基于非酸酐固化体系的无流底填料研制

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916584

Zhuqing Zhang, L. Fan, C. Wong

{"title":"基于非酸酐固化体系的无流底填料研制","authors":"Zhuqing Zhang, L. Fan, C. Wong","doi":"10.1109/ISAOM.2001.916584","DOIUrl":null,"url":null,"abstract":"Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using a nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties and reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with nonanhydride underfill shows high reliability during the thermal shock test. Using an appropriate fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Development of no-flow underfill based on non-anhydride curing system\",\"authors\":\"Zhuqing Zhang, L. Fan, C. Wong\",\"doi\":\"10.1109/ISAOM.2001.916584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using a nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties and reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with nonanhydride underfill shows high reliability during the thermal shock test. Using an appropriate fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.\",\"PeriodicalId\":321904,\"journal\":{\"name\":\"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)\",\"volume\":\"70 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAOM.2001.916584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAOM.2001.916584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

大多数无流底填料是基于环氧/酸酐化学。由于酸酐的增敏性，酸酐的使用受到限制，因此需要使用非酸酐固化体系进行无流底填料。介绍了基于环氧/酚醛树脂体系的新型无流底填料的研制。对不同结构的环氧树脂和酚醛树脂的固化性能、热机械性能和可靠性进行了评价。与酸酐固化的环氧树脂相比，环氧/酚醛树脂具有高附着力、高断裂韧性、低交联密度和高粘度的特点。在热冲击试验中，非酸酐下填料组合具有较高的可靠性。采用合适的助熔剂，研制了基于环氧/酚醛体系的无流底填料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Development of no-flow underfill based on non-anhydride curing system

Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using a nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties and reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with nonanhydride underfill shows high reliability during the thermal shock test. Using an appropriate fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

自引率

0.00%

发文量