{"title":"Evaluation of the orientation of thermal deformation in the surface-micromachined membrane of gas microsensors","authors":"Marius Dumitrescu, C. Cobianu, A. Pascu","doi":"10.1117/12.382314","DOIUrl":null,"url":null,"abstract":"Within this paper we perform a simulation study of the 'bimetal' effects for the silicon-silicon dioxide membrane suspended in different manners. For this purpose, a commercial, COSMOS/M program working with finite element method has been used. We investigated the dependence of the value and orientation of the displacements of the bi-layer type membrane as a function of temperature, temperature gradient, geometrical dimensions, expansion coefficients and type of membrane support. The test structure for this simulation consists of a square SiO2 membrane of 100 X 100 micrometers 2 with 10micrometers for each layer. The connection of the membrane to the bulk silicon was performed by different manners as follows: (i) by four horizontal bridges, (ii) by four vertical legs or (iii) by its four edges. From simulation study, we have obtained the effect of the above variables on the value and orientation of the membrane deformation, as follows: a) The temperature and gradient temperature, layer thickness and rigidity of the material lead to modification of the value displacements of the membrane; b) Type of the membrane support lead to modification of the both value and orientation of t he deformation of the membrane. This study of the membrane deformation can be successfully used for designing a new gas structure based on surface micro machining and hopefully with low power consumption and predicted deformation.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"167 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Design, Test, Integration, and Packaging of MEMS/MOEMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.382314","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Within this paper we perform a simulation study of the 'bimetal' effects for the silicon-silicon dioxide membrane suspended in different manners. For this purpose, a commercial, COSMOS/M program working with finite element method has been used. We investigated the dependence of the value and orientation of the displacements of the bi-layer type membrane as a function of temperature, temperature gradient, geometrical dimensions, expansion coefficients and type of membrane support. The test structure for this simulation consists of a square SiO2 membrane of 100 X 100 micrometers 2 with 10micrometers for each layer. The connection of the membrane to the bulk silicon was performed by different manners as follows: (i) by four horizontal bridges, (ii) by four vertical legs or (iii) by its four edges. From simulation study, we have obtained the effect of the above variables on the value and orientation of the membrane deformation, as follows: a) The temperature and gradient temperature, layer thickness and rigidity of the material lead to modification of the value displacements of the membrane; b) Type of the membrane support lead to modification of the both value and orientation of t he deformation of the membrane. This study of the membrane deformation can be successfully used for designing a new gas structure based on surface micro machining and hopefully with low power consumption and predicted deformation.
在本文中,我们对以不同方式悬浮的硅-二氧化硅膜的“双金属”效应进行了模拟研究。为此目的,一个商业化的COSMOS/M程序已经使用了有限元法。我们研究了双层型膜的位移值和方向与温度、温度梯度、几何尺寸、膨胀系数和膜支撑类型的关系。该模拟的测试结构由100 X 100微米2的方形SiO2膜组成,每层10微米。膜与大块硅的连接方式不同,如下:(i)通过四个水平桥,(ii)通过四个垂直腿或(iii)通过其四个边缘。通过模拟研究,我们得到了上述变量对膜变形值和方向的影响,如下:a)温度和梯度温度、材料的层厚和刚度导致膜的位移值发生改变;b)膜支撑的类型导致膜变形的值和方向的改变。薄膜变形的研究可以成功地用于基于表面微加工的新型气体结构的设计,并且有望实现低功耗和预测变形。