无铅焊锡箔的快速激光束回流

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916564

F. Herbert, Lutz Dorn, S. Shrestha

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引用次数: 2

摘要

对焊料和焊接接头的机械、热学和电气特性提出了不同的要求。这是由于新的操作领域以及高达200/spl度/C的加工温度。新开发和分析的无铅焊料具有广泛的熔化范围，满足了确保更高强度和疲劳稳定性以及更好的润湿性能的迫切要求。激光加工实验的目的是通过快速激光束回流的创新无铅焊料，通过细化晶粒来延长微焊点和金属化系统的质量。实验测试了回流焊箔的结构、抗剪强度和焊点的特定扩散现象。

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Rapid laser-beam reflowing of Pb-free solder foils

Different demands are claimed concerning the mechanical, thermal, and electrical characteristics of solders and soldered joints. This is due to new operation fields together with processing temperatures up to 200/spl deg/C. New development and analysis of Pb-free solders with a widespread melting range complies with acute requirements to ensure higher strength and fatigue stability as well as better wetting performance. The aim of the laser-beam processing experiments was to extend the quality of micro soldered joints and metallization systems through grain refining by rapid laser-beam reflow of innovative Pb-free solders. The experimental tests included the structure of the reflowed solder foil, the shear strength and specific diffusion phenomena of soldered joints.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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