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Design, Test, Integration, and Packaging of MEMS/MOEMS最新文献

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Anodic oxidation in polysilicon microactuators 多晶硅微致动器中的阳极氧化
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382327
P. Voumard, P. Debergh, G. Perregaux, S. Gonseth
{"title":"Anodic oxidation in polysilicon microactuators","authors":"P. Voumard, P. Debergh, G. Perregaux, S. Gonseth","doi":"10.1117/12.382327","DOIUrl":"https://doi.org/10.1117/12.382327","url":null,"abstract":"Many polysilicon devices, like comb-drives, micromotors, valves, accelerometers, micromirrors or microshutters use electrostatic forces for their actuation. Electrostatic forces increases with the square of the inverse of the distance between electrodes. Due to this favorable scaling law, electrostatic actuation is interesting for microsystems.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129656427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Analysis of electromechanical parameters of electrostatic microrelay with a movable elastic cantilever electrode 可动弹性悬臂电极静电微继电器机电参数分析
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382309
G. I. Efremov, N. Mukhurov, A. Galdetskiy
{"title":"Analysis of electromechanical parameters of electrostatic microrelay with a movable elastic cantilever electrode","authors":"G. I. Efremov, N. Mukhurov, A. Galdetskiy","doi":"10.1117/12.382309","DOIUrl":"https://doi.org/10.1117/12.382309","url":null,"abstract":"Literature provides a sufficient body of information on developments of electrostatic micro relays (EMR) with movable electrode (ME) in the form of a spring cantilever beam. However, little attention has been given to obvious close relationship between required characteristics and the corresponding design solutions of EMR components, which hinders the development of relay constructions optimal for specific working conditions. This paper presents a method for determining values and interrelations of electric and mechanical parameters of EMR's promising for certain applications. Schematically, the EMR consists of a rigid dielectric substrate 1 having a salient part 2 covered with a deposited stationary thin-film electrode (SE) 3 and spring plate 4 upon which a cantilever ME 5 is placed in the area hanging over the salient pat. Contacts 6 of control circuit are located at the electrode ends.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132988636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design, fabrication, and packaging of closed-chamber PCR chips for DNA amplification 用于DNA扩增的封闭室PCR芯片的设计、制造和包装
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382271
C. Schabmueller, A. Evans, A. Brunnschweiler, G. Ensell, D. Leslie, M. A. Lee
{"title":"Design, fabrication, and packaging of closed-chamber PCR chips for DNA amplification","authors":"C. Schabmueller, A. Evans, A. Brunnschweiler, G. Ensell, D. Leslie, M. A. Lee","doi":"10.1117/12.382271","DOIUrl":"https://doi.org/10.1117/12.382271","url":null,"abstract":"This paper reports the design, fabrication and packaging of a micro machined silicon/Pyrex based chip for the polymerase chain reaction. Anodic bonding is used for sealing the chambers of 1 (mu) l volume with a Pyrex glass wafer. Platinum resistors on the back of the wafer are used as heaters and temperature sensors. The chip is externally cooled by forced air to achieve rapid temperature cycling. The transparency of the Pyrex makes it possible for using optical readout methods. The packaging is especially designed for easy handling, filling, power connection, temperature regulation and optical readout. The mass production of such silicon reactors could make single-shot, disposable devices economically viable.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114298688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Microactuated optical MEMS (Abstract Only) 微驱动光学MEMS(仅摘要)
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382261
H. Fujita
{"title":"Microactuated optical MEMS (Abstract Only)","authors":"H. Fujita","doi":"10.1117/12.382261","DOIUrl":"https://doi.org/10.1117/12.382261","url":null,"abstract":"Optical scanners and switches are presented as examples of microactuated optical devices. Also a 3D chip-level packaging technique that is capable of optical, mechanical and electronic connections is discussed.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133769290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of miniature pantograph mechanisms with large deflective hinges for new surface mount systems 新型表面贴装系统用大偏转铰链微型受电弓机构的研制
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382324
M. Horie, T. Uchida, D. Kamiya
{"title":"Development of miniature pantograph mechanisms with large deflective hinges for new surface mount systems","authors":"M. Horie, T. Uchida, D. Kamiya","doi":"10.1117/12.382324","DOIUrl":"https://doi.org/10.1117/12.382324","url":null,"abstract":"In this paper, a new surface mount system with parallel arrangement miniature manipulators is proposed for use in system downsizing. The miniature manipulator consists of a molded pantograph mechanism, which is composed of large deflective hinges and links, both made of the same materials. In order to create such systems, first, durability of the pantograph mechanism is to be confirmed by fatigue tests. Next, the input and output displacement characteristics of the pantograph mechanism are to be experimentally discussed. Finally, propriety of the proposed system should be confirmed.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132797140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
MEMS physical analysis in order to complete experimental results return MEMS物理分析才能完成实验结果的返回
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382299
X. Lafontan, C. Dufaza, G. Perez, F. Pressecq
{"title":"MEMS physical analysis in order to complete experimental results return","authors":"X. Lafontan, C. Dufaza, G. Perez, F. Pressecq","doi":"10.1117/12.382299","DOIUrl":"https://doi.org/10.1117/12.382299","url":null,"abstract":"The emerging MicroElectroMechanical Systems (MEMS) technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses respond to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"188 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121837254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Computational framework for modeling one-dimensional subgrid components and phenomena in multidimensional microsystems 多维微系统中一维子网格组件和现象建模的计算框架
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382311
M. Pindera, S. Bayyuk, V. Upadhya, A. Przekwas
{"title":"Computational framework for modeling one-dimensional subgrid components and phenomena in multidimensional microsystems","authors":"M. Pindera, S. Bayyuk, V. Upadhya, A. Przekwas","doi":"10.1117/12.382311","DOIUrl":"https://doi.org/10.1117/12.382311","url":null,"abstract":"This paper presents a framework for modeling essentially 1D devices and components embedded in multi-dimensional spaces. The main characteristic and main advantage of the new methodology is that the 1D and multi-dimensional objects or domain are meshed completely independently of each other, without regard to their relative alignment or location, and subsequently combined into a single, unified composite mesh. The coupling of the solution between the different domains is handled fully-automatically in the solver, entirely through exchange of source terms between these domains of differing dimensionality. The source terms are evaluated locally on a cell-by-cell basis, depending on the solution values in these domains and the manner in which the 1D grids intersect the multi-dimensional grids. The capabilities and usefulness of the method are demonstrated with several examples.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129238142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
New methodology of work with concurrent engineering in electronic design 电子设计中并行工程工作的新方法
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382312
P. Owezarski, V. Baudin, S. Owezarski, G. Fabre, T. Gayraud, J. Dorkel, P. Tounsi
{"title":"New methodology of work with concurrent engineering in electronic design","authors":"P. Owezarski, V. Baudin, S. Owezarski, G. Fabre, T. Gayraud, J. Dorkel, P. Tounsi","doi":"10.1117/12.382312","DOIUrl":"https://doi.org/10.1117/12.382312","url":null,"abstract":"This paper aims at proposing a new enhanced way of working in electronic design. In fact, the design of an electronic component requires many competencies and skills, and the joint effort of several researchers and engineers, not necessarily located a the same lace. With traditional ways of work and communication tools, the interactivity level is reduced and it seems that the product life cycle cannot be improved significantly anymore. As a response, the technological progress in high speed networks and new communication and interaction tools open the way to concurrent engineering. This paper then aims at presenting such way of working, the new functionalities provided to users, and of course the benefits they can gain. As a case study, an actual example in the domain of electronics design illustrates this paper.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120944266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CAD for integrated MEMS design CAD集成MEMS设计
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382270
T. Mukherjee
{"title":"CAD for integrated MEMS design","authors":"T. Mukherjee","doi":"10.1117/12.382270","DOIUrl":"https://doi.org/10.1117/12.382270","url":null,"abstract":"The long term impact of MEMS technology will be in its ability novel sensing and actuation functionality on traditional computing and communication devices enabling the ubiquitous digital computer to interact with the world around it. The design of such integrated system will occur at the system level, driven primarily by the application. Methodologies that ease the integration of the digital domain to the real world using mixed domain technologies are therefore crucial. A hierarchical structured design approach that is compatible with standard IC design is outlined. It starts with schematic capture of a design topology, followed by behavioral simulation, layout generation, parasitic extraction, and final verification. This flow is based on a process-independent design representation of commonly used MEMS building blocks, and process-dependent materials properties, design rules, and parasitic parameters.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"284 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114253446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Design and fabrication of a novel thermally actuated vertical bimorph scanner for an integrated AFM 一种用于集成AFM的新型热驱动垂直双晶片扫描仪的设计与制造
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382279
H. Sehr, A. Evans, A. Brunnschweiler, G. Ensell
{"title":"Design and fabrication of a novel thermally actuated vertical bimorph scanner for an integrated AFM","authors":"H. Sehr, A. Evans, A. Brunnschweiler, G. Ensell","doi":"10.1117/12.382279","DOIUrl":"https://doi.org/10.1117/12.382279","url":null,"abstract":"This paper presents the concept and design of a new lateral scanning system for an integrated atomic force microscope (AFM). The core part of the scanner is formed by vertical bimorph beams, which are reported for the first time in this paper. They consist of silicon beams side-coated with aluminium, which bend upon heating causing movement in the horizontal plane. Combining vertical bimorphs with planar bimorphs allows three-dimensional actuation. Theoretical analyses comprising electro-thermal and thermo-eleastic calculations show that large actuation movements are possible at low electrical input power and low input voltage. A process has been developed to deposit aluminium onto sidewalls of silicon beams. Furthermore, the fabrication process for the actuator is described.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130640870","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
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