Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)最新文献_第2页

Fundamental study on moisture absorption in epoxy for electronic application 电子用环氧树脂吸湿性能的基础研究

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916591

S. Luo, C. Wong, J. Leisen

引用次数: 8

Environmental influence on adhesion of underfill with passivation materials 环境对钝化材料下填料附着力的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916593

S. Luo, C. Wong

{"title":"Environmental influence on adhesion of underfill with passivation materials","authors":"S. Luo, C. Wong","doi":"10.1109/ISAOM.2001.916593","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916593","url":null,"abstract":"The environmental influence on adhesion of underfill to passivation materials for flip chip packaging is discussed in this paper. Thermal cycling between -55/spl deg/C and 125/spl deg/C does not significantly affect the adhesion strength. Adhesion strength of underfill material decreases with the increase of test temperature above room temperature due to the decrease of modulus of the underfill. The sharp decrease in adhesion strength occurs at a temperature approaching and below the glass transition temperature of underfill material. The adhesion degradation after aging in a high temperature and high humidity environment is dependent on the hydrophilicity of the passivation material. Hydrophilic passivation, such as SiO/sub 2/ and Si/sub 3/N/sub 4/, shows much more severe adhesion degradation than hydrophobic passivation, such as benzocyclobutene and polyimide. It is demonstrated that the adhesion stability for hydrophilic passivation can be successfully improved by use of a coupling agent such as silane that introduces stable chemical bonding at the interface. The adhesion degradation process during aging in an 85/spl deg/C 85% chamber is slower than moisture diffusion.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"2010 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114467625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

No-clean assembly process conditions-effects on flip-chip/underfill reliability 非清洁装配工艺条件-对倒装芯片/底填可靠性的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916546

M. Todd, K. Costello

{"title":"No-clean assembly process conditions-effects on flip-chip/underfill reliability","authors":"M. Todd, K. Costello","doi":"10.1109/ISAOM.2001.916546","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916546","url":null,"abstract":"No-clean flux chemistries are gaining acceptance in many high volume SMT manufacturing processes worldwide. These materials offer advantages in manufacturing efficiencies by reducing overall manufacturing cycle time and reducing in-process inventories. The use of no-clean flux materials also eliminates potential environmentally dangerous cleaning solvents from the manufacturing environment (McCurdie, 2000). Dozens of no-clean flux formulations are now available from leading manufacturers based on both natural and synthetic chemistries. The impact of these materials, however, on product reliability must be assessed prior to acceptance. No-clean flux residues have been shown to affect, for example, the physical properties of epoxy underfill materials (Bacher and Kirkpatrick, 1999) as well as the long-term reliability characteristics of flip-chip assemblies (Todd, 2000). A series of experiments was conducted to identify the effects of key manufacturing process variable changes on the performance of flip chip underfill materials in a no-clean flux flip-chip assembly. The manufacturing process variables evaluated were: no-clean flux chemistry type; reflow profile; underfill dispense temperature.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114480010","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A new approach in the development of no-flow underfill materials for both eutectic and lead-free solders with high melting temperature 为高熔点共晶和无铅焊料的无流底填材料的开发提供了新途径

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916586

Haiying Li, C. Wong

{"title":"A new approach in the development of no-flow underfill materials for both eutectic and lead-free solders with high melting temperature","authors":"Haiying Li, C. Wong","doi":"10.1109/ISAOM.2001.916586","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916586","url":null,"abstract":"No-flow underfill technology has been drawing attention due to its potential advantages over conventional underfill technology and several no-flow underfill materials have been developed and reported. However, most of these materials are unsuitable for lead-free solder applications that usually have higher melting temperatures than eutectic solder. Due to increasing environmental concerns, demand for friendly lead-free solders has increased. This paper demonstrates the study of two new formulas of no-flow underfill developed for lead-free solders with melting point around 220/spl deg/C. These novel formulas use a liquid curing catalyst to provide ease in preparation of the no-flow underfill materials and more choice in combining fluxing agents. In this study, the curing kinetics, glass transition temperature (T/sub g/), thermal expansion coefficient (TCE), storage modulus (E') and loss modulus (E\") of these materials were studied with differential scanning calorimetry (DSC), thermo-mechanical analysis (TMA), and dynamic-mechanical analysis (DMA). The pot-life in terms of viscosity of these materials was characterized with a stress rheometer. The adhesive strength of the material on the surface of silicon chip was studied with a die-shear instrument. The materials curing kinetics were studied with DSC. The materials compatibility to the solder penetration and wetting on copper clad during solder reflow was investigated with both eutectic and no-lead solders on copper laminated FR-4 organic boards and heated in a reflow oven.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114745464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The depletion/wetting of the low melting point alloy in electrically conductive adhesives (ECAs) 导电胶粘剂(ECAs)中低熔点合金的损耗/润湿

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916595

Jiali Wu, K. Moon, C. Wong

{"title":"The depletion/wetting of the low melting point alloy in electrically conductive adhesives (ECAs)","authors":"Jiali Wu, K. Moon, C. Wong","doi":"10.1109/ISAOM.2001.916595","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916595","url":null,"abstract":"With the driving force of \"green\" revolution in electronics industry, tremendous efforts have been put into looking for lead-free alternatives. Although lead-free alloys draw a lot of attention, their parasitic weaknesses, such as high processing temperature and surface tension, limit their application on thermally sensitive, flexible, nonsolderable substrates and ultra-fine pitch size flip chip interconnection. Conventional electrically conductive adhesives (ECAs) have been widely used in surface mount and die-attach technologies for electrical interconnection and heat dissipation. The low processing temperature of ECAs is one of the major advantages over lead-free solders, which brings low system stress, simple manufacturing processes, etc. In order to improve the contact resistance of ECAs, a low melting point alloy (LMA) incorporation technology has been developed by our group. In this paper, the research thrust was concentrated on the LMA depletion method, since re-melting LMA in ECAs can adversely affect the physical properties. A differential scanning calorimeter (DSC) was used for the basic examination of the depletion rate of LMAs in typical ECAs. Cross-sectional morphology, LMA distribution and intermetallic compounds were investigated by scanning electron microscopy.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123950259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Fluxless bump reflow using carboxylic acid 羧酸无助熔剂凹凸回流

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916563

H. Matsuki, H. Matsui, E. Watanabe

引用次数: 13

Ultra-HDI with low cost photo-imageable polymers 具有低成本光成像聚合物的超hdi

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916567

Fuhan Liu, V. Sundaram, G. White, D. Sutter, R. Tummala

{"title":"Ultra-HDI with low cost photo-imageable polymers","authors":"Fuhan Liu, V. Sundaram, G. White, D. Sutter, R. Tummala","doi":"10.1109/ISAOM.2001.916567","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916567","url":null,"abstract":"As IC devices continue to drive to finer and finer feature sizes, so must the packaging to support them. High-density-interconnects (HDI) fabricated on low cost organic laminates is widely regarded as a critical enabler for device and wafer level packaging. System-on-a-package (SOP) is rapidly being accepted as the future means by which ICs and other components will be packaged. However, if SOP is to be successful, low cost materials and processes must be optimized to reliably yield fine line structures. The PRC has been working to meet a number of challenges that confront the successful implementation of SOP. One of those challenges manifests itself in the area of fine line lithography. Here, low cost photoresists and photo-imageable polymer materials are being evaluated. In addition, processes to support these materials must be optimized for developing ultra fine line HDI substrates. Line widths and spaces of 10-15 /spl mu/m and microvia diameters of 25-50 /spl mu/m have been achieved on large area organic laminates. This paper discusses a number of critical process and material issues that may affect the integrity of fine line and microvia formation.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129613624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Effect of underfill on BGA reliability 下填土对BGA可靠性的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916601

James Pyland, R. Pucha, S. Sitaraman

引用次数: 5

A transient thermal analysis using a simplified heat transfer coefficient model 基于简化传热系数模型的瞬态热分析

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916603

T. Asghari

{"title":"A transient thermal analysis using a simplified heat transfer coefficient model","authors":"T. Asghari","doi":"10.1109/ISAOM.2001.916603","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916603","url":null,"abstract":"A transient thermal analysis was performed on the Motorola Automotive and Industrial Electronics Group (AIEG) electronic module to determine the maximum temperatures of a bare transistor die during cyclic electrical loading. The Icepak computational fluid dynamics (CFD) software was used to model system level transient thermal behaviour. An initial steady state full CFD model was solved for mass, momentum, and energy based on Navier-Stokes and energy equations using the finite volume method. Heat transfer coefficients were obtained from object surfaces in contact with the convective fluid and plotted as a linear function of wall temperature for various power dissipation levels. A model with a reduced meshed region of 1/6 of the full CFD model was developed. This model incorporates heat transfer coefficients, determined from full CFD steady state runs at various power dissipation levels, as boundary conditions on the walls of the computational domain coincident to the outer surfaces of the solid model and solves only for the energy equation. The heat transfer coefficient is input as a linear function of the wall temperature. The simplified heat transfer coefficient model can be accurately used to solve transient thermal analysis problems for various duty cycles. It reduces computation time by a factor of 10 relative to the full CFD model.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130139407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Study on self-alignment capability of electrically conductive adhesives (ECAs) for flip-chip application 倒装用导电胶粘剂的自对准性能研究

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916599

K. Moon, Jiali Wu, C. Wong

{"title":"Study on self-alignment capability of electrically conductive adhesives (ECAs) for flip-chip application","authors":"K. Moon, Jiali Wu, C. Wong","doi":"10.1109/ISAOM.2001.916599","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916599","url":null,"abstract":"This study is focused on a feasibility study of the self-alignment capability of electrically conductive adhesives (ECAs) for flip-chip interconnection applications. The effect of the low melting point alloy (LMA) filler on the self-alignment capability of ECAs was investigated. The surface energy of the epoxy resin was studied in terms of the various additives and their loading level by using a goniometer with a built-in environmental chamber. The curing profile of the epoxy resin and the melting point of the LMA filler were measured using a differential scanning calorimeter (DSC). The ECAs filled with the LMA over 85 wt% showed self-alignment during the heating process. However, when the silver flakes were added into the ECA formulation, the self-alignment did not take place. It is thought that the LMA filler depleted into the silver flakes can adversely affect the self-alignment of ECAs. The key parameters required for self-alignment capability of ECAs were presented. This paper discusses the feasibility of the application of ECA with self-alignment capability for flip-chip interconnection. Initial results from these series studies indicate that incorporation of the LMA into ECAs is an efficient way to make ECAs with self-alignment capability.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130775956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7