MEMS IC测试探头利用摩擦触点

T. Itoh, K. Kataoka, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, T. Suga
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引用次数: 4

摘要

新兴的MEMS技术正进入大批量生产和成功商业应用的活跃阶段。已经开始为这种装置的空间应用提供专门知识和资格。但是这些技术仍然是最近才有的,在可靠性问题上还需要做更多的努力。本文明确了工艺分析在实际MEMS设计过程中的作用。然后,介绍了CNES开发的MEMS技术分析技术在开放MEMS技术中的应用。特别是,它显示了这些技术分析如何回应设计师的需求,设计师和创始人仍然需要一个强有力的互动。我们还在CNES上提出了MEMS可靠性问题,并将其替换为当前世界上的可靠性问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MEMS IC test probe utilizing fritting contacts
The emerging MEMS technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses response to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.
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