T. Itoh, K. Kataoka, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, T. Suga
{"title":"MEMS IC测试探头利用摩擦触点","authors":"T. Itoh, K. Kataoka, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, T. Suga","doi":"10.1117/12.382300","DOIUrl":null,"url":null,"abstract":"The emerging MEMS technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses response to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"MEMS IC test probe utilizing fritting contacts\",\"authors\":\"T. Itoh, K. Kataoka, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, T. Suga\",\"doi\":\"10.1117/12.382300\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The emerging MEMS technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses response to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.\",\"PeriodicalId\":318748,\"journal\":{\"name\":\"Design, Test, Integration, and Packaging of MEMS/MOEMS\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-04-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Design, Test, Integration, and Packaging of MEMS/MOEMS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.382300\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Design, Test, Integration, and Packaging of MEMS/MOEMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.382300","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The emerging MEMS technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses response to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.