and Al film plastic deformation results in mass transfer. The main role in the mass transfer is played by slip and creeping dislocation mechanisms with partial stress relaxation (Koleshko et al., 1987; Marieb et al., 1994). The plastic deformation in Al films can be measured by an X-ray method, but usage of this X-ray method does not yield complete representation of the mass transfer as a result of plastic deformation in the film. The main goal of this paper was examination of mass transfer in aluminium films during local area anodization. The plastic deformation arises due to an edge effect of lateral anodization of aluminium under a mask (Surganov and Mozalev, 1997).","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114069532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The effect of toughening of no-flow underfill on fillet cracking of flip-chip device 无流底填料增韧对倒装装置圆角开裂的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916598

K. Moon, L. Fan, C. Wong

{"title":"The effect of toughening of no-flow underfill on fillet cracking of flip-chip device","authors":"K. Moon, L. Fan, C. Wong","doi":"10.1109/ISAOM.2001.916598","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916598","url":null,"abstract":"The effect of toughening agents and modification of epoxy on fillet cracking was investigated. Nylon, polycarbonate (PC) and polysiloxanes with amine and epoxy functional groups were employed as the toughening agents. Nylon and PC were miscible and reacted with epoxy resin, and a homogenous phase was found. However, Nylon and PC were ineffective in enhancing the anti-fillet cracking properties of the no-flow underfill. In the case where the epoxy was modified with polysiloxanes, a second phase with fine particle size was formed and the particle size depended on the toughening agent. The morphology was observed by scanning electron microscopy (SEM) and confirmed by dynamic mechanical analysis (DMA) measurement. The physical properties such as the fracture toughness, flexural modulus, coefficient of thermal expansion (CTE), and adhesion were measured and liquid-liquid thermal shock (LLTS) tests in the -55/spl sim/125/spl deg/C range were performed with different formulations. One of the formulations toughened by amine/epoxy terminated polysiloxane, which has higher die shear strength, lower modulus, and higher toughness, passed 1000 cycles of the LLTS test. As such, in order to obtain highly reliable no-flow underfill, the physical properties of the no-flow underfill should be well controlled and balanced. Finally, correlation between physical properties of no-flow underfill and anti-fillet cracking capability for these approaches was discussed.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121030091","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders 含铅和无铅焊料的热机械性能和蠕变变形

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916562

A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J. Otto, G. Mitic

{"title":"Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders","authors":"A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J. Otto, G. Mitic","doi":"10.1109/ISAOM.2001.916562","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916562","url":null,"abstract":"For a long time, both high Pb-Sn and eutectic 63Sn-37Pb have been the suitable materials for the interconnection of electronic components because of their low cost and appropriate physical properties. Due to environmental awareness and health hazards caused by lead in the solders, large efforts have been made to develop a lead-free soldering technology. Among the large variety of lead-free solders, the Sn-Ag alloys are expected to be the best candidates. Furthermore, from a reliability point of view, there has been interest in the improved thermal fatigue resistance of solder interconnects. Therefore, in this study two lead-free solder alloys (Sn96.5Ag3.5, Sn95.5Ag3.8Cu0.7) and one lead-containing solder alloy (Sn59Pb40Ag1) were investigated and compared with each other in order to give an estimation of the creep resistance of the lead-free solders. These investigations were focused on mechanical and physical properties (coefficient of thermal expansion, Young's modulus) as well as on the microstructural appearance of the solder. The mechanical and thermomechanical behavior of the solders was examined by TMA, DMA, and creep tests.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131848189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 77

Integrated "turn-key" flip chip capability in assembly subcontracting 集成“交钥匙”倒装芯片能力组装分包

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916572

P. Kim, C. Berry, P. Mescher, L. Thompson, R. Groover

引用次数: 0

Development of no-flow underfill based on non-anhydride curing system 基于非酸酐固化体系的无流底填料研制

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916584

Zhuqing Zhang, L. Fan, C. Wong

引用次数: 0

An alternative to epoxy resin for application in isotropically conductive adhesive 一种用于各向同性导电胶粘剂的环氧树脂替代品

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916541

S. Liong, C. Wong

{"title":"An alternative to epoxy resin for application in isotropically conductive adhesive","authors":"S. Liong, C. Wong","doi":"10.1109/ISAOM.2001.916541","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916541","url":null,"abstract":"Isotropically conductive adhesive formulations predominantly include epoxy resin as the polymer matrix. Although epoxy has superior adhesion capability, it has a tendency to absorb moisture and is nonreworkable. The presence of water in ICA interconnects causes contact resistance degradation by means of galvanic corrosion. In this study, an alternative polymer matrix with low moisture absorption and potential for reworkability, is used in isotropically conductive adhesive (ICA) formulation. The contact resistance of this group of ICAs is measured throughout an accelerated aging process (85/spl deg/C/85%RH). The four point probe method is used to measure contact resistance on test coupons. Contact resistance stability of the ICAs is compared among test coupons of various surface finishes (OSP, Sn/Pb, Sn, and Ni/Au). SEM analyses are conducted on cross sections of coupons that fail early in the aging process and they are compared with coupons with stable resistance. Adhesion capability of this alternative polymer is compared with epoxy on various surfaces, e.g. OSP, Sn/Pb, Sn, and Ni/Au, using a die shear tester. Coupling agents are incorporated into the ICA formulations and their effects on adhesion and contact resistance stability are studied. Blends of epoxy and this alternative polymer are also evaluated. Contact resistance measurements of a thermoplastic-thermoset ICA blend are collected throughout the aging process. Adhesion data of the ICA blend is also collected using a die shear tester. Such a blend should produce a formulation with good adhesion and low moisture uptake, which will be verified by the experimental results.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124602049","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Effects of temperatures above the glass transition on properties of plastic encapsulant materials 玻璃化以上温度对塑料封装材料性能的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916549

R. Lowry, K. L. Hanley, R. Berriche

引用次数: 6

Application of flow microcalorimetry to develop underfill resins 应用流动微量热仪开发填充底层树脂

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916606

R. Pearson, D. Welsh, R. Oldak, B. J. McAdams

引用次数: 0

Rapid laser-beam reflowing of Pb-free solder foils 无铅焊锡箔的快速激光束回流

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916564

F. Herbert, Lutz Dorn, S. Shrestha

引用次数: 2