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Design, Test, Integration, and Packaging of MEMS/MOEMS最新文献

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Coupling of length scales in MEMS modeling: the atomic limit of finite elements MEMS建模中长度尺度的耦合:有限元的原子极限
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382286
R. Rudd
{"title":"Coupling of length scales in MEMS modeling: the atomic limit of finite elements","authors":"R. Rudd","doi":"10.1117/12.382286","DOIUrl":"https://doi.org/10.1117/12.382286","url":null,"abstract":"We discuss concurrent multiscale simulations of the dynamic and temperature-dependent behavior of sub-micron MEMS, especially micro-resonators. The coupling of length scales methodology we have developed employs an atomistic description of small but key regions of the device, consisting of millions of atoms, coupled concurrently to a finite element model of the periphery. This novel technique accurately models the behavior of the mechanical components of MEMS down to the atomic scales. This paper addresses general issues involved in this kind of multiscale simulation, with a particular emphasis on how finite elements can be extended to ensure a reliable model as the mesh spacing is refined to the atomic scale. We discuss how the coupling of length scales technique has been sued to identify atomistic effects in sub-micron resonators.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120892404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Modeling and design of multiple buried junctions detectors for color systems development 颜色系统开发中多个埋结检测器的建模与设计
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382313
A. Alexandre, G. Sou, Mohamed Ben Chouikha, M. Sedjil, G. Lu, G. Alquié
{"title":"Modeling and design of multiple buried junctions detectors for color systems development","authors":"A. Alexandre, G. Sou, Mohamed Ben Chouikha, M. Sedjil, G. Lu, G. Alquié","doi":"10.1117/12.382313","DOIUrl":"https://doi.org/10.1117/12.382313","url":null,"abstract":"Two novel integrated optical detectors called BDJ detector and BTJ detector have been developed in our laboratory. These two detectors have different applications: the BDJ detector elaborated in CMOS process can be used for wavelength or light flux detection while the BTJ detector based on a bipolar structure gives the trichromatics components of a light. To develop microsystems, we need simulation tools as SPICE model. So, we have elaborated a physical mode, proposed a parameters extraction method and study influence of different parameters for BDJ detectors. Simulations and measurements have validated these models. More, we prose a design of BTJ detectors for developing new color imaging systems.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"7 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120974069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Effects of dc and ac bias on the dynamic performance of microresonators 直流偏置和交流偏置对微谐振器动态性能的影响
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382303
F. Tay, R. Kumaran, B. L. Chua, V. Logeeswaran
{"title":"Effects of dc and ac bias on the dynamic performance of microresonators","authors":"F. Tay, R. Kumaran, B. L. Chua, V. Logeeswaran","doi":"10.1117/12.382303","DOIUrl":"https://doi.org/10.1117/12.382303","url":null,"abstract":"It has been observed in many MEMS devices that there is a shift in resonant frequency due to voltage bias. The voltage bias may include either AC or DC bias or both. This paper reports on the significant discrepancy between the analytical and experimental resonant frequencies of folded beam micro resonators. Experimental results for the resonant frequency showed a consistent 20% discrepancy over theoretical and finite element results for MUMPs fabricated resonators. This difference in frequency is also seen in SOl fabricated devices. Possible causes of the discrepancy from tapered cross section of the flexure beams, dimensional variations and electrostatic spring effects are discussed and shown to contribute to the significant difference between analytical and experimental values. Inte11iCADTM electrostatic simulation was done to isolate the electrostatic spring effect and compared with the experimental observations. The compliance due to AC voltage has also been observed in SOl and MUMPs resonators and has been presented.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127232411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Influence of materials selection and quality on ink jet nozzles fabricated by micro-electrodischarge machining 材料选择和质量对微电火花加工喷墨喷嘴的影响
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382302
H. Almond, D. Allen
{"title":"Influence of materials selection and quality on ink jet nozzles fabricated by micro-electrodischarge machining","authors":"H. Almond, D. Allen","doi":"10.1117/12.382302","DOIUrl":"https://doi.org/10.1117/12.382302","url":null,"abstract":"Ink jet nozzles require accurate definition and smooth surface finish to promote laminar flow of ink and prevent turbulence. Recent investigations into micro-electro discharge machining of nozzles in thin stainless steel have shown that surface finish is dependent not only on machining parameters but also on material selection and quality. Defects within the material such as cracks, aligned to the direction of rolling, are a source of random defects within nozzles after machining. They can cause severe problems by acting as sites for ink-flow perturbation and corrosion and thereby cause defective printing. Evaluation of material quality at the microscopic level prior to machining is therefore recommended to avoid a waster of machining-time on sub-standard material and the resultant low yield of acceptable nozzles. Image analysis of a range of materials has shown that some materials examined contained relatively few defects.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"366 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116840408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electromagnetic analysis of the IR sensor focal plane arrays of micro-optics 微光学红外传感器焦平面阵列的电磁分析
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382276
Z. Sikorski
{"title":"Electromagnetic analysis of the IR sensor focal plane arrays of micro-optics","authors":"Z. Sikorski","doi":"10.1117/12.382276","DOIUrl":"https://doi.org/10.1117/12.382276","url":null,"abstract":"Matrices of binary micro-lenses monolithically integrated with the focal-place-arrays (FPA) of longwave IR uncooled detectors can significantly improve sensor's parameters. Surface relief of the binary micro-lenses is built of annular stair step structures of heights and widths smaller than the radiation length. Scalar diffraction theory cannot correctly describe diffraction on these micro-structures and therefore the rigorous electromagnetic theory should be applied. In this aper, we have applied the electromagnetic eignemode method to study binary micro-optics for the longwave IR FPA of 50 micrometers pixel width. We have shown that binary refractive micro-lenses outperform their diffractive counterparts allowing for detectors of 10 micrometers width. The effective refractive micro-lenses require the 8-level surface relief. Geometrical optics predictions of the focal position agree quite well width electromagnetic calculations.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127976465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Scanning micromechanical mirror for fine-pointing units of intersatellite optical links 卫星间光学链路精密指向装置用扫描微机械反射镜
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382277
J. Graeffe, M. Suhonen, H. Sipola, T. Sillanpaa
{"title":"Scanning micromechanical mirror for fine-pointing units of intersatellite optical links","authors":"J. Graeffe, M. Suhonen, H. Sipola, T. Sillanpaa","doi":"10.1117/12.382277","DOIUrl":"https://doi.org/10.1117/12.382277","url":null,"abstract":"A light and fast 2-axial fine-pointing mirror has a number of space applications, especially in intersatellite optical links. The fine pointing of laser beams in optical links is currently realized with electromagnetic and piezoelectric actuators, which are relatively large and heavy. MEMS technology bears a high potential in space applications offering reduction of device size, mass and power consumption. Micro technology makes batch mode fabrication possible yielding a low cost per unit. VTT Automation has designed and partially tested a silicon micro machined electrostatically actuated 2-axial mirror, which can be controlled with a microradian accuracy and a large bandwidth over the angular range of +/- 3 mrad.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121230650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
Development and application of a computer-supported method for design optimization of micro-optical systems 微光学系统设计优化计算机支持方法的开发与应用
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382267
I. Sieber, H. Guth, H. Eggert, K. Scherer
{"title":"Development and application of a computer-supported method for design optimization of micro-optical systems","authors":"I. Sieber, H. Guth, H. Eggert, K. Scherer","doi":"10.1117/12.382267","DOIUrl":"https://doi.org/10.1117/12.382267","url":null,"abstract":"Manufacturing test structures of microsystems is a very expensive process, both in terms of time and money. For this reason, computer—supported design technologies ensuring continuous support in all design phases and, consequently, also consistency, are becoming increasingly important in microsystems technology. The modular structure of hybrid systems requires single components to be manufactured in isolation and later combined into one total system. Combining single components into one overall system is bound to be subject to certain tolerances. The concept presented in this paper is the computer—aided design of a modular system rugged enough to be employed in mass fabrication. In mass fabrication, it is not the ideal arrangement of individual components which results in the most effective system. Instead, tolerances in positioning individual optical elements need to be taken into account already in modeling. Furthermore environmental influences like e.g. variations of the temperature can have an impact on the performance of the micro—optical function module.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114160822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
MEMS IC test probe utilizing fritting contacts MEMS IC测试探头利用摩擦触点
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382300
T. Itoh, K. Kataoka, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, T. Suga
{"title":"MEMS IC test probe utilizing fritting contacts","authors":"T. Itoh, K. Kataoka, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, T. Suga","doi":"10.1117/12.382300","DOIUrl":"https://doi.org/10.1117/12.382300","url":null,"abstract":"The emerging MEMS technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses response to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115205000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
High-aspect-ratio electroformed Ni-Co microstructures with improved mold adhesion using a LIGA-like process and a Novolak sublayer 采用LIGA-like工艺和Novolak亚层的高纵横比电铸镍钴微结构提高了模具附着力
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382315
C. K. Khan Malek, Lowell S. Thomas
{"title":"High-aspect-ratio electroformed Ni-Co microstructures with improved mold adhesion using a LIGA-like process and a Novolak sublayer","authors":"C. K. Khan Malek, Lowell S. Thomas","doi":"10.1117/12.382315","DOIUrl":"https://doi.org/10.1117/12.382315","url":null,"abstract":"This work relates to a method for increasing the adhesion of polymer resist to electrically conductive substrates which is an important step in the lithographic steps for creating high-aspect-ratio micro structures. Here we are particularly interested in plating Ni-Co into the very tall high-aspect- ratio accurately patterned polymethyl methacrylate (PMMA) micromolds. They were made by deep x-ray lithography for primary or secondary metal structures or metal mold inserts within the framework of the LIGAS process. We investigated the effect of using a Novolak intermediate layer on various substrates to consolidate the adhesion of the relatively weak PMMA-metal interface. Modifying our process by introducing this intermediate Novolak sublayer improved the adhesive properties overall throughout the whole process including the planarization step, leading to a more reliable process with better yield as well an increase in the quality of the Ni-Co parts. The increase of bond resistance to heat and x-rays was evaluated by shear stress measurements.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114898741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Micromachined CMOS magnetic field sensor with ferromagnetic actuation 铁磁驱动的微机械CMOS磁场传感器
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 2000-04-10 DOI: 10.1117/12.382280
L. Latorre, V. Beroulle, Y. Bertrand, P. Nouet, I. Salesse
{"title":"Micromachined CMOS magnetic field sensor with ferromagnetic actuation","authors":"L. Latorre, V. Beroulle, Y. Bertrand, P. Nouet, I. Salesse","doi":"10.1117/12.382280","DOIUrl":"https://doi.org/10.1117/12.382280","url":null,"abstract":"In this paper we intend to introduce a new magnetic field sensor. The sensing principle is based on the deformation of a mechanical structure due to magnetic forces, using ferromagnetic materials. Thus the sensor can be classified in the passive sensor category and exhibits very low power consumption, only due to conditioning circuit. The sensor is designed for monolithic integration with CMOS electronics. Post-process fabrication steps are described and experimental results, obtained on a torsion structure are shown. The sensitivity of this new sensor compares with that of highly sensitive Hall plates. A simple analytical model is finally given and turned into analog VHDL description in order to fully integrate the sensor in the standard microelectronic design flow.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122206732","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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