Design, Test, Integration, and Packaging of MEMS/MOEMS最新文献_第4页

Packaged bulk micromachined resonant force sensor for high-temperature applications 用于高温应用的封装体微机械谐振力传感器

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382278

M. Haueis, J. Dual, C. Cavalloni, M. Gnielka, R. Buser

引用次数: 3

Photovoltaic miniarrays assembled using multichip module technology (MCM) 采用多芯片模块技术(MCM)组装的光伏微型阵列

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382285

P. R. Ortega, L. Castañer

引用次数: 2

Acoustic and magnetic MEMS components for a hearing aid instrument 助听器用声学和磁性MEMS元件

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382273

S. Chowdhury, G. Jullien, M. Ahmadi, W. Miller, D. Keating, N. Finch

{"title":"Acoustic and magnetic MEMS components for a hearing aid instrument","authors":"S. Chowdhury, G. Jullien, M. Ahmadi, W. Miller, D. Keating, N. Finch","doi":"10.1117/12.382273","DOIUrl":"https://doi.org/10.1117/12.382273","url":null,"abstract":"The design of two microelectromechanical (MEMS) devices that form pat of a micro acousto-magnetic transducer for use with a hearing-aid instrument is described in this paper. The transducer will convert acoustical energy into an electrical signal using a MEMS realization of a capacitive microphone. The output signal from the microphone undergoes signal conditioning and processing in order to drive a MEMS electromagnetic actuator. The resultant magnetic fid is used to exert a force on a high coercivity permanent micro magnet that has been implanted on the round window of the cochlea. The motion of the implanted magnet will develop traveling waves on the basilar membrane inside the cochlea to give a hearing capability. A high-sensitivity MEMS based capacitor microphone is designed using a polysilicon Germanium diaphragm. The microphone is constructed using a combination of surface and bulk micro machining techniques, in a single wafer process. The microphone diaphragm has a proposed thickness of 0.7 micrometers , an area of 2.6 mm2, an air gap of 3.0 micrometers and a 1 micrometers thick silicon nitride backplate with acoustical ports. An output voltage signal is obtained from the capacitor microphone using a capacitive voltage divider network and amplified by a simple source follower circuit. D","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126501013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Signal processing electronics for a capacitive microsensor 电容式微传感器的信号处理电子学

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382282

G. Amendola, G. Lu

引用次数: 6

Evaluation of the orientation of thermal deformation in the surface-micromachined membrane of gas microsensors 气体微传感器表面微加工膜热变形取向的评价

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382314

Marius Dumitrescu, C. Cobianu, A. Pascu

{"title":"Evaluation of the orientation of thermal deformation in the surface-micromachined membrane of gas microsensors","authors":"Marius Dumitrescu, C. Cobianu, A. Pascu","doi":"10.1117/12.382314","DOIUrl":"https://doi.org/10.1117/12.382314","url":null,"abstract":"Within this paper we perform a simulation study of the 'bimetal' effects for the silicon-silicon dioxide membrane suspended in different manners. For this purpose, a commercial, COSMOS/M program working with finite element method has been used. We investigated the dependence of the value and orientation of the displacements of the bi-layer type membrane as a function of temperature, temperature gradient, geometrical dimensions, expansion coefficients and type of membrane support. The test structure for this simulation consists of a square SiO2 membrane of 100 X 100 micrometers 2 with 10micrometers for each layer. The connection of the membrane to the bulk silicon was performed by different manners as follows: (i) by four horizontal bridges, (ii) by four vertical legs or (iii) by its four edges. From simulation study, we have obtained the effect of the above variables on the value and orientation of the membrane deformation, as follows: a) The temperature and gradient temperature, layer thickness and rigidity of the material lead to modification of the value displacements of the membrane; b) Type of the membrane support lead to modification of the both value and orientation of t he deformation of the membrane. This study of the membrane deformation can be successfully used for designing a new gas structure based on surface micro machining and hopefully with low power consumption and predicted deformation.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"167 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134232935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced flip chip technologies in rf, microwave, and MEMS applications 先进的倒装芯片技术在射频，微波和MEMS应用

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382326

H. Oppermann, C. Kallmayer, M. Klein, R. Aschenbrenner, H. Reichl

{"title":"Advanced flip chip technologies in rf, microwave, and MEMS applications","authors":"H. Oppermann, C. Kallmayer, M. Klein, R. Aschenbrenner, H. Reichl","doi":"10.1117/12.382326","DOIUrl":"https://doi.org/10.1117/12.382326","url":null,"abstract":"A variety of flip chip technologies are available today which differ in bumping material, substrate type, pad metallization and joining method. They are found in packages as well as on multichip modules and directly flip chip bonded on the board. Components including flip chip like bal grid arrays and chip size packages are introduced. Flip chip is the most favored assembly technology for high frequency applications due to the small parasitic of the short bump interconnect. High performance packages for optoelectronic devices using self-alignment during a fluxless reflow soldering are shown as well as the integration of MMICs. High density multichip modules have been fabricated for large pixel defectors of a nuclear detector with eight Chips and more than 46000 I/Os with an acceptable yield. Flip chip technology is a very flexible assembly method for different applications. Variations of the bump structure can be used for MEMS packaging as well and it was demonstrated by the assembly of a thin membrane to form an absolute pressure sensor with a vacuum enclosure. For different packaging requirements the appropriate technology should be chosen very carefully. An overview will be given for different bumping and flip chip joining methods suitable for high volume production as well as for prototyping. Wafer bumping methods will focus on electro less deposition of nickel/gold as well as on electroplating of gold, SnPb and AuSn solders. For rapid prototyping single chip bumping methods are described. Examples of different joining methods - soldering, adhesive bonding and thermocompression bonding - will be shown.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129386029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Robust and versatile software system for optimal design of MEMS structures 稳健、通用的微机电系统结构优化设计软件系统

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382290

B. Kwak, S. H. Lee, J. Huh

{"title":"Robust and versatile software system for optimal design of MEMS structures","authors":"B. Kwak, S. H. Lee, J. Huh","doi":"10.1117/12.382290","DOIUrl":"https://doi.org/10.1117/12.382290","url":null,"abstract":"A CAD-integrated total design system for MEMS is developed which can perform analysis and design for mechanical performance of a MEMS structure. The software works in a parametric CAD platform and makes users to do from CAD modeling and analysis to design optimization. Basic philosophy is to assure robustness, versatility and user friendliness. To satisfy these requirements; 1) Design variables are selectable directly form CAD model, 2) Commercial codes are utilized as many as available, and 3) Design sensitivity analysis must be simple and robust. Commercial finite element codes and some newly developed modules are integrated in the system for analysis. For design sensitivity analysis, two approaches were implemented: finite difference method and the Taguchi method. The approximate methods adopted seem to be simple and robust, which can be applied to design of complex practical structures. The design sensitivity analysis by finite difference method, with nonlinear programming and trade-off study, gives satisfactory results. The Taguchi method module is integrated for robust optimal design of MEMS structure. Although it is not meant to find the exact optimum point, it is applicable to practical problems where performance characteristics are hard to evaluate, since this does not require any derivative information. Two examples are taken to examine performance of the developed design tool and proposed methodology. It relieves much of the difficulties often met in conventional design works and has shown practicability for structural design of MEMS.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130937392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

New ultrathin 3D integration technique: technological and thermal investigations 超薄三维集成新技术:工艺与热研究

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382262

S. Pinel, J. Tasselli, A. Marty, J. Bailbé, E. Beyne, R. Van Hoof, S. Marco, S. Leseduarte, O. Vendier, A. Coello-Vera

引用次数: 5

Technical comparison of micro-electrodischarge machining, microdrilling, and copper vapor laser machining for the fabrication of ink jet nozzles 微电火花加工、微钻孔加工和铜蒸气激光加工制造喷墨喷嘴的技术比较

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382322

D. Allen, H. Almond, Peter Logan

引用次数: 25

High-thermal-impedance beams for suspended MEMS 用于悬浮式MEMS的高热阻抗波束

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382266

S. Mir, B. Charlot, F. Parrain, D. Veychard

引用次数: 2