CAD集成MEMS设计

T. Mukherjee
{"title":"CAD集成MEMS设计","authors":"T. Mukherjee","doi":"10.1117/12.382270","DOIUrl":null,"url":null,"abstract":"The long term impact of MEMS technology will be in its ability novel sensing and actuation functionality on traditional computing and communication devices enabling the ubiquitous digital computer to interact with the world around it. The design of such integrated system will occur at the system level, driven primarily by the application. Methodologies that ease the integration of the digital domain to the real world using mixed domain technologies are therefore crucial. A hierarchical structured design approach that is compatible with standard IC design is outlined. It starts with schematic capture of a design topology, followed by behavioral simulation, layout generation, parasitic extraction, and final verification. This flow is based on a process-independent design representation of commonly used MEMS building blocks, and process-dependent materials properties, design rules, and parasitic parameters.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"284 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"CAD for integrated MEMS design\",\"authors\":\"T. Mukherjee\",\"doi\":\"10.1117/12.382270\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The long term impact of MEMS technology will be in its ability novel sensing and actuation functionality on traditional computing and communication devices enabling the ubiquitous digital computer to interact with the world around it. The design of such integrated system will occur at the system level, driven primarily by the application. Methodologies that ease the integration of the digital domain to the real world using mixed domain technologies are therefore crucial. A hierarchical structured design approach that is compatible with standard IC design is outlined. It starts with schematic capture of a design topology, followed by behavioral simulation, layout generation, parasitic extraction, and final verification. This flow is based on a process-independent design representation of commonly used MEMS building blocks, and process-dependent materials properties, design rules, and parasitic parameters.\",\"PeriodicalId\":318748,\"journal\":{\"name\":\"Design, Test, Integration, and Packaging of MEMS/MOEMS\",\"volume\":\"284 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-04-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Design, Test, Integration, and Packaging of MEMS/MOEMS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.382270\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Design, Test, Integration, and Packaging of MEMS/MOEMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.382270","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

MEMS技术的长期影响将在于其在传统计算和通信设备上的新型传感和驱动功能,使无处不在的数字计算机能够与周围的世界进行交互。这种集成系统的设计将发生在系统级,主要由应用程序驱动。因此,使用混合领域技术简化数字领域与现实世界集成的方法至关重要。概述了一种与标准集成电路设计兼容的分层结构设计方法。它从设计拓扑的原理图捕获开始,接着是行为模拟、布局生成、寄生提取和最后的验证。该流程基于与工艺无关的常用MEMS构建模块的设计表示,以及与工艺相关的材料属性、设计规则和寄生参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CAD for integrated MEMS design
The long term impact of MEMS technology will be in its ability novel sensing and actuation functionality on traditional computing and communication devices enabling the ubiquitous digital computer to interact with the world around it. The design of such integrated system will occur at the system level, driven primarily by the application. Methodologies that ease the integration of the digital domain to the real world using mixed domain technologies are therefore crucial. A hierarchical structured design approach that is compatible with standard IC design is outlined. It starts with schematic capture of a design topology, followed by behavioral simulation, layout generation, parasitic extraction, and final verification. This flow is based on a process-independent design representation of commonly used MEMS building blocks, and process-dependent materials properties, design rules, and parasitic parameters.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信