Effect of underfill on BGA reliability

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916601

James Pyland, R. Pucha, S. Sitaraman

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引用次数: 5

Abstract

The effect of underfill on various thermomechanical reliability issues in SBGA (super ball grid array) packages is studied in this paper. Nonlinear finite element models with underfill and no underfill have been developed, taking into consideration the process-induced residual stresses. In this study, the solder is modeled as time and temperature-dependent, while other materials are modeled temperature and direction-dependent, as appropriate. The stress/strain variations in solder joints due to thermal cycling are analyzed. The effect of underfill is studied with respect to magnitude and location of time-independent plastic strain, time-dependent creep strain and total inelastic strain in solder balls. The possibility of delamination at the interposer-underfill interface as well as board-underfill interface is studied with the help of qualitative interfacial stress analysis. Results on SBGA packages indicate that the underfill does not always enhance the BGA and that the properties of the underfill have a significant role in the overall reliability of the BGA solder balls.

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下填土对BGA可靠性的影响

本文研究了下填料对超级球栅阵列封装中各种热机械可靠性问题的影响。建立了考虑过程残余应力的有底填和无底填的非线性有限元模型。在本研究中，焊料建模为时间和温度相关，而其他材料建模为温度和方向相关，视情况而定。分析了热循环对焊点应力应变的影响。研究了下填体对锡球中随时间变化的塑性应变、随时间变化的蠕变应变和总非弹性应变的大小和位置的影响。采用定性界面应力分析方法，研究了夹层-下填料界面及底板-下填料界面发生分层的可能性。对SBGA封装的研究结果表明，下填料并不一定能提高BGA，下填料的性能对BGA焊球的整体可靠性有重要影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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