Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)最新文献_第2页

Membrane design for MCM and BGA substrate test MCM和BGA衬底测试的膜设计

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670757

J. Cofield

引用次数: 1

Thermal management for multifunctional structures [spacecraft electronics] 多功能结构的热管理[航天器电子]

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670767

S. Rawal, D. Barnett, D. Martin

{"title":"Thermal management for multifunctional structures [spacecraft electronics]","authors":"S. Rawal, D. Barnett, D. Martin","doi":"10.1109/ICMCM.1998.670767","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670767","url":null,"abstract":"Multifunctional structures (MFS) are an innovative concept that offer a new methodology for spacecraft design, by eliminating chassis, cables and connectors, and integrating the electronics into the walls of the spacecraft. The MFS design consists of multilayer flexible circuit patches bonded onto a structural composite panel, and multichip modules (MCMs) performing specific functions are bonded on to the circuit patches, which are interconnected via flexible circuit jumpers. Incorporation of the high power density 2D and 3D MCMs into smaller and more efficient packaging designs still has the fundamental requirement to maintain component temperatures within design limits. Higher component qualification temperatures, such as 393 K, can result in smaller spacecraft radiator areas that are consistent with efficient packaging schemes. During the MFS development effort, a structural radiator panel was fabricated using high thermal conductivity (hi-K) composite facesheets, and several thermal management designs using combinations of hi-K doublers (150-1500 W/m-K), hi-K (150-700 W/m-K) corefill, and deployable radiators to maximize MCM heat rejection. Results of thermal vacuum tests and details of the thermal design methodology are presented in this paper.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131040040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The development of a top-bottom-BGA (TB-BGA) 自上而下的bga (TB-BGA)的发展

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670788

R. Leutenbauer, V. Grosser, B. Michel, H. Reichl

引用次数: 4

Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications 通用航空电子应用中数据累加器MCM-L模块的密封等效封装

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670817

C. Conway, J. Hagge

{"title":"Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications","authors":"C. Conway, J. Hagge","doi":"10.1109/ICMCM.1998.670817","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670817","url":null,"abstract":"This paper presents the results of comparative testing of standard encapsulants versus inorganic hermetic-equivalent protective coatings in a full factorial study that also compares wire-bond assembly versus flip-chip assembly and supplemental encapsulant/underfill die protections versus no encapsulant/underfill protection. The demonstration multichip modules (MCMs) included two design versions, flip-chip and wire-bond, of a general aviation data accumulator MCM. Full wafer probe testing was performed both before and after the supplemental ChipSeal/sup TM/ processing and flip-chip wafer bump processing steps. ChipSeal/sup TM/ and flip-chip wafer processing steps were shown to cause no yield degradation of the the two different wafer types used in the MCMs. Known good die (KGD) screening of all ICs in the modules was used to keep infant mortality failures out of the reliability test results. Preliminary substrate reliability investigations determined that BT and polyimide laminate materials are suitable for robust MCM-L applications. Reliability testing includes vibration in step-stress exposures from 2 to 44 g(RMS), thermal cycling for 2000 cycles from -55 to +125/spl deg/C, 85/spl deg/C/85% RH high humidity testing accelerated by pre-conditioning and power cycling, and 130/spl deg/C bias highly accelerated stress testing (HAST). Comparative reliability results are presented for identical circuit designs in flip-chip versus wire-bonded assemblies, with and without the protective inorganic coatings, and with and without organic encapsulant/underfill protection.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"14 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132643863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Solutions to catastrophic yield problems in MCM-D interconnection production MCM-D互连生产中灾难性良率问题的解决方案

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670765

J. Hawley, V. Vo

{"title":"Solutions to catastrophic yield problems in MCM-D interconnection production","authors":"J. Hawley, V. Vo","doi":"10.1109/ICMCM.1998.670765","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670765","url":null,"abstract":"Yield issues are a constant concern during production of an MCM circuit with 1.0 mil lines, 3 aluminum layers separated by polyimide insulator, 250 traces per square inch, and a top layer of aluminum and gold bond pads. The complexity of the circuit creates numerous defect opportunities, but two failure modes are catastrophic. These include megohm shorts and selective gold/aluminum layer defects such as blistering gold, voids and discoloration of aluminum bond pads. Designed experiments are performed to elucidate the root causes of the problems and determine and implement corrective actions. Megohm short testing includes process flow evaluations (lift-off vs. etchback), metal wet etches, and TiW oxidation. Results indicate that megohm shorts are eliminated by changing from a lift-off to an etchback process. Experimental parameters for selective gold/aluminum layer defects include metal deposition, TiW etch, resist strip, and polyimide etch. Significant interactions are observed between the parameters studied and test part analysis shows a gold/aluminum displacement reaction on the aluminum pads. The design of experiments, results, and corrective actions are presented. Tests showed that the aluminum deposition was the root cause of the problem. Discontinuation of use of the metal deposition machine resulted in increased yields.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132695474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Bare chip stacking structure for MCM production 用于MCM生产的裸芯片堆叠结构

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670798

T. Kimura, O. Okuda, H. Ishikawa, Y. Suzuki, C.R. Hodges, P. Kim, K. Nakajima

{"title":"Bare chip stacking structure for MCM production","authors":"T. Kimura, O. Okuda, H. Ishikawa, Y. Suzuki, C.R. Hodges, P. Kim, K. Nakajima","doi":"10.1109/ICMCM.1998.670798","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670798","url":null,"abstract":"In order to obtain higher density and lower cost multichip modules (MCM), we have developed a simply structured bare-die stacking assembly technology. It provides a simple structure with thick epoxy layer to fix upper layer bare die, rather than custom structures such as notched dies or additional electrodes at die edge in the conventional structures. The developed technology can use exactly the same dies as those for wire bonding interconnection without any additional processing. All electrical connections of the upper and lower dies are achieved by wire-bonding to the substrate independently. We have performed this stacking assembly by precise control of epoxy layer thickness and wire loop shapes. This new technology was applied to the production of MCMs, including twelve memory dies. The assembled MCM was almost twice as dense as an MCM without a stacked-die structure. The MCM were verified to functional correctly. The assembly yield of MCM with this structure was high enough for production. As our technology includes a repair method for failed dies, fully tested KGD (known good die) are not necessary.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133954356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A low-cost MCM implementation for 100-Hz TV up-conversion 用于100赫兹电视上转换的低成本MCM实现

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670838

U. Langenkamp, M. Menke, M. Plan, P. Runkel, M. Schu, B. Stumpf, R. Heimgartner, B. Schatzler, R. Gottinger

引用次数: 0

Membrane probe with pyramidal tips for a bare chip testing 用于裸晶片检测的带有锥形尖端的膜探针

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670812

S. Kasukabe, T. Mori, T. Watanabe, H. Shigi, Y. Wada, A. Ariga

引用次数: 4

MCM-D and direct module attach for RF applications MCM-D和直接模块连接射频应用

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670792

R. G. Arnold, C. Faulkner, D.J. Pedder

引用次数: 8

A system level approach to a structured MCM design methodology 结构化MCM设计方法的系统级方法

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670777

E. Ringroot, C. Truzzi, E. Beyne

引用次数: 1