{"title":"International frequency sensor association (IFSA): goals and activities","authors":"S. Yurish","doi":"10.1117/12.382308","DOIUrl":"https://doi.org/10.1117/12.382308","url":null,"abstract":"International Frequency Sensor Association (IFSA) is non- profit association, create din 1999 year with the aim to promote research, development, production and application of modern sensor with frequency or digital output throughout worldwide, thus preparing industries for the world market in this promising field. This objective can be achieved by both simulating the information exchange and dissemination through the Internet, and the creation of strong links between industry and research. Presently, IFSA comprises 48 percent industry members and 52 percent academia members form 16 European and Asian countries and USA. This paper describes the IFSA and gives an overview of its specific activities.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127607387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Scheduling MEMS manufacturing","authors":"Lixin Wang, F. Tay, L. Lee","doi":"10.1117/12.382293","DOIUrl":"https://doi.org/10.1117/12.382293","url":null,"abstract":"This paper focuses on the production scheduling in MEMS manufacturing. The whole MEMS production process can be broken into 3 sub-processes, i.e., the front-end process, the wafer cap process and the back-end process. Every wafer processed by the front end process needs to be bonded with a wafer cap that are manufactured by the wafer cap process, and then it will be sent to the back-end process. Therefore how to synchronize the release of wafers into the front end as well as the wafer cap process becomes an important topic. An ineffective coordination will create larger WHIP and longer cycle time. In this paper, four different synchronization rules are developed and they are evaluated together with seven dispatching rules. The performance measures considered are cycle time, throughput rate and WHIP. A visual interactive simulation model is constructed to imitate the production line. The simulation results indicate that the synchronization rules have more significant impact than the dispatching rules on the performance of MEMS manufacturing.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114637299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Failure of polymer-metal interfaces under hygrothermal loading","authors":"A. Tay, Y. Ma, S. H. Ong","doi":"10.1117/12.382306","DOIUrl":"https://doi.org/10.1117/12.382306","url":null,"abstract":"This paper describes a study of the failure of polymer-metal interfaces in plastic-encapsulated IC packages subjected to hygro-thermal loading during solder reflow. All the analyses performed are under plane strain conditions. A finite element fracture mechanics approach was employed to predict the temperature at which a small delamination in the polymer-metal interface of an IC package will propagate. In order to confirm the accuracy of the above prediction, actual package specimens were fabricated and subjected to various levels of moisture preconditions followed by thermal loading at varying temperatures. The specimens were then examined to determine the temperature at which the interface failed. Good agreement was found between numerical prediction and experiment.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132898591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Hanemann, J. Hausselt, R. Ruprecht, M. Skrifvars, K. Zum Gahr, Wilhelm Pfleging
{"title":"Rapid fabrication of microcomponents","authors":"T. Hanemann, J. Hausselt, R. Ruprecht, M. Skrifvars, K. Zum Gahr, Wilhelm Pfleging","doi":"10.1117/12.382295","DOIUrl":"https://doi.org/10.1117/12.382295","url":null,"abstract":"In the macroscopic world different 'rapid'-technologies like Rapid Prototyping, Rapid Manufacturing or Rapid Tooling have been established for a fast prototype or molding tool development. In all cases CAD-data can be transformed in a model or prototype directly using a laser which polymerizes reactive resin layer by layer to a final 3D mold within a short period. In this work the rapid fabrication of micro components made from polymers or composites will be presented. The whole fabrication process is divided into two main steps: Firstly laser assisted micro machining using Nd:YAG and KrF-Excimer laser allows a rapid manufacturing of micro structured cemented carbide or steel mold inserts. Secondly the application of light induced reaction injection molding using reactive monomer/polymer resins gives access to the replication of the previously fabricated mold insert. The total processing period starting from CAD until the modeled micro structured part is less than one week.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132075590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"3D resolution gray-tone lithography","authors":"N. Dumbravescu","doi":"10.1117/12.382328","DOIUrl":"https://doi.org/10.1117/12.382328","url":null,"abstract":"With the conventional micro machining technologies: isotropic and anisotropic, dry and wet etching, a few shapes can be done. To overcome this limitation, both binary multi- tasking technique or direct EB writing were used, but an inexpensive one-step UV-lithographic method, using a so- called 'gray-tone reticle', seems to be the best choice to produce local intensity modulation during exposure process. Although, by using this method and common technologies in standard IC fabrication it is easy to obtain an arbitrarily 3D shaping of positive thick resists, there are some limitations, too. The maximum number of gray-levels, on projection reticle, achieved by e-beam writing, are only 200. Also, for very thick resists, the limited focus depth of the projection objective gives a poor lateral resolution. These are the reasons why the author prose da new approach to enhance the 3D resolution of gray-tone lithography applied for thick resist. By a high resolution, both for vertical direction, as well as for horizontal direction. Particular emphasis was put on the design, manufacturing and use of halftone transmission masks, required for UV- lithographic step in the fabrication process of mechanical, optical or electronics components. The original design and fabrication method for the gray-tone test reticle were supported by experiments showing the main advantage of this new technology: the 3D structuring of thick resist in a single exposure step and also a very promising aspect ratio obtained of over 9:1. Preliminary experimental results are presented for positive thick resists in SEM micrographs. A future optimization of the lithographic process opens interesting perspectives for application of this high 3D resolution structuring method in the fabrication process of different products, with imposed complex smooth profiles, such as: x-ray LiGA-masks, refractive optics and surface- relief DOEs.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"33 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114008231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
V. Snitka, I. Šimkienė, K. Grigoras, V. Jasutis, K. Naudzius, V. Pačebutas, J. Sabataitytė, V. Mizariene
{"title":"Surface investigation of porous GaAs used for luminescent films","authors":"V. Snitka, I. Šimkienė, K. Grigoras, V. Jasutis, K. Naudzius, V. Pačebutas, J. Sabataitytė, V. Mizariene","doi":"10.1117/12.382323","DOIUrl":"https://doi.org/10.1117/12.382323","url":null,"abstract":"The investigations of photo luminescence spectra of the electrochemically produced porous GaAs layers, excited by continuous Ar laser radiation, were carried out. The chemical composition of the anodized p- and n-GaAs was analyzed by x-ray photoelectron spectroscopy. The GaAs surface morphology was examined by high-resolution transmission-electron microscopy and surface structure was investigated by electronograph EMR100 and Atomic Force Microscopy. It is established that increasing a duration and current density of etching changes the porosity of bulk GaAs and both Galium and arsenic oxides are formed on the sample surface Photo luminescence spectra of investigated porous surface consist of 'IR' and 'green' spectral structures. The 'IR' structure exhibits redshifts of its peak energies, and 'green' structure intensity is dependent on etching conditions. A possible reason of origin and changes in those spectra is discussed.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122433694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Mathematical modeling on the quadrature error of low-rate microgyroscope for aerospace applications","authors":"B. Y. Yeh, Yung C. Liang, F. Tay","doi":"10.1117/12.382274","DOIUrl":"https://doi.org/10.1117/12.382274","url":null,"abstract":"This paper reports on the mathematical modeling on the quadrature error of a micro gyroscope due to the imbalance of the flexures. Quadrature error occurs when the proof mass of a micro gyroscope oscillates along an axis that is not exactly parallel to the X-axis. The asymmetric spring flexures due to manufacturing variation can cause the proof mass to rotate when a force acts on the proof mass. The mathematical mode is verified using finite element software, Intellicad and found to have a good agreement with the simulation results for angles of rotation of comb fingers below 5.26 degrees. The mathematical model provides a new avenue of approach in solving the quadrature error problem and in saving the overall simulation time. The spring constant of the fishhook flexure can be calculated form Castigliano's energy theorem and substituted into the mathematical mode to find out the size of the quadrature error. The sensitivity of a fishhook flexure to its dimensions is analyzed.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128589261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"THERMODEL: a tool for thermal model generation and application for MEMS packages","authors":"V. Székely, M. Rencz, A. Poppe, B. Courtois","doi":"10.1117/12.382288","DOIUrl":"https://doi.org/10.1117/12.382288","url":null,"abstract":"This paper present a tool and a method for the generation of reduce order thermal models, in order to assure modeling the effect of the package on the thermal behavior of the packaged device. The method is generic, and can be based either on the simulated or on the measured thermal transient response of the real packages. It is based on the generation of the time constant density spectrum of the thermal response function, from which we automatically generate a reduced order thermal model in the form of an RC ladder network model. Beyond presenting the generic methodology experimental results are also presented, based both on the simulation and measurement of MEMS elements and packages.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128713248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Array of niobium nanotips formed in porous anodic alumina matrix","authors":"V. Surganov, G. Gorokh","doi":"10.1117/12.382321","DOIUrl":"https://doi.org/10.1117/12.382321","url":null,"abstract":"New fabrication method of nanoscale regular tips for vacuum microelectronics basing on electrochemical anodizing double- layer systems aluminum-niobium in aqueous acid electrolyte has been developed. This method allows providing very small overall emitted size and high uniform packaging densities without lithography and etching technique. Electron field emission from array of niobium nanotips formed in porous anodic alumina matrix has been investigated.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130090563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Starodub, Igor P. Goraychuk, V. M. Starodub, V. V. Il’chenko, G. V. Kuznetsov
{"title":"Application of a new electrometric approach to study interaction between biological molecules","authors":"N. Starodub, Igor P. Goraychuk, V. M. Starodub, V. V. Il’chenko, G. V. Kuznetsov","doi":"10.1117/12.382319","DOIUrl":"https://doi.org/10.1117/12.382319","url":null,"abstract":"In the paper the results about changes of the current- voltage characteristics of the surface-barrier structures (SBS) after the deposition of myoglobin and its specific monoclonal antibodies are presented. It was shown that the SBS structures with ultra-thin films or with ultra-thin layer of the porous silicon are sensitive to the presence of the protein or its specific immune complex on their surfaces. The response of the system depended on the conditions of the specific complex formation. The characteristic optimum of the thickness of Ni film or the layer of the porous silicon was revealed when the changes of the I-V characteristics had a maximum level.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"271 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124392194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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