Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916597

T. P. Ferguson, J. Qu

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引用次数: 15

Abstract

Interfacial delamination of underfill from both chip and substrate is a prevalent failure mechanism in microelectronic packaging. Of particular interest is the role moisture plays in package interfacial adhesion. In this paper, the effect of moisture on the interfacial adhesion of two no-flow underfill materials with commercially available solder mask coated FR4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85/spl deg/C/85%RH for 725 hours. In addition, a one dimensional diffusion model was developed to estimate the time at which the moisture first penetrated the interface. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture and that amine functional groups considerably retard moisture penetration through underfill encapsulants.

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无流底填充材料吸湿性及其对阻焊FR4印制板界面附着力的影响

在微电子封装中，衬底和芯片的界面分层是一种常见的失效机制。特别令人感兴趣的是水分在封装界面粘附中的作用。本文通过实验确定了湿度对两种无流动底填材料与市售阻焊膜涂覆的FR4板的界面附着力的影响。采用带预制界面裂纹的双层试样进行四点弯曲试验，量化界面断裂韧性。构建了两组不同下填层厚度的试件。第一组完全干燥，另一组在85/spl℃/85%RH条件下进行水分预处理725小时。此外，还建立了一维扩散模型来估计水分首次渗透界面的时间。研究结果表明，水分的存在对界面韧性有显著影响，胺官能团显著地延缓了水分在填充填料中的渗透。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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